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Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco Introduces a Universal Quantum Switch for Quantum Networking

Cisco designed the Universal Quantum Switch to connect quantum systems using different encoding methods, marking a major step toward scalable quantum networking over existing telecom infrastructure.


News May 14, 2026 by Joshua Tidwell
New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

New Connectors Focus on AI Memory, Rugged Power, and Sealed USB Designs

Attend, Samtec, and Same Sky have recently introduced new connectors that target modular AI memory integration, compact high-current interconnects, and environmentally sealed USB Type-C connectivity.


News May 13, 2026 by Joshua Tidwell
Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

Altera Intros Upgrade of FPGA AI Suite Enabling Determinism for Physical AI

The new version of FPGA AI Suite is designed to accelerate trained AI models into FPGAs


News May 13, 2026 by Duane Benson
Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Broadcom Targets Mass-Market Broadband With 10G PON and Wi-Fi 8 SoCs

Three new chips pair a cost-optimized fiber gateway processor with single-die dual-band Wi-Fi 8 radios, aiming to bring the latest wireless standard to price-sensitive service provider markets.


News May 12, 2026 by Luke James
Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

Europe’s Chip Ambitions: Why the EU’s Semi Strategy May Fall Short

An audit finds that the European Chips Act is "very unlikely" to hit the 20% global market target by 2030, citing fragmented funding, slow progress on FOAKs, and fierce international competition.


News May 12, 2026 by Gordon Feller
SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

SiTime Reveals MEMS Timing Device for AI Data Center GPU Optimization

The MEMS-based oscillator delivers less than 1 nanosecond of time synchronization accuracy for AI clusters.


News May 11, 2026 by Jake Hertz
Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

Intel and US Semi Fabrication Gets Huge Boost on Rumors from SpaceX, Apple

SpaceX’s proposed Terafab and Apple's preliminary discussions indicate escalating pressure to expand domestic semiconductor production.


News May 11, 2026 by Jake Hertz
Optical Brain Research Pushes Smaller Implants, Sharper Imaging

Optical Brain Research Pushes Smaller Implants, Sharper Imaging

Cornell, MIT, and HKUST teams have reported laser- and photonics-based devices that record neurons, image deeper, and tame crosstalk in all-optical neuroscience.


News May 08, 2026 by Luke James
The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

The LM386: How National Semiconductor Put a Speaker Amplifier in Eight Pins

Developed in the mid-1970s, National Semi’s LM386 collapsed a complete audio output stage into a single DIP-8 package running off a 9-V battery—and it became the first amplifier most hobbyists ever built.


News May 08, 2026 by Luke James
STMicro Unwraps Low-Power Image Sensors for Always-On Designs

STMicro Unwraps Low-Power Image Sensors for Always-On Designs

New BrightSense global-shutter sensors reduce power consumption by 10x for continuous sensing in battery-constrained wearables.


News May 07, 2026 by Jake Hertz
Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice Targets HMI and Edge Designs with New MCU Series

Gigadevice’s GD32F5HC MCU series combines high performance, compact size, integrated security, and rich peripherals to support HMI and IoT edge applications.


News May 06, 2026 by Austin Futrell
Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

Microchip Unveils Plug-In Timing Module for AI-Burdened Data Centers

The new plug-in module is designed to meet the timing and synchronization requirements of distributed computing, AI data centers, and upcoming 5G networks.


News May 06, 2026 by Duane Benson
Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Arm Axion Heads Google’s 8th-Gen TPUs as Cloud Pivots to Agentic AI

Google Cloud split the TPU line into training and inference variants, with Arm Neoverse-based Axion CPUs as the host across the stack. Arm also rolled out Performix, a free performance toolkit aimed at the silicon's growing developer base.


News May 05, 2026 by Luke James
TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

TDK Unwraps Software Tools for Sensor Data and IMU Evaluation

Today, the company released two new AI software products at Sensors Converge, SensorGPT, for creating sensor data at scale, and SensorStage to accelerate development workflow for the company’s latest IMUs.


News May 05, 2026 by Duane Benson
Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

Congatec Module Adds NPU-Based AI to Entry-Level x86 Embedded Designs

The module brings Intel's NPU-integrated processors to entry-level x86 systems, scaling edge AI performance and simplifying integration and long-term upgrades.


News May 04, 2026 by Joshua Tidwell
Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

Toshiba Collapses MCU, Motor Driver, and Sensorless Control Into One IC

The new motor control device simplifies high-efficiency brushless DC systems by combining a 32-bit processor with a specialized hardware vector engine.


News May 04, 2026 by Jake Hertz
ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

ST’s New High-Precision Op Amp Takes Aim at the 4 V to 36 V Range

The dual operational amplifier offers 20-µV precision across a wide 36-V supply range, eliminating the need for complex compensation in industrial and automotive signal chains.


News May 01, 2026 by Jake Hertz
Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

Analog Devices Unveils 2.0 Version of Its In-Cabin Automotive Audio Bus

The new ADAA245x series increases bandwidth by 400 percent and introduces Ethernet tunneling for software-defined vehicles.


News May 01, 2026 by Jake Hertz
Research Roundup: Earbud Heart Monitors, Aging on a Chip, and More

Research Roundup: Earbud Heart Monitors, Aging on a Chip, and More

New biomedical technologies use earbuds, light-driven interfaces, and microfluidic chips to improve heart monitoring and aging research.


News Apr 30, 2026 by Austin Futrell
Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

Novosense’s Isolated CAN Transceiver Offers +/-70 V Bus Fault Protection

The CAN FD-capable part targets battery management systems and high-voltage industrial buses, integrating signal isolation with bus protection in a single package.


News Apr 29, 2026 by Luke James