Latest Industry Articles

As USB PD 3.1 devices proliferate, high-voltages increase the risk of electrostatic issues. To address these problems,…

As USB PD 3.1 devices proliferate, high-voltages increase the risk of electrostatic issues. To address these problems, learn how to make smart choices in ESD and EOS testing, as well as TVS device selection.

With power modules, no one wants to have to trade-off performance for other benefits. But you don’t have to. In this…

With power modules, no one wants to have to trade-off performance for other benefits. But you don’t have to. In this article, learn about modern power module capabilities by understanding these six misconceptions.

As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon…

As data center computing and HPC advances, the stakes for ensuring reliability are high. Learn how to develop a silicon lifecycle management (SLM) strategy that ensures a successful future for your designs.

Rich resources are available today for crafting an enclosure using 3D printing. But where to begin? In this article,…

Rich resources are available today for crafting an enclosure using 3D printing. But where to begin? In this article, learn—step by step—how to design your own custom 3D printed electronics enclosure.

With the help of a case study, we examine how adopting NoC technology can significantly improve the process of updating…

With the help of a case study, we examine how adopting NoC technology can significantly improve the process of updating existing chip designs.

The task of powering FPGAs is full of complexities. Learn how a modular FPGA approach can enable you to meet tricky…

The task of powering FPGAs is full of complexities. Learn how a modular FPGA approach can enable you to meet tricky challenges including space constraints, voltage accuracy, power management, and integration.

Learn how surface-mount adapter evaluation modules (EVMs) help ease the transition to analog ICs with advanced package types.

Learn how surface-mount adapter evaluation modules (EVMs) help ease the transition to analog ICs with advanced package types.

To understand how to achieve the most accurate low-noise measurements, we will compare the noise performance of multiple…

To understand how to achieve the most accurate low-noise measurements, we will compare the noise performance of multiple probe solutions using a Rohde & Schwarz (R&S) MXO 5 series oscilloscope.

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP…

For your next chip design, should you select a design-services provider with the ability to create custom fundamental IP blocks, including standard cells and libraries? This article will help you answer this question.

Learn how the Configurable Logic Block (CLB) peripheral in the PIC16F13145 family of microcontrollers allows developers…

Learn how the Configurable Logic Block (CLB) peripheral in the PIC16F13145 family of microcontrollers allows developers to implement complex discrete logic functions in hardware to reduce the Bill of Materials and develop custom application-specific logic.

By including power consumption measurement in your regression testing, you can ensure the reliability and efficiency of…

By including power consumption measurement in your regression testing, you can ensure the reliability and efficiency of your IoT device design throughout its lifecycle.

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements…

The CXL data protocol is essential for meeting the interconnect needs of today’s data centers. Learn the key elements and benefits of this protocol, along with what’s new in CXL version 3.0.

Learn how the Ethernet Alliance Certified test plan and PoE certification can maximize your product success and help you…

Learn how the Ethernet Alliance Certified test plan and PoE certification can maximize your product success and help you avoid expensive recalls and post-launch redesigns.

Improve your PCB designs and avoid costly respins due to EMC test failures by learning some basic design techniques and…

Improve your PCB designs and avoid costly respins due to EMC test failures by learning some basic design techniques and applying modern EMC analysis software.

Avoid mistakes when exporting PCB files from your EDA tools into the Gerber format by understanding the translation…

Avoid mistakes when exporting PCB files from your EDA tools into the Gerber format by understanding the translation process and using DFM tools.

Gerber layers don’t have to be a mystery. Knowing the names and purposes of each Gerber layer used in PCB manufacturing…

Gerber layers don’t have to be a mystery. Knowing the names and purposes of each Gerber layer used in PCB manufacturing can improve your designs and ease communication with the board house.

Learn the details of the Gerber file format for PCB layout, including function, common layers, file names, extensions,…

Learn the details of the Gerber file format for PCB layout, including function, common layers, file names, extensions, and revisions to the Gerber standards.

Giant magnetoresistance (GMR) technology offers key advantages for a range of automotive applications. Learn how it…

Giant magnetoresistance (GMR) technology offers key advantages for a range of automotive applications. Learn how it works, how it compares to alternative approaches, and the types of GMR sensor solutions available.

Understanding the unique advantages provided by silicon carbide (SiC) and gallium nitride (GaN) can help you select the…

Understanding the unique advantages provided by silicon carbide (SiC) and gallium nitride (GaN) can help you select the optimal technology to meet your products’ power, thermal, and size requirements.