Engineers from the University of Illinois have developed a microchip inductor that could greatly expand the capabilities of future chips.
February 25, 2020 by Alessandro Mascellino
The JODY-W3 series of multi-radio modules features 2 x 2 MIMO and dual-mode Bluetooth 5.1.
February 24, 2020 by Gary Elinoff
This article assesses how researchers have taken a preventative approach to security by creating their own hardware backdoors.
February 21, 2020 by Hannah DeTavis
TI claims that its TPSM53604 buck module consumes 50% less power and takes up 30% less space than competing devices.
February 20, 2020 by Gary Elinoff
Mitsubishi Electric has announced an RF IC and a new electronically steered radio antenna that will deliver high-speed in-flight satellite connectivity.
February 17, 2020 by Robin Mitchell
This article is the third of a series on microcontroller timers which describes the RTCs inside a microcontroller.
February 09, 2020 by Stephen Colley
The US government has blocked the sale of an EUV lithography system to China. What is EUV? why is it important? and why did the US government prevent its sale to China?
February 06, 2020 by Robin Mitchell
The ISL70005SEH, geared for satellite orbit, incorporates both a synchronous buck converter and a low dropout (LDO) regulator in one monolithic IC.
January 31, 2020 by Gary Elinoff
The size of a postage stamp, ChipSats form a sensor network to carry out tasks of larger satellites.
January 21, 2020 by Lisa Boneta
This episode of Tech Specs is part of a video series highlighting the features, applications, and technical specs of newly-released products.
January 21, 2020 by TTI, Inc
Position trackers and position sensors are fundamentally different. Yet sometimes outside of engineering spaces, we hear the terms used interchangeably. Here's why the distinction matters.
January 18, 2020 by Tyler Charboneau
Based on familiar COTS devices, these two radiation-hardened devices are designed to facilitate space-based Ethernet connectivity.
January 15, 2020 by Gary Elinoff
Maxim states that the MAX20340 shrinks the size of the power interface by 13mm2 and increases mechanical reliability.
January 10, 2020 by Gary Elinoff
The new SoC expedites the design of smart devices with LoRa and other types of LPWAN IoT connectivity.
January 08, 2020 by Gary Elinoff
This article highlights a few recent products that aim to meet the engineering pain points for harsh environments, including processing, power usage, size, and weight.
January 05, 2020 by Hannah DeTavis
The KU1500 is designed to allow radios to send and receive signals at the same time on the same or adjacent channels.
December 31, 2019 by Gary Elinoff
This Featured Product Spotlight is part of a video series exploring the specifications, applications, and market context of new products.
December 22, 2019 by Mouser Electronics
This New Product Brief (NPB) is part of a video series highlighting the features, applications, and technical specs of newly-released products.
December 19, 2019 by Mouser Electronics
The module is housed in a 7.5mm × 9.5mm × 1.5mm package and supports Thread and Zigbee.
December 19, 2019 by Gary Elinoff
December 13, 2019 by Mouser Electronics
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