Showing off its custom silicon, AWS has announced its newest chip purpose-built for HPC applications.
Showing off its custom silicon, AWS has announced its newest chip purpose-built for HPC applications.
Pushing an alternative to edge-based radar processing, Ambarella is rolling out a centralized processed solution for 4D…
Pushing an alternative to edge-based radar processing, Ambarella is rolling out a centralized processed solution for 4D automotive imaging radar.
A new GaN laser chip from Kyocera may shine a path forward for low-cost, high-yield optoelectronics chips on silicon substrates.
A new GaN laser chip from Kyocera may shine a path forward for low-cost, high-yield optoelectronics chips on silicon substrates.
Archer Materials is tackling some of the most complex chips in the industry, from quantum processors to graphene-based…
Archer Materials is tackling some of the most complex chips in the industry, from quantum processors to graphene-based labs-on-a-chip.
Qualcomm's Snapdragon 8 Gen 2 platform hopes to enable unprecedented performance in flagship smartphones, leveraging…
Qualcomm's Snapdragon 8 Gen 2 platform hopes to enable unprecedented performance in flagship smartphones, leveraging technology called "Snapdragon Smart" and "Snapdragon Sight."
Known for its dinner plate-sized AI chips, Cerebras has now released an AI supercomputer available for commercial and…
Known for its dinner plate-sized AI chips, Cerebras has now released an AI supercomputer available for commercial and academic research.
SkyWater produced the first silicon wafers integrating Weebit’s embedded ReRAM, marking a major milestone toward ReRAM…
SkyWater produced the first silicon wafers integrating Weebit’s embedded ReRAM, marking a major milestone toward ReRAM commercialization.
Eliyan is emerging from stealth mode, unveiling the successful tapeout of its high-performance UCIe-compliant die-to-die…
Eliyan is emerging from stealth mode, unveiling the successful tapeout of its high-performance UCIe-compliant die-to-die interconnect technology in 5 nm process.
Aiming to usurp Arm processors in size-constrained, compute hungry designs like wearables, SiFive has expanded its RISC-V…
Aiming to usurp Arm processors in size-constrained, compute hungry designs like wearables, SiFive has expanded its RISC-V “Performance” line of processors.
Seeking to provide the embedded IoT “plumbing” needed for smart home devices, NXP has unveiled a set of development…
Seeking to provide the embedded IoT “plumbing” needed for smart home devices, NXP has unveiled a set of development platforms for implementing Matter-based designs.
EV companies are making chip design an in-house matter—regaining supply chain control and reducing reliance on…
EV companies are making chip design an in-house matter—regaining supply chain control and reducing reliance on third-party manufacturers.
With its new SoC, IBM hopes to pave the way for AI training and performance that can one day be 1,000 times faster than…
With its new SoC, IBM hopes to pave the way for AI training and performance that can one day be 1,000 times faster than modern solutions.
MediaTek’s new compute-intensive SoC is aimed at powering the next generation of mid-range Android 5G smartphones.
MediaTek’s new compute-intensive SoC is aimed at powering the next generation of mid-range Android 5G smartphones.
Researchers have developed a new technique to trap light and sound in waveguides to manipulate light in large-scale circuits.
Researchers have developed a new technique to trap light and sound in waveguides to manipulate light in large-scale circuits.
Vehicles today operate on thousands of ICs. Here are three interesting chips that exemplify the diversity of automotive…
Vehicles today operate on thousands of ICs. Here are three interesting chips that exemplify the diversity of automotive technology.
DARPA has tapped Intel to develop a low-cost link between current and future satellite constellations—effectively…
DARPA has tapped Intel to develop a low-cost link between current and future satellite constellations—effectively creating a "universal translator."
The company leverages micro-transfer printing (mTP) for a new high-density laser spectrophotometer chip.
The company leverages micro-transfer printing (mTP) for a new high-density laser spectrophotometer chip.
The reference design features a new SoC with proprietary electronic dispersion compensation (EDC) capabilities.
The reference design features a new SoC with proprietary electronic dispersion compensation (EDC) capabilities.
The Internet of Things will have a much larger scope thanks to recently-announced products from Silicon Labs.
The Internet of Things will have a much larger scope thanks to recently-announced products from Silicon Labs.
At NVIDIA's most recent GTC, the company announced a new SoC to centralize the disparate computing requirements of modern…
At NVIDIA's most recent GTC, the company announced a new SoC to centralize the disparate computing requirements of modern vehicles.
Facebook
Google
GitHub
Linkedin