All About Circuits

Latest News

Categories

ITD 2023 Day 3: The Cold, Hard Challenges of Building Quantum ICs and Computers

ITD 2023 Day 3: The Cold, Hard Challenges of Building Quantum ICs and Computers

We are getting an early start on Day 3 of ITD 2023 with three live webinars kicking off before the sun comes up in the US. You also won't want to miss today's keynote from IBM discussing their quantum computing hardware. Join us all day for great live sessions and more educational content.


News Oct 04, 2023 by Dale Wilson
ITD 2023 Day 2: Energizing the Future: Real-Time Precision in Renewable Energy Management

ITD 2023 Day 2: Energizing the Future: Real-Time Precision in Renewable Energy Management

It's Day Two of Industry Tech Days 2022! Charge up for today's sessions by learning about today's Keynote speaker from Texas Instruments.


News Oct 03, 2023 by Jeff Child
ITD 2023 Day 1: Building Tomorrow’s AR/VR Systems With Today’s Hardware

ITD 2023 Day 1: Building Tomorrow’s AR/VR Systems With Today’s Hardware

Today is the first day of Industry Tech Days 2023, and we kick things off with a keynote discussion about virtual reality hardware development with a Meta engineering leader. Join us throughout the day for live sessions and tons of great content.


News Oct 02, 2023 by Dale Wilson
Your Guide to Industry Tech Days 2023

Your Guide to Industry Tech Days 2023

Welcome to Industry Tech Days 2023! This guide will help you navigate through the major features of the show and plan your participation.


News Oct 01, 2023 by Dale Wilson
Keysight Unwraps EDA Tool Suite for Boosting RF and 5G Design Productivity

Keysight Unwraps EDA Tool Suite for Boosting RF and 5G Design Productivity

The Keysight EDA 2024 tool suite promises to provide end-to-end design, modeling. and simulation with “shift left” workflow tools designed to increase productivity in the RF/5G world.


News Sep 30, 2023 by Duane Benson
Microchip Claims Industry’s First Low Pin Count MCU Family With I3C Support

Microchip Claims Industry’s First Low Pin Count MCU Family With I3C Support

Microchip’s latest MCU shows that big things can come in small packages.


News Sep 29, 2023 by Aaron Carman
MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

MIPI Alliance Reports Successful Plugfest of Three I3C Specifications

This year’s Plugfest helped validate I3C and build out its ecosystem amongst some of the industry’s leaders.


News Sep 28, 2023 by Jake Hertz
GaN Transistors Double Down on Size and Power Efficiency

GaN Transistors Double Down on Size and Power Efficiency

Whether in space or on the ground, these GaN-based transistors unlock new benefits compared to silicon.


News Sep 27, 2023 by Aaron Carman
New Test & Measurement Tools Rise to Meet the Needs of High-Frequency Devices

New Test & Measurement Tools Rise to Meet the Needs of High-Frequency Devices

New test tools from Siglent, Teledyne LeCroy, and Keysight flex frequency range, accuracy, flexibility, and resolution.


News Sep 26, 2023 by Darshil Patel
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
Navitas Technology Takes GaN to New Power Heights

Navitas Technology Takes GaN to New Power Heights

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.


Chipmakers, Researchers, and Hobbyists Show Off the Many Faces of RISC-V

Chipmakers, Researchers, and Hobbyists Show Off the Many Faces of RISC-V

In this roundup, we review the ways RISC-V is making its mark in the computing world—from small-scale gaming projects to large-scale corporate initiatives.


News Sep 23, 2023 by Abdulwaliy Oyekunle
SiTime Targets Data Centers and Network Gear With MEMS OXCO Family

SiTime Targets Data Centers and Network Gear With MEMS OXCO Family

Armed with specifications well suited to data center and network infrastructure needs, these new MEMS-based oven-controlled crystal oscillators (OXCOs) ensure robust precision timing.


News Sep 22, 2023 by Jake Hertz
AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

AMD Aims Its Adaptive SoCs at Space Systems, Motor Control, and DSP

For designers needing pure performance and high efficiency, AMD’s latest adaptive SoCs provide computing power for new applications.


News Sep 21, 2023 by Aaron Carman
Connector Reboots: Apple iPhone Goes USB-C, Intel Delivers Thunderbolt 5

Connector Reboots: Apple iPhone Goes USB-C, Intel Delivers Thunderbolt 5

It’s a consequential time in the connectivity world. While Apple switches to USB-C on its new iPhone 15, Intel has released version 5 of its Thunderbolt standard.


News Sep 21, 2023 by Jake Hertz
MOSFET Report: New Devices Lower Losses and Boost Power Density

MOSFET Report: New Devices Lower Losses and Boost Power Density

New power MOSFETs are aiding industrial power electronics with their high efficiency and power density.


News Sep 20, 2023 by Darshil Patel
Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

Toshiba Adds Six Over-Temperature Detection ICs to Portfolio

The latest Toshiba temperature ICs extend the applicability of Thermoflagger technology.


News Sep 19, 2023 by Aaron Carman
CPU Designer Jim Keller Rethinks RISC-V AI Processing at Tenstorrent

CPU Designer Jim Keller Rethinks RISC-V AI Processing at Tenstorrent

Hailed for his historic microprocessor designs at AMD, Apple, and Broadcom, Jim Keller is onto his next CPU endeavor at Tenstorrent.


News Sep 19, 2023 by Jake Hertz
ESA Demos MEMs Rocket Thruster That’s as Small as a Coin

ESA Demos MEMs Rocket Thruster That’s as Small as a Coin

Miniature satellite thruster rocket engine with 1 mm combustion chamber requires MEMs fabrication techniques to manufacture. Uses only ice and electricity to create power.


News Sep 18, 2023 by Duane Benson
To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

To Accelerate Edge Design, Cadence Introduces New NPUs and SDK to AI IP

The new NPUs offload from any host processor to facilitate on-device edge computing.


News Sep 18, 2023 by Aaron Carman