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Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Higher Volts, Smaller Caps: New MLCCs for Auto, Aero, and Defense

Discover how the latest MLCCs from Samsung, Murata, and Kyocera are tackling extreme environments through unprecedented power density and miniaturization.


News Apr 28, 2026 by Duane Benson
Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

Microchip’s CLB MCUs Marry Programmable Logic and Embedded Control

The configurable logic block microcontrollers grant developers the flexibility of an MCU-based design with the deterministic capability of dedicated hardware.


News Apr 28, 2026 by Duane Benson
Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Tageos Unveils FlexIC-Based NFC Inlays Using Pragmatic Semi’s Paper Chip

Two new product families pair Pragmatic's PR1301 chip with paper antennas to push smart packaging beyond silicon RFID's cost and material floor.


News Apr 27, 2026 by Luke James
More Control, Less Chaos With Microchip’s New All-in-One DSCs

More Control, Less Chaos With Microchip’s New All-in-One DSCs

Microchip’s new digital signal controllers integrate high-resolution control, high-speed analog, and post-quantum cryptography.


News Apr 24, 2026 by Joshua Tidwell
Intel 8086: How a Stopgap CPU Became the Foundation of Modern Computing

Intel 8086: How a Stopgap CPU Became the Foundation of Modern Computing

Released in June 1978 after a three-month architecture sprint, the 8086 was meant to buy Intel time while it finished its real next-gen processor. But the real one failed, and the stopgap built x86.


News Apr 24, 2026 by Luke James
Piezoelectric Chip Out of UCSD Rethinks DC-DC Conversion for GPUs

Piezoelectric Chip Out of UCSD Rethinks DC-DC Conversion for GPUs

A prototype converter achieves 96.2% peak efficiency, stepping 48 V down to 4.8 V, delivering four times the output current of previous piezoelectric designs.


News Apr 23, 2026 by Luke James
ADI Quietly Rolls Out 8- and 16-Channel, Easy Drive Multiplexed SAR ADCs

ADI Quietly Rolls Out 8- and 16-Channel, Easy Drive Multiplexed SAR ADCs

Analog Devices introduces a new family of high-density, 16-bit successive approximation register (SAR) ADCs to simplify multichannel data acquisition.


News Apr 22, 2026 by Jake Hertz
New Semtech IC Closes the USB-PD VBus Protection Gap at 53 V

New Semtech IC Closes the USB-PD VBus Protection Gap at 53 V

Where conventional TVS diodes fall short, the new circuit protection device offers continuous clamping voltage across current and temperature conditions.


News Apr 21, 2026 by Austin Futrell
Jack Dennis, Founding Father of Hacker Culture, Dies at 94

Jack Dennis, Founding Father of Hacker Culture, Dies at 94

The MIT professor emeritus shaped time-sharing, computer architecture, and a generation of engineers during a career spanning four decades.


News Apr 21, 2026 by Luke James
Infineon Intros ‘Virtual Oscilloscope’ for Digital Power Conversion

Infineon Intros ‘Virtual Oscilloscope’ for Digital Power Conversion

EEPower met with Infineon at Embedded World 2026 to learn about the ModusTooblox Power Suite, which bundles power conversion libraries, a PMBus stack, and a virtual oscilloscope.


News Apr 20, 2026 by Luke James
Espressif Bundles Wi-Fi 6, Bluetooth 5.4, and HMI Into RISC-V SoC

Espressif Bundles Wi-Fi 6, Bluetooth 5.4, and HMI Into RISC-V SoC

The new ESP32-S31 combines high-performance dual-core processing with multi-protocol wireless support.


News Apr 20, 2026 by Jake Hertz
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
Protocol, Link, & Physical: Synopsys Debuts First ‘Complete’ Storage

Protocol, Link, & Physical: Synopsys Debuts First ‘Complete’ Storage

The flash storage solution is the first complete IP set to include UFS 5.0, UniPro 3.0, and M PHY v6.0—and it delivers double the speed of UFS 4.0.


News Apr 17, 2026 by Duane Benson
Toshiba’s Quantum-Inspired Computer 100x Faster With New Algorithm

Toshiba’s Quantum-Inspired Computer 100x Faster With New Algorithm

The company's third-generation algorithm may speed up the performance of its Simulated Bifurcation Machine (SBM), allowing it to find solutions for drug discovery, finance, and beyond.


News Apr 16, 2026 by Luke James
Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

The company’s latest silicon, silicon carbide, and gallium nitride solutions offer a complete power conversion chain from the grid to the processor for AI data centers.


News Apr 16, 2026 by Jake Hertz
Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Design Wins Roundup: From Real-Time Medical Imaging to Artemis II

Integration and efficiency are reshaping modern system design, from rad-hard ICs in NASA’s Artemis II mission to SoCs turning ID badges into wireless systems.


News Apr 15, 2026 by Joshua Tidwell
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 3

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 3

The Netherlands' €1.1B integrated photonics initiative, led by PhotonDelta, is driving global leadership by financing startups and strengthening the supply chain.


News Apr 14, 2026 by Gordon Feller
Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Geared for quantum systems, Indie engineered the narrow-linewidth laser engineered for ytterbium atom cooling, which eliminates the need for external optical stacks.


News Apr 14, 2026 by Luke James
Nvidia Unveils Seven Chips to ‘Scale the World’s Largest AI Factories’

Nvidia Unveils Seven Chips to ‘Scale the World’s Largest AI Factories’

The Vera Rubin platform offers a modular, rack-scale architecture to help develop and deploy agentic AI.


News Apr 13, 2026 by Jake Hertz