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Key Design Building Blocks Falling into Place for Smart Hearables

Key Design Building Blocks Falling into Place for Smart Hearables

Low-power components, voice activation platforms and development kits enable designers to create wireless earbuds, hearing aids, and smart headsets operating on small batteries.


News Jun 24, 2019 by Majeed Ahmad
Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.


News Jun 22, 2019 by Mark Hughes
How to Troubleshoot a DC-DC Buck Converter

How to Troubleshoot a DC-DC Buck Converter

This article addresses troubleshooting a staple of electronic systems that don’t always work as planned: switch-mode, low-voltage, DC-DC, single-phase, non-isolated, basic buck converter circuits.


Amphenol’s Jason Ellison on Signal Integrity Careers and His Free, Open Source PCB Design Software

Amphenol’s Jason Ellison on Signal Integrity Careers and His Free, Open Source PCB Design Software

Ellison speaks on the importance of networking, giving to the EE community, and helping younger engineers.


News Jun 19, 2019 by Mark Hughes
The Latest AMR-Based Current Sensors: What Is Anisotropic Magneto Resistance?

The Latest AMR-Based Current Sensors: What Is Anisotropic Magneto Resistance?

What is anisotropic magneto resistance? Check out examples of AMR-based current sensors on the market.


News Jun 16, 2019 by Gary Elinoff
DC-DC Buck Converter Design Tips and Tricks

DC-DC Buck Converter Design Tips and Tricks

This article will go over some general tips you can use when designing a DC-DC buck converter.


Miller Frequency Compensation: How to Use Miller Capacitance for Op-Amp Compensation

Miller Frequency Compensation: How to Use Miller Capacitance for Op-Amp Compensation

Miller capacitance is commonly used in a method for operational amplifier frequency compensation.


Shunt Capacitance Compensation in Operational Amplifiers

Shunt Capacitance Compensation in Operational Amplifiers

In this article, we'll discuss how shunt capacitance can be used to achieve frequency compensation in op-amps and we'll also see why this is not the preferred technique.


Smart Home Roundup: IoT Sensors and Wireless Networks for Hazard Detection

Smart Home Roundup: IoT Sensors and Wireless Networks for Hazard Detection

From sensors to wireless platforms, learn how far the IoT has crept into the modern smart home in this roundup.


News Jun 10, 2019 by Gary Elinoff
TDK Announces Thin-Film Power Inductor Primed for Mobile Device Design

TDK Announces Thin-Film Power Inductor Primed for Mobile Device Design

What are thin-film inductors and how can they help with mobile design? Learn about a new inductor from TDK.


News Jun 04, 2019 by Gary Elinoff
Design Automation Conference Kicks Off in Las Vegas

Design Automation Conference Kicks Off in Las Vegas

Design Automation Conference runs June 3-6 with a theme of "From Chips to Systems–Learn Today, Create Tomorrow."


News Jun 03, 2019 by Gary Elinoff
The Advanced Microcontroller Bus Architecture: An Introduction

The Advanced Microcontroller Bus Architecture: An Introduction

This article will introduce the Advanced Microcontroller Bus Architecture (AMBA), an open standard for SoC designs.


6 Ways to Design for Circuit Board Rework

6 Ways to Design for Circuit Board Rework

Learn why you should design for rework—and 6 easy ways to do it.


Transimpedance Amplifier Stability

Transimpedance Amplifier Stability

Learn about how to stabilize transimpedance amplifiers or TIAs with useful examples.


Will Energy Harvesting Be What Fuels the Growth of the IoT?

Will Energy Harvesting Be What Fuels the Growth of the IoT?

This article explores the challenge of constantly powering the billions of devices that make up the IoT and how energy harvesting could be an effective solution.


Maxim Integrated Himalaya uSLIC™ Power Modules | New Product Brief

Maxim Integrated Himalaya uSLIC™ Power Modules | New Product Brief

Maxim Integrated Himalaya uSLIC™ Power Modules are step-down DC-DC power modules that leverage advanced packaging technologies to shrink the power supply solution by up to 2.25 times.


“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.


News May 27, 2019 by Gary Elinoff
Noise Analysis Using LTspice Tutorial

Noise Analysis Using LTspice Tutorial

Learn how to simulate noise using LTspice and use this great tool to learn more about low-noise design.


Get Ready for Unified Design: Keysight Announces Integrative PathWave Software

Get Ready for Unified Design: Keysight Announces Integrative PathWave Software

Keysight's new PathWave software ambitiously aims to pack the modern EE's design experience into one program.


News May 22, 2019 by Kate Smith
3 Hardware-to-Cloud Design Kits That Simplify IoT Connectivity and Application Development

3 Hardware-to-Cloud Design Kits That Simplify IoT Connectivity and Application Development

Simplicity is the name of the game for IoT dev boards designed to decrease complexity and time to market.


News May 20, 2019 by Majeed Ahmad