Latest Deep Learning Articles and Videos

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration…

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution…

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts…

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification,…

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods.…

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in…

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology.…

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive…

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive cybersecurity.

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.

Optical computing is the "New Moore's Law" for AI. It solves electronic scaling limits, offering higher speed, lower…

Optical computing is the "New Moore's Law" for AI. It solves electronic scaling limits, offering higher speed, lower power, and efficiency gains proportional to problem size for matrix operations.

Do you remember when supercomputers were described by their processing power? That was so 2024. Today, we talk about the…

Do you remember when supercomputers were described by their processing power? That was so 2024. Today, we talk about the power for processing. Goodbye terraops, hello terrawatt-hours!

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!

By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in…

By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.

Learn why the best silicon is useless without the right AI developer tools.

Learn why the best silicon is useless without the right AI developer tools.

In the final part of this series, we zero in on three photonics technologies expected to be essential for demanding…

In the final part of this series, we zero in on three photonics technologies expected to be essential for demanding computing and communication systems of the future.

Announced today, Broadcom’s Gen 8 128G Fibre Channel switch portfolio is claimed as the first quantum-safe, SAN…

Announced today, Broadcom’s Gen 8 128G Fibre Channel switch portfolio is claimed as the first quantum-safe, SAN architecture with 128G speed, AI-powered SAN management, and quantum-safe cryptography.

In this article, we round up the news that leading companies announced last week at the Embedded World North America…

In this article, we round up the news that leading companies announced last week at the Embedded World North America event in Anaheim, CA