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TDK Merges Sensing and Intelligence at the Edge Like Never Before

TDK Merges Sensing and Intelligence at the Edge Like Never Before

All About Circuits met with TDK at CES 2026 to learn how their solutions may redefine sensing, inference, and context awareness in wearables and smart glasses.


News Jan 19, 2026 by Jake Hertz
Mostek MK4116/MK4164: The DRAM Pair That Standardized the 8-Bit Era

Mostek MK4116/MK4164: The DRAM Pair That Standardized the 8-Bit Era

Mostek’s 16K MK4116 and its 64K successor, the MK4164, became the DRAMs that defined late-1970s and early-1980s microcomputers and set conventions the industry followed for years.


News Jan 16, 2026 by Luke James
Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.


News Jan 15, 2026 by Austin Futrell
Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

Inside eMASS’s ECS-DoT SoC: Decompression and AI at the Sensor Edge

In this exclusive CES interview, All About Circuits learned how EMASS's new ultra-low-power SoC brings intelligence where size, power, and latency matter most: the sensor edge.


News Jan 14, 2026 by Jake Hertz
For the First Time, AI Designs a Computer—in Less Than a Week

For the First Time, AI Designs a Computer—in Less Than a Week

Quilter has designed a fully functional Unix computer using AI, compressing a quarter's worth of PCB design time into a single week.


News Jan 14, 2026 by Arjun Nijhawan
Exclusive Interview: Weebit Nano, TI, and the Future of Resistive RAM

Exclusive Interview: Weebit Nano, TI, and the Future of Resistive RAM

Look out, flash! With a resounding vote of confidence from Texas Instruments and Onsemi, ReRAM may be here to stay.


News Jan 13, 2026 by Jake Hertz
Rohm Expands DC Motor Driver Lineup for Home and Office Appliances

Rohm Expands DC Motor Driver Lineup for Home and Office Appliances

Rohm's new brushed DC motor drivers may help designers balance reuse, protection, and ultra-low standby power in compact motor stages.


News Jan 13, 2026 by Luke James
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.


News Jan 12, 2026 by Jake Hertz
Ceva Expands Edge AI Portfolio From Wearables to SDVs

Ceva Expands Edge AI Portfolio From Wearables to SDVs

At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.


News Jan 12, 2026 by Jake Hertz
Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.


News Jan 12, 2026 by Luke James
Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.


News Jan 09, 2026 by Gordon Feller
Geehy Launches Encoder MCU Aimed at High-Precision Motion Control

Geehy Launches Encoder MCU Aimed at High-Precision Motion Control

Geehy didn't just tack encoder support onto a general-purpose MCU; the new "encoder MCU" is tailored for industrial servo systems, embodied robots, and intelligent automation equipment.


News Jan 09, 2026 by Luke James
MIT Flips the Challenges of Chip Stacking On Its Head

MIT Flips the Challenges of Chip Stacking On Its Head

Low-temperature BEOL transistors and memory elements aim to cut data-movement energy in AI workloads.


News Jan 08, 2026 by Luke James
AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

The industry's biggest chipmakers came to CES with processors that will shape the future of AI PCs, data center computing, and embedded AI.


News Jan 08, 2026 by Duane Benson
Design Wins: Four Designs Rethink Compute, Power, and Integration

Design Wins: Four Designs Rethink Compute, Power, and Integration

This four-product roundup highlights new hardware platforms for spaceborne AI, EV power, wireless sensing, and private 5G.


News Jan 07, 2026 by Joshua Tidwell
NXP Ushers Agentic AI to the Edge with New AI Development Tools

NXP Ushers Agentic AI to the Edge with New AI Development Tools

Announced today at CES, the new tools focus on inference-first deployment to embedded processors rather than retrofitting cloud-native workflows.


News Jan 06, 2026 by Jake Hertz
Digid Qualifies Its Tiny Temperature and Force Sensors for Mass Deployment

Digid Qualifies Its Tiny Temperature and Force Sensors for Mass Deployment

Announced today at CES, Digid has qualified its nanoscale sensing technology for volume deployment.


News Jan 06, 2026 by Jake Hertz
At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

Today at CES, Ambarella unveiled an SoC with multi-sensor perception, multi-stream video, and very low power consumption.


News Jan 06, 2026 by Duane Benson
6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans

6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans

Recent updates show where RISC-V is heading, from compact ESP32 devices to one of the biggest names in mainstream computing.


News Jan 05, 2026 by Joshua Tidwell