The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this…
The device technology co-optimization (DTCO) methodology requires generating large numbers of layouts. This article introduces a few ways of speeding up this time-consuming process using automation.
Follow my upgrade of a handheld game controller as I add a new 1.8-inch color LCD for animated graphics and an…
Follow my upgrade of a handheld game controller as I add a new 1.8-inch color LCD for animated graphics and an accelerometer module for motion control input.
In this project we create an 8-bit arithmetic logic unit (ALU) in the VHDL language and run it on an Altera CPLD…
In this project we create an 8-bit arithmetic logic unit (ALU) in the VHDL language and run it on an Altera CPLD development board connected to a custom PCB with input switches and LED display.
Designing antennas for compact IoT devices is a tricky task, but an increasingly important one. Learn more about this…
Designing antennas for compact IoT devices is a tricky task, but an increasingly important one. Learn more about this challenge and how to meet it.
Understanding PCB material parameters such as relative permittivity and loss tangent allows us to discuss some important…
Understanding PCB material parameters such as relative permittivity and loss tangent allows us to discuss some important considerations for choosing the right material when designing a high-speed/high-frequency application.
Switched-mode power supplies (SMPS) appear simple to route on your PCB, but are they? This article identifies two noise…
Switched-mode power supplies (SMPS) appear simple to route on your PCB, but are they? This article identifies two noise sources and simple fixes to improve your EMC performance.
In this article, we’ll discuss why a discrete implementation cannot provide a high accuracy in resistive current sensing.
In this article, we’ll discuss why a discrete implementation cannot provide a high accuracy in resistive current sensing.
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as…
Learn how to use single-ended amplifiers in low-side current sensing, including PCB layout tips and considerations, as well as a layout example based on an op-amp in the SOT23 package.
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative…
This article discusses how we can examine the oscillator circuit to make sure that it has sufficient “negative resistance” or “oscillation allowance”.
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can…
Learn how the load capacitance mismatch can “pull” the crystal to oscillate at a different frequency and how we can circumvent this problem.
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience…
Children’s toys aren’t just for children. Inside every toy, there are hundreds of hours of engineering experience just waiting to be discovered.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
Learn how to reduce second harmonic distortion by following some guidelines for placing decoupling capacitors in your PCB layout.
Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using…
Need a low-distortion ADC interface? In this article, we'll discuss how to reduce 2nd harmonic distortion by using symmetric PCB layout.
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the…
In this article, we’ll discuss another group of thermal data, called thermal characterization parameters denoted by the Greek letter Psi (Ψ).
This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.
This article continues our discussion of design techniques that help us to improve the performance of transimpedance amplifiers.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Learn about an important thermal metric for designing the interface between an IC package and a heat sink.
Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about…
Junction-to-ambient thermal resistance (or θJA) should be measured under standardized testing conditions. Learn about these details to use this thermal metric appropriately.
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied,…
Assessing the thermal performance of an IC package becomes easier if you understand this common, but often misapplied, parameter known as theta JA.
Learn the high-level steps behind RFIC design.
Learn the high-level steps behind RFIC design.
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