All About Circuits

Latest AI/Neural Networks News

Categories

Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Samsung, Micron, and SK Hynix Lead the Charge on HBM3E DRAM

Three companies—Samsung, Micron, and SK Hynix—have announced moves in the high-bandwidth memory (HBM) 3E market.


News Mar 13, 2024 by Duane Benson
5 Electrical Engineering Research Projects Making Their Mark in 2024

5 Electrical Engineering Research Projects Making Their Mark in 2024

From 3D processors to self-powered sensors, these academic research projects show how "the next big thing" in electronics may emerge from labs worldwide.


News Mar 08, 2024 by Jake Hertz
Intel Spins Off Altera as Independent FPGA Supplier

Intel Spins Off Altera as Independent FPGA Supplier

Eight and a half years after acquiring Altera, Intel has spun off the FPGA division as an independent subsidiary.


News Mar 08, 2024 by Duane Benson
Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

Exclusive Interview—Flux Partners With Ultra Librarian to Tap Its Ecosystem

We talked with Flux’s co-founders about their new partnership—announced today—with online electronic parts ecosystem firm Ultra Librarian.


News Mar 06, 2024 by Jeff Child
Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Synopsys Supports AI-Bogged Data Centers With First 1.6T Ethernet IP

Ahead of the IEEE 1.6 TbE standard, Synopsys has developed a complete 1.6 T solution that includes multi-rate, multi-channel 1.6 T Ethernet MAC and PCS controllers, 224-G Ethernet PHY IP, and verification IP.


News Mar 05, 2024 by Jake Hertz
AMD Rolls Out Cost-Optimized FPGA Family

AMD Rolls Out Cost-Optimized FPGA Family

As FPGAs target more applications, AMD’s newest family—launched today—balances cost and power with performance.


News Mar 05, 2024 by Aaron Carman
Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Renesas Acclaims New Edge AI MPU for High Performance, Low Power

Unveiled today, Renesas' new embedded AI processors significantly increase performance for vision-sensing devices while consuming less power than competitive alternatives.


News Feb 29, 2024 by Duane Benson
ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST Drops Two Time-of-Flight Sensors for 3D Depth Sensing

ST has newly released an all-in-one LiDAR module for 3D direct ToF and pushed another indirect ToF sensor into mass production.


News Feb 28, 2024 by Jake Hertz
ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.


News Feb 23, 2024 by Aaron Carman
ISSCC 2024: MediaTek Presents Neural Visual-Enhancement Engine for IoT

ISSCC 2024: MediaTek Presents Neural Visual-Enhancement Engine for IoT

We kick off our ISSCC coverage with MediaTek's neural visual-enhancement engine, a device that bests competitors with its energy and area efficiency—making it an appealing up-and-comer for smart devices.


News Feb 23, 2024 by Jake Hertz
Arm Unveils ‘Best Generation of Neoverse Technology Yet’

Arm Unveils ‘Best Generation of Neoverse Technology Yet’

Arm's third generation of its Neoverse IP is designed to maximize TCO for intensive workloads and support new technologies like chiplets.


News Feb 22, 2024 by Jake Hertz
SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

SemiQ Introduces New High-Frequency, High-Power SiC MOSFET Modules

The five new parts are 1,200-V, full-bridge quad MOSFETs with current ratings from 27–102 A and RDS(on) values ranging from 20 to 80 mΩ.


News Feb 22, 2024 by Duane Benson
Siemens Unveils 3-Piece Emulation and Prototyping Solution

Siemens Unveils 3-Piece Emulation and Prototyping Solution

The new hardware-assisted verification and validation system marks a first for the EDA industry.


News Feb 21, 2024 by Jake Hertz
TI Launches Compact Power Devices Ahead of APEC 2024

TI Launches Compact Power Devices Ahead of APEC 2024

The company will demonstrate the new GaN power stages and DC-DC modules at APEC this year.


News Feb 20, 2024 by Aaron Carman
Generative AI Meets Its Computing Match in Nvidia’s New GPU

Generative AI Meets Its Computing Match in Nvidia’s New GPU

The company’s new GPU builds on Nvidia RTX technology for improvements in AI, graphics, and compute.


News Feb 13, 2024 by Jake Hertz
AMD Launches Embedded+ Architecture Blending Ryzen and Versal

AMD Launches Embedded+ Architecture Blending Ryzen and Versal

Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.


News Feb 06, 2024 by Jake Hertz
IEEE Radio and Wireless Week—A Wrap Up: Eyes on the Future

IEEE Radio and Wireless Week—A Wrap Up: Eyes on the Future

In the age of innovation, new technologies will be necessary to continue building on previous work. At RWW 2024, the consensus: We’re nearing a peak. How can we continue climbing?


News Feb 05, 2024 by Aaron Carman
Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

In this news analysis piece, Nthatisi discusses crafting sensors equipped with Wi-Fi 6, Matter, and Machine Learning using Silicon Labs' SiWx917 IoT device.


News Jan 27, 2024 by Nthatisi Hlapisi
Synopsys Acquires Ansys for $35 Billion, Bolstering Its Simulation Prowess

Synopsys Acquires Ansys for $35 Billion, Bolstering Its Simulation Prowess

Synopsys is set to acquire simulation software firm Ansys to further advance its systems design offerings


News Jan 24, 2024 by Ingrid Fadelli
Renesas Curtails IoT Standby Power With New 64-bit Microprocessors

Renesas Curtails IoT Standby Power With New 64-bit Microprocessors

Powered by Arm Cortex CPUs, the new MPUs hit key IoT pain points: standby power, peripherals, and security features.


News Jan 17, 2024 by Arjun Nijhawan