Latest Non-volatile News

Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.

Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.

SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on…

SuperFlash, SST's flash memory platform used across multiple industries, has achieved AEC-Q100 Grade 1 Qualification on UMC's 55nm platform, allowing it to make headway into the automotive sector.

Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in…

Here is the profile of a fab that provides composition screening and stack engineering services for new materials used in the next-generation memory devices.

Today’s roundup touches on how resistive RAM could change artificial intelligence applications, what to expect with…

Today’s roundup touches on how resistive RAM could change artificial intelligence applications, what to expect with upcoming DDR5 RAM specifications, and the latest news on 3D NAND flash memory.

An uptick in interest in cryptocurrencies has also increased interest in fast, high-capacity, and especially secure data…

An uptick in interest in cryptocurrencies has also increased interest in fast, high-capacity, and especially secure data storage. Here are some developments in the data storage realm.

A flash memory shortage, beginning in 2016 and originally projected to continue until mid-2017, has been re-forecasted to…

A flash memory shortage, beginning in 2016 and originally projected to continue until mid-2017, has been re-forecasted to continue well into 2018.

Get an update on Toshiba's advances in 3D flash memory, just in time for Flash Memory Summit.

Get an update on Toshiba's advances in 3D flash memory, just in time for Flash Memory Summit.

In this teardown, we inspect the PCBs and their major components (ICs) found inside Microsoft's Xbox 360 Kinect.

In this teardown, we inspect the PCBs and their major components (ICs) found inside Microsoft's Xbox 360 Kinect.

Global demands for NAND Flash Memory has far outstripped production. Here's some info on why and how this shortage occurred.

Global demands for NAND Flash Memory has far outstripped production. Here's some info on why and how this shortage occurred.

The Amazon Kindle Fire tablet is a 7" color tablet. This Teardown Tuesday opens one up and looks inside.

The Amazon Kindle Fire tablet is a 7" color tablet. This Teardown Tuesday opens one up and looks inside.

Veteran engineers and market forecasters alike have fears of an impending component shortage this year. What evidence is…

Veteran engineers and market forecasters alike have fears of an impending component shortage this year. What evidence is there to suggest such a claim and if true, how will engineers be affected?

Researchers at Cornell University have engineered a new magnetic material that could potentially make electronics 100…

Researchers at Cornell University have engineered a new magnetic material that could potentially make electronics 100 times “greener”. Could this (finally) be the dawn of room-temperature superconductors?

Researchers at IBM’s Zurich laboratory have demonstrated the feasibility of 3 bits-per-cell storage using phase-change…

Researchers at IBM’s Zurich laboratory have demonstrated the feasibility of 3 bits-per-cell storage using phase-change memory (PCM) technology under large temperature fluctuations.

In this Retro Teardown, we will look at the history of the Commodore 64 and then tear one apart!

In this Retro Teardown, we will look at the history of the Commodore 64 and then tear one apart!

With the release of Pokemon Go!, Pokemon is finding its way back into the minds of millions. What's inside of a Pokemon…

With the release of Pokemon Go!, Pokemon is finding its way back into the minds of millions. What's inside of a Pokemon Red cartridge?

A research team consisting of Stanford and NMSU engineers may have found a material capable of revolutionizing the 2D…

A research team consisting of Stanford and NMSU engineers may have found a material capable of revolutionizing the 2D memory semiconductor market.

Toshiba has released a new flash memory based on its 48-layer stacking process. It has far more storage than traditional…

Toshiba has released a new flash memory based on its 48-layer stacking process. It has far more storage than traditional NAND flash memory, greater write/erase reliability endurance, and faster write speeds.

Intel and Micron have teamed up to produce the first new type of memory created in over 25 years. The non-volatile memory…

Intel and Micron have teamed up to produce the first new type of memory created in over 25 years. The non-volatile memory has speeds up to 1,000 times faster than NAND.