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Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
CPU Designer Jim Keller Rethinks RISC-V AI Processing at Tenstorrent

CPU Designer Jim Keller Rethinks RISC-V AI Processing at Tenstorrent

Hailed for his historic microprocessor designs at AMD, Apple, and Broadcom, Jim Keller is onto his next CPU endeavor at Tenstorrent.


News Sep 19, 2023 by Jake Hertz
Development Boards Built to Kick Start Automotive, Edge AI, & IoT Design

Development Boards Built to Kick Start Automotive, Edge AI, & IoT Design

Renesas, Infineon, Edge Impulse, and AnalogLamb have released boards and kits—all with the goal of accelerating development cycles in embedded systems.


News Sep 16, 2023 by Abdulwaliy Oyekunle
AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
Generative AI Startup Shows Off Digital In-Memory Computing Platform

Generative AI Startup Shows Off Digital In-Memory Computing Platform

Offering improved performance and lower operating costs, D-Matrix’s newest platform presents a clear path forward to scale data center AI.


News Sep 14, 2023 by Aaron Carman
How Will Angstrom-Scale Chips Advance the Electronics Industry?

How Will Angstrom-Scale Chips Advance the Electronics Industry?

Angstrom-scale ICs will require innovation across the entire semiconductor ecosystem: This will include advances in both the hardware (transistors, power distribution, and connection of multi-die systems) and tools (EDA tools with AI/ML and silicon life-cycle management).


Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel Reveals Two New Xeon Processor Lines at Hot Chips 2023

Intel’s newest Xeon processors are based on either performance cores (P-cores) or efficiency cores (E-cores), giving designers more flexibility to prioritize speed or power efficiency.


News Aug 30, 2023 by Aaron Carman
AMD Levels Up Gaming GPUs, Providing Mid-Tier Option in RX 7000 Series

AMD Levels Up Gaming GPUs, Providing Mid-Tier Option in RX 7000 Series

The two new graphics cards improve performance per dollar and fill an important gap in AMD's RX 7000 lineup.


News Aug 29, 2023 by Aaron Carman
Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands

Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands

Each of these companies has introduced new hardware in the hopes of supporting modern AI workloads.


News Aug 16, 2023 by Jake Hertz
Understanding the Compute Hardware Behind Generative AI

Understanding the Compute Hardware Behind Generative AI

Generative AI tools like ChatGPT have had a huge impact in numerous sectors of society. As engineers, it’s helpful for us to understand the computing technology that makes it possible.


Qorvo Releases Free Circuit Simulation Software, QSPICE

Qorvo Releases Free Circuit Simulation Software, QSPICE

Built with power and analog engineers in mind, Qorvo's new QSPICE software shrinks overall runtimes and offers a reported 100% completion rate.


News Jul 27, 2023 by Jake Hertz
EM Side-Channel Attacks on Cryptography

EM Side-Channel Attacks on Cryptography

Electromagnetic-based side-channel attacks are non-invasive, meaning the attacker does not need physical access to the device to steal information. We’ll look at how these EM side-channel attacks work.


At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.


News Jul 17, 2023 by Darshil Patel
Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.


News Jul 12, 2023 by Jake Hertz
Ex-Apple Engineers Develop ‘Disappearing Computer’ in Pin-sized Device

Ex-Apple Engineers Develop ‘Disappearing Computer’ in Pin-sized Device

With a wearable projector that acts as a "non-physical smartphone," Humane hopes its flagship computing device will help people stay present in everyday life.


News Jul 11, 2023 by Chantelle Dubois
Lightelligence Reports ‘World’s First’ Optical Network-on-Chip Processor

Lightelligence Reports ‘World’s First’ Optical Network-on-Chip Processor

The new processor is said to use optical networking to overcome scaling challenges in conventional computing architecture.


News Jul 11, 2023 by Jake Hertz
ADVANTECH ICAM 520 Industrial AI Camera | New Product Brief

ADVANTECH ICAM 520 Industrial AI Camera | New Product Brief

The Advantech ICAM-520 Industrial AI Camera is a comprehensive and rugged solution designed for Edge AI vision applications. Watch and learn all about their features, specs, applications, and more!


AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

AMD Claims Planet’s Largest FPGA-based SoC for Emulation and Prototyping

The company positions the new chiplet-based SoC as well suited for todays’ ever more complex chip designs.


News Jun 27, 2023 by Jake Hertz
One Year Later, Renesas Details the Status of Its Reality AI Acquisition

One Year Later, Renesas Details the Status of Its Reality AI Acquisition

Renesas has a lot to show in the one year since it acquired the startup Reality AI.


News Jun 22, 2023 by Jake Hertz
Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Eliyan Talks First Silicon on ‘Most Efficient’ Chiplet Interconnect

Claiming record time for its first silicon, chiplet interconnect specialist Eliyan lays out its case for how its Nulink UCIe interconnect offers advantages over silicon interposer approaches.


News Jun 19, 2023 by Duane Benson