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U-blox’s New Wi-Fi 6E Module Steps Up When the Airwaves Get Crowded

U-blox’s New Wi-Fi 6E Module Steps Up When the Airwaves Get Crowded

U-blox built the tri-band Wi-Fi 6E and Bluetooth 5.4 module for secure, high-throughput industrial IoT applications.


News Apr 06, 2026 by Joshua Tidwell
Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi Releases 2 Solutions for Battery Pack Management

Dukosi is combining cell-level data tracking with a wireless communication architecture to address traceability requirements and reduce wiring complexity in battery systems.


News Apr 06, 2026 by Shannon Cuthrell
Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

Nuvoton Unveils MCU With Cortex-M33 Core Aimed at Smart Devices

The NuMicro M3331 series runs at up to 180 MHz and integrates hardware security, CAN FD, and LED control interfaces across packages as small as 4 × 4 mm.


News Apr 03, 2026 by Luke James
Power Integrations Extends Flyback Topology to 440W With GaN

Power Integrations Extends Flyback Topology to 440W With GaN

At APEC 2026, Power Integrations introduced its TopSwitchGaN 440 W, which unites PowiGaN switches with traditional TOPSwitch architecture, simplifying high-power designs.


News Apr 03, 2026 by Luke James
Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.


News Apr 02, 2026 by Jake Hertz
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.


News Apr 02, 2026 by Gordon Feller
Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

The startup's programmable chip uses a metasurface architecture to control light without moving parts.


News Apr 01, 2026 by Luke James
pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

pSemi Unveils Multi-Level Buck Converter for Direct Charging Designs

Claimed as the “world’s first” 4-level buck converter, the device enables high-efficiency 6 A fast charging for mobile and portable electronics.


News Mar 31, 2026 by Jake Hertz
5 Light-Based Technologies Reshaping Computing and Sensing

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.


News Mar 31, 2026 by Luke James
Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. Releases Multi-Phase SPI Boost Controller for Auto Lighting

Diodes Inc. says the device balances the demands of advanced headlight control units, including power density, efficiency, EMI, and functional safety.


News Mar 30, 2026 by Austin Futrell
Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

Microchip Intros Hybrid MCU/MPU SIP for Human-Machine Interfaces

The automotive-qualified system-in-package brings MPU power to a more accessible MCU-type development environment.


News Mar 30, 2026 by Duane Benson
Nordic Rains IoT Products at Embedded World and MWC 2026

Nordic Rains IoT Products at Embedded World and MWC 2026

At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.


News Mar 27, 2026 by Joshua Tidwell
Intersil ICL7106/07: The 40-Pin DIP That Built a Million Multimeters

Intersil ICL7106/07: The 40-Pin DIP That Built a Million Multimeters

Nearly five decades after Intersil released the ICL7106 and ICL7107 in 1978, the chips at the heart of the world's cheapest digital meters are still in production.


News Mar 27, 2026 by Luke James
Kristina Johnson: Engineering Change From Movie Theaters to Government

Kristina Johnson: Engineering Change From Movie Theaters to Government

To close out Women's History Month, we spotlight Kristina M. Johnson, the mind behind RealD's 3D technology—just one of her 118 patents.


News Mar 26, 2026 by Luke James
U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

U-blox’s New GNSS Platform Reportedly Cuts Power Consumption 40%

The new L1/L5 platform selectively engages its second frequency band only when conditions demand it, targeting wearables, fleet trackers, and drones.


News Mar 26, 2026 by Luke James
Ambient Scientific Lends AI Processor to Women’s Safety Wearable

Ambient Scientific Lends AI Processor to Women’s Safety Wearable

The MAI device from Dimension NXG runs AI models continuously on a 180-mAh battery for up to 14 days, using analog in-memory compute to keep power consumption at microwatt levels.


News Mar 25, 2026 by Luke James
Gigadevice Debuts Motor Control MCU and Low-Power NOR Flash Memory

Gigadevice Debuts Motor Control MCU and Low-Power NOR Flash Memory

Gigadevice doubled down on efficiency at Embedded World—unveiling a motor-control MCU that slashes system complexity and a low-voltage NOR flash that cuts power use by a third.


News Mar 24, 2026 by Duane Benson
4 Standout Microcontrollers From Embedded World 2026

4 Standout Microcontrollers From Embedded World 2026

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.


News Mar 23, 2026 by Duane Benson
STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

STMicro Launches UWB IC Family Aimed at Next-Gen Ranging and Sensing

Announced at Embedded World, the new IEEE 802.15.4ab-compliant SoC extends wireless ranging to hundreds of meters.


News Mar 23, 2026 by Jake Hertz
At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson