This design solution evaluates the accuracy of thermocouples used for high-temperature measurements as well as resistance temperature detectors (RTDs) used for local cold-junction-compensation (CJC) points.
April 11, 2019 by Bonnie Baker, Maxim Integrated
Circuit board stacks of four or more layers often have through vias that attach to pads on layers where there is no electrical connection. Should those non-function pads stay, or should they go? This article presents the problem and provides resources.
October 18, 2018 by Mark Hughes
With the introduction of a new set of requirements by the US Department of Energy that became law in February 2016, it has become mandatory for manufacturers to improve the efficiency of old designs to meet DoE Level VI in order to sell them to the US market.
July 11, 2017 by Zhihong Yu, Monolithic Power Systems