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IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.


News Feb 04, 2026 by Jake Hertz
Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi's new AI HAT+ 2 adds higher-performance neural acceleration and memory support to extend generative workloads on Raspberry Pi 5.


News Feb 03, 2026 by Jake Hertz
Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten compact-model and PDK development cycles.


News Jan 30, 2026 by Luke James
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.


News Jan 27, 2026 by Austin Futrell
Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic’s Integrated SoC to Simplify Edge AI for Battery-Powered IoT

Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.


News Jan 22, 2026 by Joshua Tidwell
Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Case Study: A Low-Cost, Low-Profile 6kW, 800 V to 12.5 V DC-DC for AI Power

Learn how GaN technology enables a low-cost, low-profile 6 kW, 800 VDC to 12.5 VDC converter using an ISOP LLC topology. This meets the design needs of next-gen, MW-scale AI server infrastructure.


CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

CES Memory Roundup: Companies Tackle Bandwidth, Power, and Reliability

Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.


News Jan 21, 2026 by Luke James
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
How Brain-Inspired Hardware Is Learning to Scale

How Brain-Inspired Hardware Is Learning to Scale

While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.


News Jan 20, 2026 by Austin Futrell
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
TDK Merges Sensing and Intelligence at the Edge Like Never Before

TDK Merges Sensing and Intelligence at the Edge Like Never Before

All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.


News Jan 19, 2026 by Jake Hertz
Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Defending the Digital Highway: Cybersecurity for Software-Defined Vehicles

Learn how evolving regulations, lifecycle security strategies, and quantum-ready cryptography are reshaping automotive cybersecurity.


Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

In this exclusive CES interview, All About Circuits learned how EMASS's new ultra-low-power SoC brings intelligence where size, power, and latency matter most: the sensor edge.


News Jan 14, 2026 by Jake Hertz
Software-Defined Systems: Reshaping the Future of Modern Cars

Software-Defined Systems: Reshaping the Future of Modern Cars

This article explores how digital twins can help to reshape the design methodology of automotive semiconductors and systems, enabling truly software-defined vehicles.


For the First Time, AI Designs a Computer—in Less Than a Week

For the First Time, AI Designs a Computer—in Less Than a Week

Quilter has designed a fully functional Unix computer using AI, compressing a quarter's worth of PCB design time into a single week.


News Jan 14, 2026 by Arjun Nijhawan
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.


News Jan 12, 2026 by Jake Hertz
Ceva Expands Edge AI Portfolio From Wearables to SDVs

Ceva Expands Edge AI Portfolio From Wearables to SDVs

At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.


News Jan 12, 2026 by Jake Hertz