Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream 8-bit and early 16-bit designs.
Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream 8-bit and early 16-bit designs.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
KYOCERA AVX KGP Stack Capacitors are high-frequency solutions engineered to deliver high capacitance values within a…
KYOCERA AVX KGP Stack Capacitors are high-frequency solutions engineered to deliver high capacitance values within a compact mounting footprint, enhancing both density and circuit reliability. Watch and learn all about their features, specs, applications, and more!
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for…
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for safer overcurrent detection.
Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip…
Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip SRAM for high-throughput devices.
In this article, we examine how adding a zero to the PLL loop filter affects the transient behavior and steady-state errors.
In this article, we examine how adding a zero to the PLL loop filter affects the transient behavior and steady-state errors.
Insight SiP adds LL, LX, and LP variants to its ISP2454 BLE series, offering different power and memory configurations to…
Insight SiP adds LL, LX, and LP variants to its ISP2454 BLE series, offering different power and memory configurations to meet varied IoT design needs.
TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors, are high-precision wire-to-board solutions engineered…
TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors, are high-precision wire-to-board solutions engineered for space-constrained modern applications. Watch and learn all about their features, specs, applications, and more!
ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers are high-performance, compact gate driver solutions specifically…
ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers are high-performance, compact gate driver solutions specifically engineered for the precise control of three-phase BLDC and PMSM motors. Watch and learn all about their features, specs, applications, and more!
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI…
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.
The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting…
The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting carrier-board reuse across vendors and deployment classes.
Bulgin Vitalis Buccaneer Solutions represents a breakthrough in sustainable engineering, offering a rugged connectivity…
Bulgin Vitalis Buccaneer Solutions represents a breakthrough in sustainable engineering, offering a rugged connectivity solution constructed with up to 86% bio-based content by weight. Watch and learn all about their features, specs, applications, and more!
The audio capture chip leverages Triad's current conveyor architecture to deliver a 156-dB input capture range from dual inputs.
The audio capture chip leverages Triad's current conveyor architecture to deliver a 156-dB input capture range from dual inputs.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density…
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference…
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.
Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology.…
Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.
At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.
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