CES 2020 offered new insights and product announcements regarding 5G, automotive, IoT, and AI. But which of these trends should engineers pay attention to?
January 13, 2020 by Lisa Boneta
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
January 13, 2020 by Cabe Atwell
Whether we like it or not, electrical engineers are deeply implicated in the world’s confusing and expensive quest for quality of life.
January 12, 2020 by Robert Keim
This article reviews how AI is making its way into education, which in turn may direct the future of Industry 4.0.
January 11, 2020 by Cabe Atwell
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new power management IC is said to help designers build smaller, less intrusive automotive camera systems.
January 09, 2020 by Gary Elinoff
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
January 09, 2020 by Tyler Charboneau
This article discusses the Perceptron configuration that we will use for our experiments with neural-network training and classification, and we’ll also look at the related topic of bias nodes.
January 09, 2020 by Robert Keim
The OpenRTK330L is said to deliver cm-level accuracy during GNSS outages and is fully customizable with open-source algorithms.
January 08, 2020 by Lisa Boneta
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
Micron claims that the new DDR5 will provide an 85% increase in memory performance in the next generation of server workloads.
January 07, 2020 by Lisa Boneta
This article explores the use of LoRa devices for long-range, low power smart metering of utilities, which allows for remote daily operations and the collection of data.
January 07, 2020 by Rémi Demerlé, Semtech
NXP designed S32G, a vehicle network processor, to reduce software complexity and enhance data security.
January 07, 2020 by Gary Elinoff
CES isn't just for consumer gadgets. Here are some trends at the show that may affect your designs.
January 07, 2020 by Hannah DeTavis
Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.
January 06, 2020 by Gary Elinoff
This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.
January 06, 2020 by TTI, Inc
Loongson’s 3A4000 and 3B000 processors were manufactured using ST’s 28nm FD-SOI process.
January 06, 2020 by Cabe Atwell
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.
January 05, 2020 by Hannah DeTavis
A pioneer of electromagnetism, James C. Maxwell redefined how mathematicians—and students—have approached both quantum mechanics and special relativity.
January 04, 2020 by Tyler Charboneau
The COM-WHUC6 module, measuring at 95mm x 95mm, can support up to 64GB of eMMC memory with two available DDR4 slots.
January 03, 2020 by Gary Elinoff
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