In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
MCAD and ECAD have inserted themselves into most design engineers' day-to-day work. Although familiar, both programs have come a long way and are continuing to evolve. In this article, learn the past and future of these design tools.
August 27, 2020 by Sam Sattel, Autodesk
Intel Enpirion PowerSoC modules are DC-DC step-down converters that integrate nearly all the components needed to build a power supply without sacrificing performance or efficiency. These solutions are designed to meet strict FPGA, ASIC, and processor power requirements.
August 25, 2020 by Tamara Lin, Intel
The OKdo E1 development board is only as wide as a coin but contains the LPC55S69 microcontroller, making it suitable for a variety of small production runs and prototypes. Here, get more familiar with the dev board and see how to use its evaluation kit.
August 20, 2020 by Mark Dunnett, on Behalf of NXP
The FixturFab DEV260 development fixture allows designers to debug or configure PCBAs during the development phase. See how it works in this example using the Sparkfun Power Delivery Board.
August 04, 2020 by Duncan Lowder, FixturFab
Intermediate Bus Architecture is an emerging method that power designers are using to conserve PCB space. This article discusses the solution benefits and tradeoffs of adopting this technique, and how it may be scaled to address application-specific requirements.
July 07, 2020 by Tamara Lin, Intel
This article aims to simplify the DC power connector selection process with an overview of types, key specifications, and commonly accepted nomenclature, while also looking at audio and USB connectors in power applications.
June 23, 2020 by Ryan Smoot, CUI Devices
Semiconductor manufacturing is a complex industry and small improvements anywhere in the process can make a big difference to the bottom line. This article discusses the benefits of continually optimizing manufacturing for the semiconductor industry by introducing smart manufacturing solutions.
May 19, 2020 by Tim Hewitt, Siemens Digital Industries Software
In this article, Octopart's Director of Operations for Part Data Geof Lipman explores how traditional CAD modeling needs to change in order for electrical engineers to keep up with product design deadlines.
March 10, 2020 by Geof Lipman, Octopart
Manufacturing still takes a large portion of time in the electrical engineering cycle. This article discusses how software-driven automation and the IIoT can help hasten the manufacturing process.
December 17, 2019 by Shashank Samala, Tempo Automation
This article looks at digit detection and recognition using MNIST eIQ as an example, which consists of several parts — the digit recognition is performed by a TensorFlow Lite model, and a GUI is used to increase the usability of the i.MX RT1060 device.
3 days ago by David Piskula, NXP Semiconductors
In this article, we discuss some key security threats to be aware of when designing for the IoT, important security functions, and how protecting these designs is becoming easier with advances in security ICs.
September 15, 2020 by Scott Jones, Maxim Integrated
In this article, learn how to enable I2C by allowing the LPC55S69 MCU on the E1 board to communicate with a Bosch BME280 environmental sensor present on the Microe Weather click module.
September 10, 2020 by Mark Dunnett, on Behalf of NXP
How do GaN (gallium nitride), SiC (silicon carbide), silicon, and GaN-on-SiC compare? Learn how Infineon's CoolGaN™ HEMTs (high-electron-mobility transistors) provide improvements in power management.
In partnership with Infineon
Floating-gate Flash circuitry is only embedded in devices fabricated at 40nm or earlier nodes, so it is not embedded in the most advanced, highest-performance processors. For secure code and data storage, designers, therefore, have to specify an external device that contains secure memory capacity.
In partnership with Winbond
Learn the basics of automotive radar, MIMO radar signal processing, applications, and market trends. Test and measurement requirements for research and development, mandatory ETSI tests and production verification of automotive radar sensors in the 24 GHz, 77 GHz and 79 GHz domains are described.
In partnership with Rohde & Schwarz
The purpose of this application note is to provide the system engineer with details of the unique features of Maxim's MAX14912/MAX14913 products, and in particular, to explain how these products can safely handle 24V DC loads of "Unlimited Inductance" using Maxim's patented SafeDemag™ feature.
In partnership with Maxim Integrated
