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2020 Chip Market Year in Review: DRAM Comes Out on Top

2020 Chip Market Year in Review: DRAM Comes Out on Top

According to IC Insights, DRAM was the biggest IC product category for 2020 with sales of $65.2 billion, followed by NAND coming in second at $55.2 billion.


News Dec 10, 2020 by Luke James
FPGAs and Firmware: An Ironclad Security Duo at Every Stage of Design and Manufacture

FPGAs and Firmware: An Ironclad Security Duo at Every Stage of Design and Manufacture

With increased data transfer comes increased hardware security. We sat down with Lattice Semiconductor to discuss a new security-focused FPGA that may be a solution to many firmware vulnerabilities.


News Dec 08, 2020 by Jake Hertz
Developers Turn to 5nm ASICs to Meet 5G Data Center Loads

Developers Turn to 5nm ASICs to Meet 5G Data Center Loads

2020 has seen a swathe of progress on the 5nm process node led by TSMC. Here’s a quick look at recent developments involving 5nm ASICs.


News Dec 02, 2020 by Luke James
Analog Power at the Size of Digital? Edge AI Processor Combines Best of Both Worlds

Analog Power at the Size of Digital? Edge AI Processor Combines Best of Both Worlds

Can analog computation be a viable solution to the many challenges facing edge AI hardware? We spoke with Mike Henry, CEO of Mythic, to see why they think it is.


News Dec 02, 2020 by Jake Hertz
Voltage-Level Translators: Connecting a World of Increasingly Varying Voltages

Voltage-Level Translators: Connecting a World of Increasingly Varying Voltages

Voltage-level translators are essential in devices like SD/micro SD card readers, wireless access points, and 5G femtocells. How exactly do these devices work?


News Nov 30, 2020 by Nicholas St. John
Xilinx, TI, and Skyworks Tackle PA Efficiency Problems in 5G Small Cell Radios

Xilinx, TI, and Skyworks Tackle PA Efficiency Problems in 5G Small Cell Radios

As modulation scheme efficiency goes up, power amplifier efficiency goes down. Xilinx, TI, and Skyworks are bringing their expertise to the table to reconcile the trade-off.


News Nov 18, 2020 by Adrian Gibbons
Micron Takes 3D NAND to Towering New Heights— 176 Layers to Be Exact

Micron Takes 3D NAND to Towering New Heights— 176 Layers to Be Exact

In what the company has described as a breakthrough in flash memory, performance, and density, Micron has shipped the world’s first 176-layer 3D NAND.


News Nov 17, 2020 by Luke James
Xilinx and Samsung Pioneer First Adaptable Computational Storage Device

Xilinx and Samsung Pioneer First Adaptable Computational Storage Device

With the demand for in-memory computation increasing, Xilinx and Samsung have set out to create a “one size fits all” solution.


News Nov 13, 2020 by Jake Hertz
In the Latest Semiconductor Merger, Marvell Buys Inphi

In the Latest Semiconductor Merger, Marvell Buys Inphi

As the industry rapidly consolidates, Marvell Technology Group Ltd announces its merger with Inphi Corp. in a cash-and-stock deal worth $10 billion.


News Nov 05, 2020 by Luke James
AMD to Purchase Xilinx for $35 Billion in Stock Deal

AMD to Purchase Xilinx for $35 Billion in Stock Deal

Advanced Micro Devices has agreed to buy rival Californian chipmaker Xilinx in a $35 billion all-stock deal, the latest in a wave of high-profile mergers and acquisitions currently sweeping the semiconductor industry.


News Oct 27, 2020 by Luke James
Xilinx Brings FPGA DNA to a Custom Hybrid System-on-Chip for 5G Radio Units

Xilinx Brings FPGA DNA to a Custom Hybrid System-on-Chip for 5G Radio Units

Xilinx solutions are surfacing for each new wave in the 5G rollout. Appearing in 2021, the new RFSoC DFE is forecasted to break all existing benchmarks.


News Oct 27, 2020 by Adrian Gibbons
SK Hynix to Acquire Intel’s NAND Memory Business

SK Hynix to Acquire Intel’s NAND Memory Business

US chipmaker Intel is selling part of its NAND memory chip business to SK Hynix for $9 billion in a deal that will see the South Korean semiconductor supplier become the world’s second-largest flash memory chipmaker.


News Oct 22, 2020 by Luke James
TI’s New Isolated Gate Driver Aims to Boost Efficiency in EV Powertrains

TI’s New Isolated Gate Driver Aims to Boost Efficiency in EV Powertrains

The new isolated gate driver for high-powered SiC and GaN power devices is said to reduce PCB space, eliminate external components, and increase power efficiency in EVs.


While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

While CPUs and GPUs Work Harder in Data Centers, DPUs Work Smarter

As next-gen data centers amp up processing and speed, they're going to need processing units that can handle the heft of AI and machine learning.


News Oct 14, 2020 by Nicholas St. John
New GaN Transistor Combines Si Gate Driver in Same Package

New GaN Transistor Combines Si Gate Driver in Same Package

In an attempt to create smaller and more efficient charging solutions, STMicroelectronics has combined GaN transistors in the same package as gate drivers.


News Oct 01, 2020 by Jake Hertz
What is DrMOS—the IC Powering Next-Gen Processors?

What is DrMOS—the IC Powering Next-Gen Processors?

Integrated powertrain devices go back at least as far as 2004 when Intel wrote the specification for DrMOS, a high-efficiency high-current IC for powering next-gen processors.


News Sep 30, 2020 by Adrian Gibbons
New “4D Imaging Radar” for Automotive Industry in the Works. Is the Name Accurate?

New “4D Imaging Radar” for Automotive Industry in the Works. Is the Name Accurate?

This week, Xilinx and Continental announced the auto industry’s first "production-ready" 4D imaging radar. But do 4D radars actually exist beyond the theoretical?


News Sep 25, 2020 by Jake Hertz
Open-Source NVMe Controller Tech Can Help Academics Develop Memory Devices

Open-Source NVMe Controller Tech Can Help Academics Develop Memory Devices

NVMe controller technology can be difficult and expensive for academics to get their hands on. Now, a new open-source option may help EE students prototype new storage devices.


News Sep 22, 2020 by Luke James
Xilinx Hardware Accelerators Link Up With O-RAN to Push 5G Server Performance

Xilinx Hardware Accelerators Link Up With O-RAN to Push 5G Server Performance

Hardware acceleration is said to create a new 5G throughput reality with 42x encoding and 24x decoding improvements for FEC and HARQ line coding.


News Sep 21, 2020 by Adrian Gibbons
Audio Design is Complex. A New “Complete Audio System” May Quicken Prototyping

Audio Design is Complex. A New “Complete Audio System” May Quicken Prototyping

Leveraging their A2B audio bus technology, Analog Devices has released a full audio system for fast prototyping, evaluation projects, demonstrations, and educational applications.


News Sep 10, 2020 by Jake Hertz