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Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.


News Jan 12, 2026 by Luke James
Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.


News Jan 09, 2026 by Gordon Feller
MIT Flips the Challenges of Chip Stacking On Its Head

MIT Flips the Challenges of Chip Stacking On Its Head

Low-temperature BEOL transistors and memory elements aim to cut data-movement energy in AI workloads.


News Jan 08, 2026 by Luke James
AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

The industry's biggest chipmakers came to CES with processors that will shape the future of AI PCs, data center computing, and embedded AI.


News Jan 08, 2026 by Duane Benson
Design Wins: Four Designs Rethink Compute, Power, and Integration

Design Wins: Four Designs Rethink Compute, Power, and Integration

This four-product roundup highlights new hardware platforms for spaceborne AI, EV power, wireless sensing, and private 5G.


News Jan 07, 2026 by Joshua Tidwell
NXP Ushers Agentic AI to the Edge with New AI Development Tools

NXP Ushers Agentic AI to the Edge with New AI Development Tools

Announced today at CES, the new tools focus on inference-first deployment to embedded processors rather than retrofitting cloud-native workflows.


News Jan 06, 2026 by Jake Hertz
At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

Today at CES, Ambarella unveiled an SoC with multi-sensor perception, multi-stream video, and very low power consumption.


News Jan 06, 2026 by Duane Benson
The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

Optical computing is the "New Moore's Law" for AI. It solves electronic scaling limits, offering higher speed, lower power, and efficiency gains proportional to problem size for matrix operations.


Our 2025 Top Trend: AI Assimilates

Our 2025 Top Trend: AI Assimilates

Do you remember when supercomputers were described by their processing power? That was so 2024. Today, we talk about the power for processing. Goodbye terraops, hello terrawatt-hours!


News Dec 28, 2025 by Dale Wilson
Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Our Top 2025 Research Stories: Rubber CMOS, Washable Electronics, and More

Enjoy this roundup of our favorite All About Circuits research news articles of 2025!


News Dec 26, 2025 by Jeff Child
The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

The Configurable Matrix Computer: A New Alternative to the von Neumann Architecture

Learn how this new type of AI processor provides a 100x improvement in power and performance over conventional GPUs or MCUs.


Q.ANT’s New Photonic Processor Pushes AI and HPC Beyond Silicon’s Limits

Q.ANT’s New Photonic Processor Pushes AI and HPC Beyond Silicon’s Limits

Q.ANT has debuted NPU 2 with enhanced nonlinear optical processing, delivering major gains in efficiency and performance for next-generation AI and HPC workloads.


News Dec 18, 2025 by Joshua Tidwell
Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks

Using Synopsys Tools, Complex AI SoC Achieves Verification in 5 Weeks

Rebellions employed Synopsys' VCS, ZeBu, Virtualizer, and the Verification Continuum to achieve full bring-up and live demo just five weeks after first silicon.


News Dec 17, 2025 by Duane Benson
Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.


News Dec 15, 2025 by Gordon Feller
Keysight Introduces Handheld Analyzer for High-Precision RF Measurements

Keysight Introduces Handheld Analyzer for High-Precision RF Measurements

The new platform adds 120 MHz of gap-free IQ streaming, high-speed data transfer, and AI-assisted waveform identification.


News Dec 15, 2025 by Luke James
5 Research Breakthroughs Push the Boundaries of Photonic Computing

5 Research Breakthroughs Push the Boundaries of Photonic Computing

Recent advances in photonic platforms, memory architectures, and optical switching demonstrate an evolving space for optical computing.


News Dec 10, 2025 by Luke James
Gigadevice Introduces Dual-Voltage NOR Flash for Wearables, AI, and More

Gigadevice Introduces Dual-Voltage NOR Flash for Wearables, AI, and More

The company optimized the device's dual-voltage design for high-speed, low-power 1.2 V SoC applications.


News Dec 09, 2025 by Austin Futrell
Five Design Wins Redefining Edge Intelligence, Connectivity, and Power

Five Design Wins Redefining Edge Intelligence, Connectivity, and Power

This roundup covers collaborations driving progress in AI processing, IoT radios, 5G NTN conformance, Auracast audio hardware, and indoor-light energy harvesting.


News Dec 03, 2025 by Joshua Tidwell
Korea’s Semiconductor Titans Undergo Strategic Transformations

Korea’s Semiconductor Titans Undergo Strategic Transformations

Korean semiconductor giants—like Samsung and SK hynix—are shifting focus from traditional memory to AI-driven tech, such as HBM, amid global competition, US controls, and government support.


News Dec 03, 2025 by Gordon Feller
Taoglas Upgrades Antenna Tool With AI Modeling, PCB Templates, and More

Taoglas Upgrades Antenna Tool With AI Modeling, PCB Templates, and More

Taoglas has rolled out a major update to its Antenna Integrator tool, adding AI-enhanced modeling, realistic PCB-shape templates, and new export features aimed at tightening collaboration between electrical and mechanical teams.


News Dec 01, 2025 by Luke James