ST says its new microprocessors balance application-class performance, real-time control, and power management.
ST says its new microprocessors balance application-class performance, real-time control, and power management.
The add-on board, based on U-blox's X20, brings all-band GNSS, RTK, and HAS-ready corrections to Syslogic's embedded platforms.
The add-on board, based on U-blox's X20, brings all-band GNSS, RTK, and HAS-ready corrections to Syslogic's embedded platforms.
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide…
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.
The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten…
The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten compact-model and PDK development cycles.
Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream…
Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream 8-bit and early 16-bit designs.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for…
Toshiba has expanded its lineup with the TC75W71FU dual comparator with a 30-45 ns response and rail‑to‑rail I/O for safer overcurrent detection.
Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip…
Infineon has launched a USB 2.0 controller that features dual-core processing, integrated security, and large on-chip SRAM for high-throughput devices.
Insight SiP adds LL, LX, and LP variants to its ISP2454 BLE series, offering different power and memory configurations to…
Insight SiP adds LL, LX, and LP variants to its ISP2454 BLE series, offering different power and memory configurations to meet varied IoT design needs.
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI…
The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.
The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting…
The new oHFM specification defines a common, scalable module framework for FPGA and SoC-FPGA designs, targeting carrier-board reuse across vendors and deployment classes.
The audio capture chip leverages Triad's current conveyor architecture to deliver a 156-dB input capture range from dual inputs.
The audio capture chip leverages Triad's current conveyor architecture to deliver a 156-dB input capture range from dual inputs.
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density…
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference…
Nordic's new SoC integrates an Axon NPU and Neuton models, delivering ultra-low-power, on-device AI with quick inference and easier developer workflows.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Gen5 QLC client SSDs, enterprise LPDDR5X with RAIDDR ECC, and HBM4-era AI memory concepts anchor a week of announcements.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.
At CES 2026, Infineon showcased a new family of radio chips integrating Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread.
While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems…
While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.
At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like…
At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.
All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context…
All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.
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