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MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.


News Jan 27, 2026 by Austin Futrell
SGeT Publishes oHFM, an Open, Vendor-Independent FPGA Module Standard

SGeT Publishes oHFM, an Open, Vendor-Independent FPGA Module Standard

The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting carrier-board reuse across vendors and deployment classes.


News Jan 26, 2026 by Luke James
Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions represents a breakthrough in sustainable engineering, offering a rugged connectivity solution constructed with up to 86% bio-based content by weight. Watch and learn all about their features, specs, applications, and more!


Triad Semiconductor Reimagines Audio Signal Capture With ‘Universal AFE’

Triad Semiconductor Reimagines Audio Signal Capture With ‘Universal AFE’

The audio capture chip leverages Triad's current conveyor architecture to deliver a 156-dB input capture range from dual inputs.


News Jan 26, 2026 by Duane Benson
Understanding the PDK Generation Process

Understanding the PDK Generation Process

In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.


Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.


News Jan 22, 2026 by Joshua Tidwell
Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.


CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.


News Jan 21, 2026 by Luke James
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
Infineon First to Roll Out Wi-Fi 7, 20-MHz Tri-Radio Device for IoT

Infineon First to Roll Out Wi-Fi 7, 20-MHz Tri-Radio Device for IoT

At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.


News Jan 20, 2026 by Duane Benson
How Brain-Inspired Hardware Is Learning to Scale

How Brain-Inspired Hardware Is Learning to Scale

While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.


News Jan 20, 2026 by Austin Futrell
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
TDK Merges Sensing and Intelligence at the Edge Like Never Before

TDK Merges Sensing and Intelligence at the Edge Like Never Before

All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.


News Jan 19, 2026 by Jake Hertz
Exploring the Bode Plots of PLLs With a Lag-Lead Loop Filter

Exploring the Bode Plots of PLLs With a Lag-Lead Loop Filter

In this article, we derive design equations for a second-order PLL with a lag-lead filter by examining its Bode plots.


Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive cybersecurity.


Mostek MK4116/MK4164: The DRAM Pair That Standardized the 8-Bit Era

Mostek MK4116/MK4164: The DRAM Pair That Standardized the 8-Bit Era

Mostek’s 16K MK4116 and its 64K successor, the MK4164, became the DRAMs that defined late-1970s and early-1980s microcomputers and set conventions the industry followed for years.


News Jan 16, 2026 by Luke James
Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.


News Jan 15, 2026 by Austin Futrell
Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

In this exclusive CES interview, All About Circuits learned how EMASS's new ultra-low-power SoC brings intelligence where size, power, and latency matter most: the sensor edge.


News Jan 14, 2026 by Jake Hertz
Software-Defined Systems: Reshaping the Future of Modern Cars

Software-Defined Systems: Reshaping the Future of Modern Cars

This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.