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ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

ST Intros Automotive Drivers for Load Protection & High-Voltage Switching

STMicroelectronics has introduced an automotive high-side driver for harsh electrical transients and isolated gate drivers for high-voltage switching applications in EVs and hybrid vehicles.


News Mar 06, 2026 by Austin Futrell
NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

NXP Rolls Out 10BASE-T1S PMD Transceivers for Ethernet at Edge

The automotive- and industrial-grade devices target low-cost multidrop Ethernet with CAN-like simplicity.


News Mar 03, 2026 by Jake Hertz
New Automotive ICs Cover Signal Integrity, Power Density, & Integration

New Automotive ICs Cover Signal Integrity, Power Density, & Integration

Recent automotive IC releases highlight ongoing efforts to improve signal integrity in ADAS, increase power density in compact inductors, and integrate sensing and logic functions for next-gen electric drive platforms.


News Mar 02, 2026 by Austin Futrell
Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

Toshiba Keys Into Motors With Gate Driver and Sine-Wave Drive Controller

With increasing electrification across vehicle subsystems, Toshiba is rolling out brushed and brushless DC motor control components.


News Feb 26, 2026 by Charles Lee
Renesas Looks to the Future of Automotive With New Memory and SoC Tech

Renesas Looks to the Future of Automotive With New Memory and SoC Tech

The company attended ISSCC with some big automotive announcements: a new approach to chiplet-based processing and a configurable 3-nm memory architecture.


News Feb 24, 2026 by Jake Hertz
Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.


News Feb 23, 2026 by Luke James
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.


News Feb 17, 2026 by Jake Hertz
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors are high-precision, 24-bit isolated sensing solutions engineered for the rigorous demands of modern power management. Watch and learn all about their features, specs, applications, and more!


Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets provide a high-power, versatile charging interface for electric and plug-in hybrid vehicles, supporting both continuous currents up to 250A and temporary boosts up to 500A. Watch and learn all about their features, specs, applications, and more!


Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Modular Architecture: The Key to Reliable EV Charging Infrastructure

Modular Architecture: The Key to Reliable EV Charging Infrastructure

Learn how modular design principles contribute to EV charger reliability, scalability, and maintenance for engineers planning charging networks.


Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors | Featured Product Spotlight

TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors | Featured Product Spotlight

TE Connectivity 0.8mm Low-Profile Crimp Terminal HPI Connectors, are high-precision wire-to-board solutions engineered for space-constrained modern applications. Watch and learn all about their features, specs, applications, and more!


ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers | New Product Brief

ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers | New Product Brief

ROHM BD6787xMWV-Z Brushless DC Motor Gate Drivers are high-performance, compact gate driver solutions specifically engineered for the precise control of three-phase BLDC and PMSM motors. Watch and learn all about their features, specs, applications, and more!


Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions | New Product Brief

Bulgin Vitalis Buccaneer Solutions represents a breakthrough in sustainable engineering, offering a rugged connectivity solution constructed with up to 86% bio-based content by weight. Watch and learn all about their features, specs, applications, and more!


Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz