Effectively storing data remains a key issue in modern information systems and a challenge for electronics engineers who need to design devices with the thought…
Effectively storing data remains a key issue in modern information systems and a challenge for electronics engineers who need to design devices with the thought of robust data storage as a primary concern.
In this article, we will look at a proposed non-volatile DRAM and how it compares to current memory technologies.
In this article, we will look at a proposed non-volatile DRAM and how it compares to current memory technologies.
The K32 L2 MCUs are based on the Arm Cortex-M0+ core and feature multiple low-power modes.
The K32 L2 MCUs are based on the Arm Cortex-M0+ core and feature multiple low-power modes.
As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are…
As smart technology grows, developers are looking for more flexible network protocols. Here are some ways companies are combining, developing, or expanding protocols to broaden IoT applications.
Toshiba's newest family of SLC NAND memory products focuses on high transfer rates and providing an alternative to NOR memory.
Toshiba's newest family of SLC NAND memory products focuses on high transfer rates and providing an alternative to NOR memory.
The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity…
The adoption of PCIe Gen4 and USB 3.2 interface technologies shows how controller chips are trying to match the capacity and speed of flash memory they serve in SSD designs.
This week is the 14th annual Flash Memory Summit, a conference focused on memory.
This week is the 14th annual Flash Memory Summit, a conference focused on memory.
The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.
The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.
This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).
This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on…
SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on UMC's 55nm platform, allowing it to make headway into the automotive sector.
Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in…
Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in the next-generation memory devices.
Today’s roundup touches on how resistive RAM could change artificial intelligence applications, what to expect with…
Today’s roundup touches on how resistive RAM could change artificial intelligence applications, what to expect with upcoming DDR5 RAM specifications, and the latest news on 3D NAND flash memory.
An uptick in interest in cryptocurrencies has also increased interest in fast, high-capacity, and especially secure data…
An uptick in interest in cryptocurrencies has also increased interest in fast, high-capacity, and especially secure data storage. Here are some developments in the data storage realm.
A flash memory shortage, beginning in 2016 and originally projected to continue until mid-2017, has been re-forecasted to…
A flash memory shortage, beginning in 2016 and originally projected to continue until mid-2017, has been re-forecasted to continue well into 2018.
Get an update on Toshiba's advances in 3D flash memory, just in time for Flash Memory Summit.
Get an update on Toshiba's advances in 3D flash memory, just in time for Flash Memory Summit.
In this teardown, we inspect the PCBs and their major components (ICs) found inside Microsoft's Xbox 360 Kinect.
In this teardown, we inspect the PCBs and their major components (ICs) found inside Microsoft's Xbox 360 Kinect.
Global demands for NAND Flash Memory has far outstripped production. Here's some info on why and how this shortage occurred.
Global demands for NAND Flash Memory has far outstripped production. Here's some info on why and how this shortage occurred.
The Amazon Kindle Fire tablet is a 7" color tablet. This Teardown Tuesday opens one up and looks inside.
The Amazon Kindle Fire tablet is a 7" color tablet. This Teardown Tuesday opens one up and looks inside.
Veteran engineers and market forecasters alike have fears of an impending component shortage this year. What evidence is…
Veteran engineers and market forecasters alike have fears of an impending component shortage this year. What evidence is there to suggest such a claim and if true, how will engineers be affected?
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