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New App Tool for Augmented Reality PCB Design Enters Beta

New App Tool for Augmented Reality PCB Design Enters Beta

Ever wish you could see your design file layers overtop your spun board? Augmented reality may make that possible in real time.


News Jul 22, 2019 by Mark Hughes
Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

Matt Berggren, Director of Autodesk’s Product Development Group, on Why We Need Better DFM Education

AAC had a chance to talk with Matt Berggren, Director of the EAGLE and Tinkercad teams at Autodesk.


News Jun 22, 2019 by Mark Hughes
X-FAB Announces Substrate Coupling Analysis Tool To Combat Troublesome Parasitic Effects

X-FAB Announces Substrate Coupling Analysis Tool To Combat Troublesome Parasitic Effects

A new tool from foundry group X-FAB aims to mitigate the negative effects of substrate coupling in IC design.


News May 13, 2019 by Gary Elinoff
Altium Announces New Cloud-Based Design Environment with Eye Towards Collaboration: Altium 365

Altium Announces New Cloud-Based Design Environment with Eye Towards Collaboration: Altium 365

Altium today announced Altium 365, a cloud-based design platform intended to bring manufacturing and sourcing into a hardware design environment.


News Oct 04, 2018 by Mark Hughes
How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

How Cloud-Based CAE Is Changing Prototyping: An Interview with Ian Campbell, CEO of OnScale

The days of manual prototyping may be numbered, but so could prohibitively expensive IP licenses.


News Aug 27, 2018 by Karissa Manske
Engineer Spotlight: MacroFab Co-Founder Parker Dillmann Explains PCB Design Trends

Engineer Spotlight: MacroFab Co-Founder Parker Dillmann Explains PCB Design Trends

AAC recently spoke with Parker Dillmann, lead EE and co-founder of MacroFab, a PCB manufacturing company that aims to take some of the old-school pain out of the product development and scaling processes.


News Jun 12, 2018 by Justin Kirkham
Hardware-in-the-Loop Simulation and Power System Design: An Interview with Dr. Sudipta Chakraborty

Hardware-in-the-Loop Simulation and Power System Design: An Interview with Dr. Sudipta Chakraborty

Sudipta Chakraborty is the Director of Energy Systems at OPAL-RT. In this Engineer Spotlight, he speaks about challenges facing power system design, how hardware-in-the-loop simulations are important for problem-solving with grid integration, and his work on the IEEE-1547 standard for power grid test procedures.


News Apr 18, 2018 by Chantelle Dubois
Altium Releases Designer 18 PCB Design Software

Altium Releases Designer 18 PCB Design Software

Just in time for the new year, Altium LLC has announced the newest release of the company’s flagship PCB design software—Altium Designer 18.


News Dec 26, 2017 by Chantelle Dubois
Exploring the Future of Design in Autonomous Vehicles: An Interview with Mark Forbes of Altium

Exploring the Future of Design in Autonomous Vehicles: An Interview with Mark Forbes of Altium

All About Circuits recently met with Mark Forbes, Director of Product and Persona Marketing at Altium, to discuss the details behind autonomous vehicles including the challenges of unifying safety standards and why embedded software is so important to this booming field.


News Dec 13, 2017 by Karissa Manske
DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

The Defense Advanced Research Projects Agency (DARPA) recently announced six additions to its Electronic Resurgence Initiative (ERI), using the talents (and funding) of the US military to solve issues that practicing designers see coming in the industry.


News Sep 25, 2017 by Chantelle Dubois
Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

AJP promises to revolutionize 3D printing in the IoT era.


Cadence to Unveil New Design Solutions at TSMC 2016

Cadence to Unveil New Design Solutions at TSMC 2016

Cadence Design Systems will be dropping the curtain on some exciting new technology solutions this year at TSMC 2016 in San Jose on March 15th.


News Mar 11, 2016 by Aaron LaBarbera