The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
The Agilex 3 line includes small form-factor FPGAs with AI and an integrated MCU.
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices,…
The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by…
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.
Bluetooth SIG promises centimeter-level accuracy when measuring the distance between connected Bluetooth devices.
Bluetooth SIG promises centimeter-level accuracy when measuring the distance between connected Bluetooth devices.
Intel has revealed the details of the long-awaited Lunar Lake architecture, bringing advanced AI compute to personal computing.
Intel has revealed the details of the long-awaited Lunar Lake architecture, bringing advanced AI compute to personal computing.
RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops.
RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops.
Space-constrained edge processors may soon get a boost from Intel’s new SoC.
Space-constrained edge processors may soon get a boost from Intel’s new SoC.
Announced this week at Hot Chips 2024, the new processors use a scalable I/O sub-system to slash energy consumption and…
Announced this week at Hot Chips 2024, the new processors use a scalable I/O sub-system to slash energy consumption and data center footprint.
Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart…
Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart performance to mobile devices.
Japan’s leading telecommunications company has partnered with quantum computing company D-Wave to use D-Wave’s…
Japan’s leading telecommunications company has partnered with quantum computing company D-Wave to use D-Wave’s equipment for network operational improvement.
Announced today, the new RISC-V processor is SiFive's first foray into mainstream data center and infrastructure use cases.
Announced today, the new RISC-V processor is SiFive's first foray into mainstream data center and infrastructure use cases.
Today, the startup announced a breadth of customizable RISC-V-based processor IP solutions backed by $100 million in funding.
Today, the startup announced a breadth of customizable RISC-V-based processor IP solutions backed by $100 million in funding.
Automakers can now choose an Intel SDV SoC and later add a discrete GPU to handle larger compute workloads.
Automakers can now choose an Intel SDV SoC and later add a discrete GPU to handle larger compute workloads.
At the width of a pencil eraser, the new digital light processing chipset may enable the "smallest, fastest, and…
At the width of a pencil eraser, the new digital light processing chipset may enable the "smallest, fastest, and lowest-power 4K ultra-high-definition (UHD) projectors ever".
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost…
Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost phones worldwide.
The new line operates at 200 MHz—the highest dsPIC clock speed to date—and adds a double-precision floating point…
The new line operates at 200 MHz—the highest dsPIC clock speed to date—and adds a double-precision floating point unit and enhanced DSP engine.
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against…
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.
Using multiple layers of diffracting materials, the researchers can physically maneuver light to perform permutations and…
Using multiple layers of diffracting materials, the researchers can physically maneuver light to perform permutations and enhance security.
InspireSemi’s new compute chip couples the parallel processing of GPUs with the versatility of CPUs.
InspireSemi’s new compute chip couples the parallel processing of GPUs with the versatility of CPUs.
With the ability to shift computing resources as needed, Microchip’s new 64-bit, RISC-V processors bring needed…
With the ability to shift computing resources as needed, Microchip’s new 64-bit, RISC-V processors bring needed flexibility to embedded edge devices.
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