All About Circuits

Latest Articles and Videos

Categories

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages

The shift to 3D ICs and chiplets demands automated, hierarchical design planning to manage exploding pin counts. Learn how Siemens EDA's Innovator3D IC addresses these challenges.


Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Pickering Unwraps Free Toolset to Streamline ATE Signal Path Workflow

Announced today, the free cloud-based toolset replaces spreadsheets with graphical signal path design for automated test engineers.


News Mar 05, 2026 by Luke James
Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

Infineon Unveils Isolated Gate Drivers With Opto-Emulator Input for SiC

The new family of opto-emulator gate drivers provides drop-in replacements to conventional silicon, IGBT, and SiC MOSFET designs.


News Mar 04, 2026 by Charles Lee
Build Your Own Clock With Analog Dials, Part 2

Build Your Own Clock With Analog Dials, Part 2

We continue our design of a clock that uses analog ammeters to display time and temperature. In this installment, we examine the second of the two circuits that enable the timekeeping function.


NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
Omron Electronics P6K Relay Sockets & G6K Low Signal Relays | Digital Datasheet

Omron Electronics P6K Relay Sockets & G6K Low Signal Relays | Digital Datasheet

Omron Electronics P6K Relay Sockets & G6K Low Signal Relays, enabling easy relay replacement to reduce downtime, labor, and overall maintenance costs. Watch and learn all about their features, specs, applications, and more!


 Advancing RF Performance with TE Connectivity’s NanoRF Series Connectors | Tech Guide

Advancing RF Performance with TE Connectivity’s NanoRF Series Connectors | Tech Guide

In this Tech Guide, explore TE Connectivity’s NanoRF Series Connectors — delivering high-frequency RF performance with compact RF/optical integration, precise 50-ohm impedance, up to 85 GHz support, and floating alignment for durability. Watch now to get started!


Menlo Micro Announces Configurable Switch for Semiconductor Testing

Menlo Micro Announces Configurable Switch for Semiconductor Testing

The company claims the MEMS switch is in a league of its own, replacing mechanical and solid-state relays in high-speed semiconductor test equipment.


News Mar 03, 2026 by Duane Benson
New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Google Moonshot Company Taara Debuts ‘Radical’ Silicon Photonics Platform

Google Moonshot Company Taara Debuts ‘Radical’ Silicon Photonics Platform

Taara Photonics integrates 1,000+ light emitters in a finger-sized module, enabling electronic beam steering without mechanical parts.


News Mar 02, 2026 by Luke James
Using Gilbert Multipliers as Phase Detectors in PLLs

Using Gilbert Multipliers as Phase Detectors in PLLs

This article explores the operation of the Gilbert-cell phase detector for both small and large signals.


Inside the 7400-Series Era of Digital Logic

Inside the 7400-Series Era of Digital Logic

Texas Instruments’ SN7400 and the broader 7400-series TTL family defined how digital systems were built, debugged, and scaled from the mid-1960s through the early microprocessor age.


News Feb 27, 2026 by Luke James
Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

With increasing electrification across vehicle subsystems, Toshiba is rolling out brushed and brushless DC motor control components.


News Feb 26, 2026 by Charles Lee
SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix's new LPDDR6 SDRAM exhibits five key innovations to improve performance, reduce power consumption, and increase reliability.


News Feb 26, 2026 by Duane Benson
Build Your Own Clock With Analog Dials, Part 1

Build Your Own Clock With Analog Dials, Part 1

This project turns old-school analog ammeters into a working clock that can also display the ambient temperature.


ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.


News Feb 24, 2026 by Jake Hertz
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.


News Feb 23, 2026 by Luke James
Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

Keysight Launches 3D Interconnect Designer for Chiplets and 3DICs

The W3510E workflow targets pre-layout modeling, EM analysis, and early UCIe and BoW validation for advanced AI infrastructure designs.


News Feb 23, 2026 by Luke James