The TMC7300 can deliver two amps to drive either one or two DC motors, relays, and LEDs.
January 13, 2020 by Gary Elinoff
CES 2020 offered new insights and product announcements regarding 5G, automotive, IoT, and AI. But which of these trends should engineers pay attention to?
January 13, 2020 by Lisa Boneta
During CES 2020, Google announced new hardware editions and upgrades to the Coral ecosystem, including an Accelerator Module, the Dev Board Mini, and a System-on-Module.
January 13, 2020 by Cabe Atwell
SenslinQ combines integrated software with sensors, Arm- or RISC-V-based MCUs, Ceva's DSP units, and other connected technologies for contextually-aware IoT devices.
January 09, 2020 by Tyler Charboneau
The OpenRTK330L is said to deliver cm-level accuracy during GNSS outages and is fully customizable with open-source algorithms.
January 08, 2020 by Lisa Boneta
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
NXP designed S32G, a vehicle network processor, to reduce software complexity and enhance data security.
January 07, 2020 by Gary Elinoff
Omnivision aims to make the High-Efficiency Video Coding (HEVC) standard a practical choice for battery-powered home security devices.
January 06, 2020 by Gary Elinoff
Loongson’s 3A4000 and 3B000 processors were manufactured using ST’s 28nm FD-SOI process.
January 06, 2020 by Cabe Atwell
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.
January 05, 2020 by Hannah DeTavis
The COM-WHUC6 module, measuring at 95mm x 95mm, can support up to 64GB of eMMC memory with two available DDR4 slots.
January 03, 2020 by Gary Elinoff
The new environmental tracker employs Nordic Semiconductor's cellular IoT and Bluetooth technologies and features a five-year battery life.
December 30, 2019 by Gary Elinoff
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
December 28, 2019 by Mouser Electronics
Zuken’s eCADSTAR now includes design constraint management for length-, delay-, and skew-based routing.
December 28, 2019 by Gary Elinoff
The K32 L2 MCUs are based on the Arm Cortex-M0+ core and feature multiple low-power modes.
December 24, 2019 by Gary Elinoff
December 21, 2019 by Mouser Electronics
In a bid to galvanize its own AI future, Intel has acquired advanced AI training and inference silicon technology.
December 21, 2019 by Tyler Charboneau
December 20, 2019 by Mouser Electronics
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
December 19, 2019 by Gary Elinoff
Flex Logix’s eFPGA is a low-power FPGA that can be integrated into SoCs, microcontrollers, and ICs.
December 18, 2019 by Cabe Atwell
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