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ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

ISSCC 2024: Inside AMD’s Zen 4c—The Area-Optimized Cloud Computing Core

AMD engineers presented their latest innovation this week at ISSCC, showing the world how they realized the Zen 4c CPU core.


News Feb 23, 2024 by Aaron Carman
AMD Launches Embedded+ Architecture Blending Ryzen and Versal

AMD Launches Embedded+ Architecture Blending Ryzen and Versal

Unveiled today, the new architecture hopes to facilitate sensor integration, offloaded processing, and faster times to market.


News Feb 06, 2024 by Jake Hertz
IEEE Radio and Wireless Week—A Wrap Up: Eyes on the Future

IEEE Radio and Wireless Week—A Wrap Up: Eyes on the Future

In the age of innovation, new technologies will be necessary to continue building on previous work. At RWW 2024, the consensus: We’re nearing a peak. How can we continue climbing?


News Feb 05, 2024 by Aaron Carman
Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

Building IoT Sensors Armed With AI, Wi-Fi 6, and Matter Capabilities

In this news analysis piece, Nthatisi discusses crafting sensors equipped with Wi-Fi 6, Matter, and Machine Learning using Silicon Labs' SiWx917 IoT device.


News Jan 27, 2024 by Nthatisi Hlapisi
Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.


News Jan 09, 2024 by Duane Benson
AMD Unveils Processor and AI Adaptive SoC—Both Aimed At Automotive

AMD Unveils Processor and AI Adaptive SoC—Both Aimed At Automotive

At CES, AMD makes the case that next-generation cars could be a lot smarter by leveraging the company’s new embedded processor and adaptive SoCs.


News Jan 08, 2024 by Aaron Carman
Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

Can There Be Any Doubt? In Our Industry, 2023 Was ‘The Year of AI’

While the rest of the world spent 2023 playing with ChatGPT, the electronics industry put AI into everything from processors to edge IoT chips to EDA tools.


News Dec 27, 2023 by Jeff Child
Flux Upgrades Its Copilot Tool Adding Multi-Modal AI Features

Flux Upgrades Its Copilot Tool Adding Multi-Modal AI Features

Released today, the upgrade brings improvements—including image capability—in Flux AI Chatbot giving designers a smarter virtual “engineering partner” to help with electronics PCB designs


News Dec 21, 2023 by Duane Benson
Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Kinara Aims Its Tiny Ara-2 Processor at Big Generative Edge AI Workloads

Boasting a cost-effective approach, today Kinara is rolling out its new edge AI processor designed to take on the demanding workloads brought on by generative AI.


News Dec 12, 2023 by Jake Hertz
Arm Releases the Cortex-M52 Aimed At Low-Power Embedded AI

Arm Releases the Cortex-M52 Aimed At Low-Power Embedded AI

Rounding out its portfolio, the latest Arm processor—announced today—sports AI performance in low-power silicon.


News Nov 22, 2023 by Aaron Carman
RISC-V Rollouts Abound at This Week’s North America RISC-V Summit

RISC-V Rollouts Abound at This Week’s North America RISC-V Summit

Reporting a “banner year” for adoption, these RISC-V developments show the versatility of the ISA.


News Nov 10, 2023 by Aaron Carman
Nvidia Targets Generative AI for Robotics with New Frameworks

Nvidia Targets Generative AI for Robotics with New Frameworks

At ROSCon 2023 this week, the release of the Metropolis and Isaac ROS 2.0 frameworks makes AI-powered robotics more practical and easier to develop.


News Oct 19, 2023 by Aaron Carman
SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive Rolls Out RISC-V Cores Aimed at Generative AI and ML

SiFive has released two new processors, one to target machine learning applications, and one to target general-purpose HPC.


News Oct 16, 2023 by Jake Hertz
Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.


News Sep 25, 2023 by Duane Benson
AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

AI Networking Chip Startup, Enfabrica, Receives $125 Million in Series B Funding

With Nvidia now added to its list of strategic investors, Enfabrica has opened pre-orders on systems using its AI era fabric switch IC


News Sep 15, 2023 by Duane Benson
At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

At DAC 2023, EDA Tools Roll Aimed at Next-gen IC Design and Verification

A slew of new electronic design automation (EDA) tools and resources for IC design and verification were debuted at last week’s DAC 2023 event. Here’s a sampling.


News Jul 17, 2023 by Darshil Patel
Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

Rambus Serves up Quantum-safe IP Solutions To Fend off Attacks

The new Root of Trust IP from Rambus offers post-quantum cryptography hardware solutions.


News Jul 12, 2023 by Jake Hertz
Interface-type Memristive Device Pushes Neuromorphic Computing Onward

Interface-type Memristive Device Pushes Neuromorphic Computing Onward

A new interface-type memristive device may be used to build artificial synapses for the next wave of neuromorphic computing.


News Jun 13, 2023 by Chantelle Dubois
Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Axelera AI Raises $50 Million to ‘Mainstream’ Edge AI

Leveraging its proprietary in-memory compute scheme and RISC-V dataflow technology, Axelera AI seeks to “democratize” artificial intelligence (AI).


News May 31, 2023 by Jake Hertz
Flux Adds AI Design Assistant to Its Browser-based PCB Design Tool

Flux Adds AI Design Assistant to Its Browser-based PCB Design Tool

Flux is launching an integrated AI-powered “chatbot-like” design assistant that’s integrated into its web-based online PCB design tool.


News Apr 27, 2023 by Jeff Child