All About Circuits

Latest Articles and Videos

Categories

Why Supply Chain Visibility Is Becoming an Engineering Requirement

Why Supply Chain Visibility Is Becoming an Engineering Requirement

Hidden upstream dependencies can turn great product designs into costly delays. Discover why component sourcing risk must now be factored into early product decisions.


MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

MOSIS Partners With GlobalFoundries, Extending 40-Year Prototyping Legacy

The USC-run service that pioneered multi-project wafers in 1981 now offers a path from shared shuttle runs to full production on GlobalFoundries' FinFET and FD-SOI processes.


News Jul 22, 2026 by Luke James
A Precision Multi-Sensor Data Acquisition Module

A Precision Multi-Sensor Data Acquisition Module

Build a low-noise, 32-bit delta-sigma ADC board designed around the ADS1262. This 10-channel design features integrated signal conditioning for RTDs, thermocouples, and strain gauges.


Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

Exclusive—Powering AI Processors Using a 48 V Factorized Power Architecture

In this Q&A with Vicor, we explore current multiplication and decoupled conversion stages. Both overcome traditional multiphase limitations and drastically cut I²R thermal losses for high-demand loads.


News Jul 21, 2026 by Dale Wilson
Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Trio of Connectors Take Aim at Designs for Cars, Computing, and Controls

Trio of Connectors Take Aim at Designs for Cars, Computing, and Controls

Molex, TE Connectivity, and Samtec have introduced new connector platforms targeting next-generation automotive networking, industrial electronics, and AI computing.


News Jul 20, 2026 by Joshua Tidwell
Understanding the Noise Performance of AM Receivers with Envelope Detection

Understanding the Noise Performance of AM Receivers with Envelope Detection

Envelope detection is simple, but that simplicity has a noise-performance cost. Here’s how much SNR conventional AM gives up compared to its coherent counterparts.


Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
The NE565: The Chip That Made the Phase-Locked Loop Practical

The NE565: The Chip That Made the Phase-Locked Loop Practical

Signetics packed a VCO and phase detector into one 14-pin part, turning a daunting feedback technique into something an ordinary engineer could build.


News Jul 17, 2026 by Luke James
New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

New Demands on RF Interconnects—How 5G and AI are Redefining RF Designs

5G, AI, and quantum computing are pushing RF interconnects to their limits. Learn how engineers are evolving connector designs to ensure signal integrity in compact, high-speed systems.


Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Announced today, the new AuraStack AI Super Agent brings AI-enabled design to PCB design and advanced packaging, offering a full-flow agentic environment that boosts engineering productivity by 15X.


News Jul 15, 2026 by Jeff Child
An Ultra-Low-Noise Pre-Amp For Audio Applications

An Ultra-Low-Noise Pre-Amp For Audio Applications

Build an ultra-low-noise preamplifier with a JFE150 JFET and OPA202 op-amp, perfect for high-impedance sensors, hydrophones, guitar pickups, microphones, and turntables.


Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.


News Jul 15, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Application Processors deliver intelligent, secure, and real-time edge computing for next-generation embedded systems. Watch and learn all about their features, specs, applications, and more!


YAGEO AEC-Q200 Hybrid Polymer Capacitors | Featured Product Spotlight

YAGEO AEC-Q200 Hybrid Polymer Capacitors | Featured Product Spotlight

YAGEO AEC-Q200 Hybrid Polymer Capacitors deliver reliable, high-performance energy storage for demanding automotive and industrial applications. Watch and learn all about their features, specs, applications, and more!


IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM Unveils ‘Smallest, Most Powerful Chip in the World’

IBM leveraged its nanostack architecture, a technique that "builds a chip like a city," to pack nearly 100 billion transistors on a fingernail-sized chip.


News Jul 13, 2026 by Austin Futrell
Siglent Expands High-Speed Test Portfolio With New Probe & VSA Software

Siglent Expands High-Speed Test Portfolio With New Probe & VSA Software

The new 8-GHz active differential probe and vector signal analysis software target PCIe, DDR, USB, Ethernet, Wi-Fi, LTE, and 5G signal analysis.


News Jul 13, 2026 by Joshua Tidwell