Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a…
Renesas has developed two new semiconductor solutions for the growing IO-Link market. The new IO-Link solutions include a four-channel master IC and a dual-channel sensor signal conditioner IC.
STMicroelectronics’ ST85MM programmable powerline communication supports modern field-proven meters and communication standards
STMicroelectronics’ ST85MM programmable powerline communication supports modern field-proven meters and communication standards
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Apple calls its newest M4 additions "the most advanced family of chips ever built for a personal computer."
Apple calls its newest M4 additions "the most advanced family of chips ever built for a personal computer."
Join the All About Circuits team as we look ahead to next week's Electronica 2024 where we will be exploring the latest…
Join the All About Circuits team as we look ahead to next week's Electronica 2024 where we will be exploring the latest innovations in electronics technology.
The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer,…
The Akida Pico low-power acceleration co-processor may drive compact AI-enabled wearables and sensors for consumer, healthcare, and IoT applications.
The partnership has produced three new integrated circuit solutions for Intel's next generation of battery-efficient laptops.
The partnership has produced three new integrated circuit solutions for Intel's next generation of battery-efficient laptops.
Qualcomm claims the new processor offers the mobile industry’s largest shared cache with record speeds for data retrieval.
Qualcomm claims the new processor offers the mobile industry’s largest shared cache with record speeds for data retrieval.
In this roundup, we discuss several announcements from last week's summit pushing RISC-V adoption and processing power.
In this roundup, we discuss several announcements from last week's summit pushing RISC-V adoption and processing power.
Microchip tapped SiFive's RISC-V CPUs for its new mission-critical processors.
Microchip tapped SiFive's RISC-V CPUs for its new mission-critical processors.
Enjoy this taste of the rich collection of technology news from the Embedded World North America trade show in Austin, Texas.
Enjoy this taste of the rich collection of technology news from the Embedded World North America trade show in Austin, Texas.
The new family includes the first NPU-enabled desktop processors with a built-in GPU for powerful media support.
The new family includes the first NPU-enabled desktop processors with a built-in GPU for powerful media support.
The NoC upgrade unlocks new scalability, performance, and power efficiency opportunities.
The NoC upgrade unlocks new scalability, performance, and power efficiency opportunities.
Three new processor series may bring AI performance and reliability to the industrial sector.
Three new processor series may bring AI performance and reliability to the industrial sector.
The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.
The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.
In this edition of Research Shorts, we spotlight five news snippets exploring the feats of engineering students worldwide.
In this edition of Research Shorts, we spotlight five news snippets exploring the feats of engineering students worldwide.
Rohm, Toshiba, and Nexperia target compact designs that can be used in various automotive applications.
Rohm, Toshiba, and Nexperia target compact designs that can be used in various automotive applications.
The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices,…
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by…
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.
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