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The Curiously Low-tech Side of High-tech Manufacturing

The Curiously Low-tech Side of High-tech Manufacturing

In this article, engineers discuss seemingly primitive parts of the manufacturing process and the feasibility of replacing those processes with automation.


News Feb 08, 2020 by Ingrid Fadelli
How to Increase the Accuracy of a Hidden Layer Neural Network

How to Increase the Accuracy of a Hidden Layer Neural Network

In this article, we’ll perform some classification experiments and gather data on the relationship between hidden-layer dimensionality and network performance.


“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

“Modern Designs Require Modern Tools”: PCB Design Platform Uses AR for Design and Debug

inspectAR offers engineers a revolutionary new method of interacting with PCBs using the power of augmented reality.


News Jan 29, 2020 by Robin Mitchell
Fieldscale and ST Introduce Simulation Software for STM32-based Capacitive Touch Sensors

Fieldscale and ST Introduce Simulation Software for STM32-based Capacitive Touch Sensors

Fieldscale’s SENSE simulation software allows OEMs to develop touch-enabled devices with far less hardware prototyping.


News Jan 28, 2020 by Gary Elinoff
The Importance of Reliability Verification in AI/ML Processors

The Importance of Reliability Verification in AI/ML Processors

With the adoption of artificial intelligence and machine learning in a wide variety of applications, reliability verification of AI/ML processors is critical since failures can have major consequences for the validity and legitimacy of AI/ML technology.


Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken Announces New High-speed Configuration for Its Online PCB Design Platform

Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.


News Dec 28, 2019 by Gary Elinoff
Cadence to Acquire AWR for $160 Million to Simplify RF IC Design

Cadence to Acquire AWR for $160 Million to Simplify RF IC Design

Cadence and National Instruments are ramping up their collaborations to a strategic alliance to facilitate the design process of RF integrated circuits.


News Dec 09, 2019 by Gary Elinoff
AVX High Temperature Multi-Layer Varistors | Tech Specs

AVX High Temperature Multi-Layer Varistors | Tech Specs

This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.


new products Dec 05, 2019 by TTI, Inc
Highland Technology’s Quadrature Modulator Geared for Aerospace Simulation

Highland Technology’s Quadrature Modulator Geared for Aerospace Simulation

The P348 is designed for transducer simulation and provides carrier frequencies over a range of 0.5MHz to 20MHz.


News Nov 26, 2019 by Gary Elinoff
How Automated CDC Protocol Verification Accelerates Testing Processes

How Automated CDC Protocol Verification Accelerates Testing Processes

This article describes a methodology that automates set up, constraints, and results analysis as designs move from static CDC analysis to formal verification to simulation and avoid manual scripting efforts, thus reducing setup effort and errors.


Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Altium Claims Title of First Cloud-based Platform for eCAD Component Management

Concord Pro allows each player in the design process to share up-to-date component information.


News Nov 01, 2019 by Gary Elinoff
Obtaining Convergence for High-Q XTAL Oscillators

Obtaining Convergence for High-Q XTAL Oscillators

Learn a method of attaining convergence when simulating very high Q crystal oscillators using Cadence’s Virtuoso Periodic Steady State (PSS) analysis.


The Importance of Advanced ERC in Circuit Design

The Importance of Advanced ERC in Circuit Design

This article introduces and explores advanced ERC, highlighting its differences from traditional ERC and discussing how it can help create better circuit designs.


Common PCB Stackups for a Four-Layer Board

Common PCB Stackups for a Four-Layer Board

This article looks at the common options for a four-layer board stackup.


Major Causes of High Temperatures on PCBs

Major Causes of High Temperatures on PCBs

This article discusses the major causes of high temperatures on PCBs that cause failure and damage to the board itself.


TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK and Modelithics Collaborate on RF Component Modeling for EDA Tools

TDK joins a list of companies who provide test-based models for RF and mmWave components through Modelithics.


News Aug 29, 2019 by Gary Elinoff
Understanding Verilog Shift Registers

Understanding Verilog Shift Registers

This article will discuss how to implement a shift register in Verilog. The register described can be synthesized and downloaded to an FPGA for test in actual hardware.


Special Topics in Schematic Capture

Special Topics in Schematic Capture

Learn about heterogeneous and homogenous buses, special IC packages, and more!


Error Checking Schematics

Error Checking Schematics

This article presents tools and practices in reducing errors in your schematics.


Mitigating Noise in Double-sided PCBs: Multipoint Grounding (Gridded Ground) in Two-layer PCB Design

Mitigating Noise in Double-sided PCBs: Multipoint Grounding (Gridded Ground) in Two-layer PCB Design

Learn how to use the gridded ground technique to reduce noise in a double-sided PCB.