In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
In this deep dive, we take a look at how Winbond’s CUBE technology solves memory challenges for edge AI designs.
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Unveiled today at Electronica, AMD designed the new FPGA to act as a “traffic cop” in larger AI systems.
Announced today, Onsemi calls the new platform the "industry’s most advanced" analog and mixed-signal platform, aiding…
Announced today, Onsemi calls the new platform the "industry’s most advanced" analog and mixed-signal platform, aiding the development of intelligent power management, sensor interfaces, and communications solutions.
Join the All About Circuits team as we look ahead to next week's Electronica 2024 where we will be exploring the latest…
Join the All About Circuits team as we look ahead to next week's Electronica 2024 where we will be exploring the latest innovations in electronics technology.
Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them…
Renesas' new 32-bit MCUs maintain the power of its RA8 series MCUs while streamlining their features, making them cost-effective for high-volume embedded applications.
The dental brace uses sensors and feedback components to help motor-impaired individuals interact with a phone, computer,…
The dental brace uses sensors and feedback components to help motor-impaired individuals interact with a phone, computer, or fitness tracker using their mouths.
It takes more than physicists and electrical engineers to advance the semiconductor industry. Charles Sporck, ME, helped…
It takes more than physicists and electrical engineers to advance the semiconductor industry. Charles Sporck, ME, helped drive the early days of the tech industry with production, operations, and management expertise.
Arm, Intel, and NXP are lending their hands to the software world with new hardware-integrated frameworks.
Arm, Intel, and NXP are lending their hands to the software world with new hardware-integrated frameworks.
The new MCUs merge performance, efficiency, and security for smart appliances.
The new MCUs merge performance, efficiency, and security for smart appliances.
With AI-enabled IoT taking the embedded world by storm, more SBCs and embedded systems are coming to market.
With AI-enabled IoT taking the embedded world by storm, more SBCs and embedded systems are coming to market.
Enjoy this taste of the rich collection of technology news from the Embedded World North America trade show in Austin, Texas.
Enjoy this taste of the rich collection of technology news from the Embedded World North America trade show in Austin, Texas.
The NoC upgrade unlocks new scalability, performance, and power efficiency opportunities.
The NoC upgrade unlocks new scalability, performance, and power efficiency opportunities.
Unveiled at Embedded World North America last week, the new software development environment and accompanying developer…
Unveiled at Embedded World North America last week, the new software development environment and accompanying developer portal may make edge design faster and more reliable.
The RISC-V-based SoC design platform automates workflows and promises 10x higher power efficiency than off-the-shelf solutions
The RISC-V-based SoC design platform automates workflows and promises 10x higher power efficiency than off-the-shelf solutions
The company’s newest flagship SoC introduces architectural advances to bring performance and efficiency to the next…
The company’s newest flagship SoC introduces architectural advances to bring performance and efficiency to the next wave of AI-capable smartphones.
In this edition of Research Shorts, we spotlight five news snippets exploring the feats of engineering students worldwide.
In this edition of Research Shorts, we spotlight five news snippets exploring the feats of engineering students worldwide.
In this edition of Tech Shorts, we spotlight six snippets of industry news targeting power, connectivity, AI, and beyond.
In this edition of Tech Shorts, we spotlight six snippets of industry news targeting power, connectivity, AI, and beyond.
The new V4M and V4H automotive computing SoCs target ADAS L2, L2+, and L3 while maintaining software compatibility with…
The new V4M and V4H automotive computing SoCs target ADAS L2, L2+, and L3 while maintaining software compatibility with existing chips in the R-Car line.
The new MCU features a unique multicore architecture to optimize performance and power efficiency.
The new MCU features a unique multicore architecture to optimize performance and power efficiency.
Announced today, NXP calls the Trimension SR250 the industry’s first single-chip solution that combines ultra-wideband…
Announced today, NXP calls the Trimension SR250 the industry’s first single-chip solution that combines ultra-wideband radar sensing, secure UWB ranging, and on-chip processing.
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