In this Industry Article, we'll discuss PoE (Power over Ethernet) standards and power sourcing equipment (PSE), using office Internet of Things (IoT) devices as an example application.
November 16, 2021 by Rich Fry, TDK Corporation of America
At last week's Accelerated Data Center Premiere, AMD revealed a plethora of new processor technology including the 3rd Gen of EPYC processors (the Milan-X), the shift to 5 nm, and a Zen 4 architecture.
November 15, 2021 by Jake Hertz
Distributed high-performance compute (HPC) is the cornerstone technology for climate forecasting, signal processing, and more applications. To address this, Xilinx brings forth their Alveo U55C HPC Accelerator.
November 15, 2021 by Adrian Gibbons
STMicroelectronics aims to guarantees privacy in common near-field communication (NFC) applications such as contactless transactions, healthcare records, seamless access to digital content with new NFC tag ICs.
November 14, 2021 by Abdulwaliy Oyekunle
With advancements in materials science and electronic engineering, 3D printing is entering the stage of developing made-to-fit wearable electronic systems like that from the University of Arizona.
November 12, 2021 by Kristijan Nelkovski
At this year’s Accelerated Data Center Premiere event, AMD announced a new family of accelerators, the Instinct MI200 series, that claims to literally speed up high-performance computing (HPC) in data centers.
November 11, 2021 by Jake Hertz
One effective solution to the requirements of 5G technology is the use of HLC (High-layer Count) PCB boards that integrate key features such as skip vias, POVF manufacturing, advanced raw materials, and impedance control.
November 11, 2021 by Sarah Kuang, Kinwong