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Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips

The ATS296X series from Actions Technology combines Ceva's High Data Throughput radio IP with Actions' own dual-RF design, targeting links of roughly 7.5 Mbps.


News Aug 17, 2026 by Luke James
Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

Silicon Labs Unwraps Its ‘Lowest Power’ BLE SoC Targeting IoT Devices

The EFR32BG2B SoC family supports Bluetooth 6 and is the lowest power Bluetooth LE chip with channel sounding from Silicon Labs.


News Aug 14, 2026 by Duane Benson
Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

Ambiq Rolls Out Two SoC Series Targeting Edge AI Applications

The six new chips offer a wide range of connectivity and graphics options for wearables, hearables, AR devices, health monitors, industrial sensors, and beyond.


News Aug 12, 2026 by Duane Benson
Preserving Battery Life: Waking the FPB-RA0E1 from Low-Power Mode Using a 32-Bit Interval Timer

Preserving Battery Life: Waking the FPB-RA0E1 from Low-Power Mode Using a 32-Bit Interval Timer

This article shows you how to configure Software Standby mode and implement a periodic wake-up routine on the Renesas FPB-RA0E1 Fast Prototyping Board, built around the Arm Cortex-M23-based RA0E1 MCU.


Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

Quectel Debuts Wi-Fi 7 Modules With Bluetooth 6.0 for Streaming and Gaming

The FCE870X and FME170X share the same high-end feature set across two package formats, giving product teams a choice between embedded and modular designs.


News Aug 10, 2026 by Dale Wilson
Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

Business Shorts: Partnerships Advancing AI Factories, Physical AI, and More

In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.


News Aug 03, 2026 by Luke James
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors | New Product Brief

Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors provide high-speed, high-density interconnect solutions for next-generation embedded computing platforms. Watch and learn all about their features, specs, applications, and more!


new products Aug 02, 2026 by Mouser
The New Era of Retail Begins at the Edge Leveraging On-Device AI

The New Era of Retail Begins at the Edge Leveraging On-Device AI

On-device AI enhances retail by enabling real-time processing for robotics, kiosks, and more, offering low latency, improved privacy, and operational efficiency for a better customer experience.


Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

Geehy Intros 200 V Motor Gate Driver for Compact 3-Phase Drive Systems

A new three-phase motor gate driver integrates a bootstrap diode and robust protective mechanisms to streamline designs and reduce switching losses in compact motor applications.


News Jul 28, 2026 by Jeff Child
Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Microchip’s Latest SDK Brings Sparse Neural Networks to PolarFire FPGAs

Sparsity-based model compression from the Neuronix AI Labs acquisition promises up to 2x faster CNN inference on low-power, SEU-immune hardware.


News Jul 24, 2026 by Luke James
AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

AMD Unveils Processors, Boards, and Dev Platform—All Tuned for Physical AI

Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.


News Jul 23, 2026 by Jeff Child
A Precision Multi-Sensor Data Acquisition Module

A Precision Multi-Sensor Data Acquisition Module

Build a low-noise, 32-bit delta-sigma ADC board designed around the ADS1262. This 10-channel design features integrated signal conditioning for RTDs, thermocouples, and strain gauges.


Embedded Intelligence: Insights From An Industry Pioneer

Embedded Intelligence: Insights From An Industry Pioneer

Embedded industry pioneer Christian Eder, co-founder of congatec, joins Daniel Bogdanoff to discuss 30 years of modular design, open standards like COM-HPC, and the future of edge AI.


Infineon Serves up Security IC Supporting USB and NFC Connectivity

Infineon Serves up Security IC Supporting USB and NFC Connectivity

The new SECORA ID Key S USB security solution supports FIDO2 and PKI through hardware and near field interfaces.


News Jul 20, 2026 by Duane Benson
Understanding the Noise Performance of AM Receivers with Envelope Detection

Understanding the Noise Performance of AM Receivers with Envelope Detection

Envelope detection is simple, but that simplicity has a noise-performance cost. Here’s how much SNR conventional AM gives up compared to its coherent counterparts.


Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

Arduino Launches Plug-and-Play Modules for Long-Range Sensor Projects

With the three new boards, developers can seamlessly integrate complex I2C sensor networks with motor drive systems without the headaches of chaotic wiring.


News Jul 17, 2026 by Dr. Steve Arar
Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

Nuvoton Rolls MCU Blending 24-bit ADC and Analog Front End

The Cortex-M23 microcontroller pairs metrology-grade signal acquisition with an LCD driver and Class-D voice output in a single LQFP128 package.


News Jul 15, 2026 by Luke James
Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

Efinix Seeks to Overcome Edge AI Constraints With New FPGA Family

The Titanium Edge FPGA family targets constrained edge AI with 50% lower power, compact SiP packages, high-speed MIPI I/O, and robust security/reliability features for intelligent systems.


News Jul 14, 2026 by Austin Futrell
STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

STMicro Debuts Single-Die Mobile Chip With Post-Quantum Cryptography

The ST54M places an NFC controller, secure element, and eSIM on one die and adds a hardware accelerator for NIST's post-quantum algorithms.


News Jul 14, 2026 by Luke James
NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Applications Processors | Featured Product Spotlight

NXP Semiconductors i.MX 95 Application Processors deliver intelligent, secure, and real-time edge computing for next-generation embedded systems. Watch and learn all about their features, specs, applications, and more!


new products Jul 13, 2026 by Mouser