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Research Shorts: Medtech Targets Sleep, Speech, Strength, and More

Research Shorts: Medtech Targets Sleep, Speech, Strength, and More

Recent research explores healthcare diagnosis, monitoring, and rehab—from the "world's smallest programmable microbots" to wearables that restore speech to stroke patients.


News Feb 16, 2026 by Austin Futrell
Alpha & Omega Semi Unwraps 600 V Super Junction MOSFET Devices

Alpha & Omega Semi Unwraps 600 V Super Junction MOSFET Devices

The αMOS E2 platform seeks to deliver efficiency, ruggedness, and power density for high-voltage power conversion.


News Feb 16, 2026 by Jake Hertz
Introduction to the Gilbert Multiplier

Introduction to the Gilbert Multiplier

This article explores the Gilbert cell, a widely used analog multiplier circuit.


Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

Toshiba Adds High-Speed CCD Image Sensor to Machine Vision Portfolio

The new linear sensor pushes the capture speed envelope for industrial machine vision.


News Feb 13, 2026 by Duane Benson
National Semiconductor’s LM317 and the Rise of Adjustable Linear Power

National Semiconductor’s LM317 and the Rise of Adjustable Linear Power

Introduced in the mid-1970s, National Semiconductor’s LM317 condensed linear regulation into a three-terminal building block and turned voltage selection into a resistor choice.


News Feb 13, 2026 by Luke James
ST Launches LVDS Driver for High-Speed Data and Low-Voltage Logic

ST Launches LVDS Driver for High-Speed Data and Low-Voltage Logic

A space-grade quad LVDS line driver targets modern spacecraft data links with 600-Mbps throughput and wide-range CMOS compatibility.


News Feb 12, 2026 by Luke James
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
R&S Expands Mid-Range Portfolio With New 44 GHz Spectrum Analyzer

R&S Expands Mid-Range Portfolio With New 44 GHz Spectrum Analyzer

The new product provides 44 GHz coverage and extends 40 MHz of real-time spectrum analysis across the FPL family.


News Feb 11, 2026 by Jake Hertz
Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins | Featured Product Spotlight

Same Sky Pogo Pins & PCB Pins offer a high-reliability interconnect solution featuring gold-plated contacts designed to withstand up to 100,000 mating cycles. Watch and learn all about their features, specs, applications, and more!


Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Researchers are advancing materials and device concepts that treat heat as something that can be stored, directed, or actively managed, rather than merely dissipated.


News Feb 11, 2026 by Luke James
Mini-Circuits ZX60 Low Noise Amplifiers | New Product Brief

Mini-Circuits ZX60 Low Noise Amplifiers | New Product Brief

Mini-Circuits ZX60 Low Noise Amplifiers (LNAs) are engineered to amplify weak RF signals with high gain and a low noise figure, ensuring exceptional signal integrity across a wide frequency range. Watch and learn all about their features, specs, applications, and more!


STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

The new USB Power Delivery sink controller combines hardwired USB-PD operation with a patented hybrid mode to simplify full-feature USB-C sink designs with minimal firmware.


News Feb 10, 2026 by Austin Futrell
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.


News Feb 09, 2026 by Joshua Tidwell
Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.


News Feb 09, 2026 by Jeff Child
Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot

Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot

Learn how to select the zero frequency, damping factor, and loop bandwidth for one of the most popular PLL configurations.


Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors are high-precision, 24-bit isolated sensing solutions engineered for the rigorous demands of modern power management. Watch and learn all about their features, specs, applications, and more!


Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.