The new family uses coreless transformer technology to ramp up switching speeds while lowering power dissipation by up to 70%.
The new family uses coreless transformer technology to ramp up switching speeds while lowering power dissipation by up to 70%.
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power…
Announced today at APEC 2024, the new, highly integrated family of devices, reduces package size and increases power density for designers.
The five new parts are 1,200-V, full-bridge quad MOSFETs with current ratings from 27–102 A and RDS(on) values ranging…
The five new parts are 1,200-V, full-bridge quad MOSFETs with current ratings from 27–102 A and RDS(on) values ranging from 20 to 80 mΩ.
The company will demonstrate the new GaN power stages and DC-DC modules at APEC this year.
The company will demonstrate the new GaN power stages and DC-DC modules at APEC this year.
Engineers can now easily visualize what is consumed and what is harvested in an energy-harvesting system that uses…
Engineers can now easily visualize what is consumed and what is harvested in an energy-harvesting system that uses Nexperia solutions.
Three MOSFET products bring down on-resistance, package sizes, and noise—improving both low- and high-voltage…
Three MOSFET products bring down on-resistance, package sizes, and noise—improving both low- and high-voltage automotive performance.
In this roundup, we highlight three new DC-DC converters that emerged in the last few months, each driven by package and…
In this roundup, we highlight three new DC-DC converters that emerged in the last few months, each driven by package and performance improvements.
In this roundup, we highlight recent automotive news: new labs for software-defined vehicles, driver modeling programs,…
In this roundup, we highlight recent automotive news: new labs for software-defined vehicles, driver modeling programs, and even Hall-effect latches.
The acquisition marks a larger trend of consolidation in the GaN industry.
The acquisition marks a larger trend of consolidation in the GaN industry.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
This year’s event was full of advances in fields ranging from EV charging to ESD prevention.
One critical barrier to EV adoption is their notoriously long charge times. Onsemi aims to address one piece of the…
One critical barrier to EV adoption is their notoriously long charge times. Onsemi aims to address one piece of the puzzle with new power-integrated modules.
Several companies took the spotlight at CES 2024 to demo the newest wave of energy-harvesting technology.
Several companies took the spotlight at CES 2024 to demo the newest wave of energy-harvesting technology.
This week, TI unveiled several single-chip automotive solutions at CES—one of which is the first automotive radar…
This week, TI unveiled several single-chip automotive solutions at CES—one of which is the first automotive radar sensor for satellite architectures.
New gate driver circuits address the challenges of wide-bandgap (WBG) semiconductors to help these high-power devices…
New gate driver circuits address the challenges of wide-bandgap (WBG) semiconductors to help these high-power devices harness their potential.
On the 120th anniversary of the first powered, controlled flight by a heavier-than-air aircraft, we reflect on…
On the 120th anniversary of the first powered, controlled flight by a heavier-than-air aircraft, we reflect on Curtiss-Wright's legacy as an aviation pioneer.
As we look back on the year, let’s take a look at All About Circuits’ most popular and memorable technical content.
As we look back on the year, let’s take a look at All About Circuits’ most popular and memorable technical content.
Infineon has released XHP 3 IGBT modules to simplify parallelization in complex designs without sacrificing efficiency.
Infineon has released XHP 3 IGBT modules to simplify parallelization in complex designs without sacrificing efficiency.
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and…
High-energy and power-dense supercapacitor technologies from Kyocera AVX and Littelfuse help with power management and extend operating times for battery-powered devices and systems.
In this roundup, we highlight how Onsemi, Mitsubishi Electric, and ST have each expanded their SiC capacity.
In this roundup, we highlight how Onsemi, Mitsubishi Electric, and ST have each expanded their SiC capacity.
The new 1,200 V SiC MOSFETs are the first product of Nexperia's recent partnership with Mitsubishi Electric.
The new 1,200 V SiC MOSFETs are the first product of Nexperia's recent partnership with Mitsubishi Electric.
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