This article looks at the different connectivity options for deploying IoT networks, exploring the pros and cons of each.
This article looks at the different connectivity options for deploying IoT networks, exploring the pros and cons of each.
This article discusses some concepts for ensuring motion detector designs will be robust to external disturbances by…
This article discusses some concepts for ensuring motion detector designs will be robust to external disturbances by presenting an infrared detector assembly that can significantly reduce the parts count and improve product performance and reliability.
Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design…
Power conversion systems in EVs follow the half-bridge configuration. This article explores the IGBT half-bridge design of a high-voltage side (output stage) of the gate driver.
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design…
Leveraging board-level cameras offer a variety of benefits. To help identify the right mix of features and design elements, here are some factors to consider when selecting and designing in an embedded machine vision camera.
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and…
This article explores using PSpice for TI to simulate potential causes for parasitic effects in a motor-drive design and offers design tips to mitigate the negative effects common with high-power motor-drive systems.
Stepper motors work well in a wide range of applications but can struggle with torque ripple and current distortion…
Stepper motors work well in a wide range of applications but can struggle with torque ripple and current distortion issues. Learn about QuietStep, a proprietary algorithm from Allegro MicroSystems, as a possible solution.
This article provides designers with recommendations for protection and low-power control components for power outlet…
This article provides designers with recommendations for protection and low-power control components for power outlet design that both prevent overloads from damaging sensitive circuitry and maximize device efficiency.
Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system…
Learn about the benefits of time-sensitive networking (TSN) and how engineers use it to ensure that an industrial system is ready for the future. This article focuses on three members of the set of TSN standards.
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This…
Redriver or retimer devices can extend the Peripheral Component Interface Express (PCIe®) protocol signal range. This article discusses how to select the best one for compute system and NVMe™ storage applications today and into the future.
This article explores components that protect and control their circuits in smart home security applications,…
This article explores components that protect and control their circuits in smart home security applications, specifically components for protecting wired and wireless security cameras and wired doorbell cameras.
This article investigates the Transform Engine, another part of the PowerQuad, which enables the LPC55S69 MCU to compute…
This article investigates the Transform Engine, another part of the PowerQuad, which enables the LPC55S69 MCU to compute a Fast Fourier Transform (FFT).
This article discusses an algorithm to find the optimum adjusted point in a two-dimensional space with orthogonal input…
This article discusses an algorithm to find the optimum adjusted point in a two-dimensional space with orthogonal input vectors. The algorithm solves equations for intersecting circles based on measured data points.
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer…
Learn about the widely used methods for filtering and processing data samples in the time domain while taking a closer look at the Dual Biquad IIR engine of the PowerQuad unit in the LPC55S69 MCU.
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical…
This article explores the IEC 60730 Class B standard for functional safety to address both mechanical and electrical design in appliances. Learn what the standard entails and controllers to help meet these standards.
Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about…
Documentation within the project pipeline is essential and design modeling is no different. In this article, learn about how to leverage the different modeling methods in Fusion 360.
In this article, learn about the PowerQuad co-processor and its role in performing CPU-heavy tasks to allow the Arm…
In this article, learn about the PowerQuad co-processor and its role in performing CPU-heavy tasks to allow the Arm Cortex-M33 cores to execute other tasks in the LPC55S69 MCU.
This article provides an overview of access control topology in smart homes and industrial buildings by covering the…
This article provides an overview of access control topology in smart homes and industrial buildings by covering the various protection and sensing solutions engineers can use in their designs.
Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of…
Learn how to use Fusion 360 to develop digital drawings, 3D renderings, and animations to help in the creations of complex designs.
Learn how the i.MX 8M Plus applications processor enables edge computing, speeding up machine learning for a variety of…
Learn how the i.MX 8M Plus applications processor enables edge computing, speeding up machine learning for a variety of applications including industrial tasks.
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as…
Designers must consider processing temperatures, producibility, and solder joint integrity of every component as well as higher I/O connectors. This article looks at ways to enable smaller component footprints for high-density PCBs.