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A New Multi-Pixel Metal-Oxide Gas Sensor with an I2C Interface in a Small Package

A New Multi-Pixel Metal-Oxide Gas Sensor with an I2C Interface in a Small Package

Sensirion touts long-term stability and increased robustness from their new SGP metal-oxide gas sensor, which is aimed at indoor air quality applications.


News Nov 13, 2017 by Nick Davis
SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

SiFive, the company behind the first RISC-V based SoCs, has recently announced the addition of Flex Logix’s FPGA IP to its DesignShare initiative.


News Nov 12, 2017 by Chantelle Dubois
Penny Wise and Pound Foolish: One Man’s Experience with the Hidden Cost of Cheap Parts

Penny Wise and Pound Foolish: One Man’s Experience with the Hidden Cost of Cheap Parts

Sometimes pennies saved in the design and manufacturing process can cost dollars later. This article visits the hidden costs of sourcing cheap components.


News Nov 03, 2017 by Mark Hughes
STMicro’s New ST53G System-in-Package Chip Could Add Contactless Payment to Your Smart Watch

STMicro’s New ST53G System-in-Package Chip Could Add Contactless Payment to Your Smart Watch

Could this be the chip that brings contactless payment in wearables to the forefront? This News Brief takes a look at the ST53G SiP (system-in-package) from STMicroelectronics.


News Oct 23, 2017 by Tim Youngblood
The History and Basics of IPC Standards: The Official Standards for PCBs

The History and Basics of IPC Standards: The Official Standards for PCBs

Learn about the industry-adopted IPC standards that govern every step related to the design, assembly, inspection, testing, and documentation of printed circuit boards (PCBs).


News Oct 20, 2017 by Nick Davis
Intel to Introduce New CPU-FPGA Hybrid Chip Supported by Acceleration Stack

Intel to Introduce New CPU-FPGA Hybrid Chip Supported by Acceleration Stack

Last year, Intel acquired FPGA-focused Altera. Now they've announced the intention to create a hybrid between their well-known CPUs and FPGAs.Last year, Intel acquired FPGA-focused Altera. Now they've announced a new line of hybrid chips that combine FPGAs with their well-known CPUs, achieving a goal set in 2010.


News Oct 18, 2017 by Chantelle Dubois
Teardown Tuesday: Motion-Activated Trail Camera

Teardown Tuesday: Motion-Activated Trail Camera

In this Teardown Tuesday, we are going to take a look at the inner workings of a trail camera!


News Oct 17, 2017 by Alex Udanis
Dialog Semiconductor to Acquire Silego for $306 Million in Bid for the IoT

Dialog Semiconductor to Acquire Silego for $306 Million in Bid for the IoT

Dialog Semiconductor is set to acquire Silego for a reported $306 million. How will this affect their product lines?


News Oct 14, 2017 by Tim Youngblood
New Design Contest Challenges Designers to Create Configurable Mixed-Signal ICs

New Design Contest Challenges Designers to Create Configurable Mixed-Signal ICs

A new design competition has presented a series of challenges over roughly two months to use GreenPAK technology to make configurable mixed-signal ICs (CMICs).


Nextchip SoC Teams Up with CEVA Platform to Boost Real-Time Image Processing for ADAS

Nextchip SoC Teams Up with CEVA Platform to Boost Real-Time Image Processing for ADAS

In this News Brief, we take a look at Nextchip's Apache4 pre-processor SoC, which was recently licensed to the CEVA-XM4 imaging and vision platform.


DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

DARPA Adds Six Programs to Electronic Resurgence Initiative for Circuit Design and Microelectronics

The Defense Advanced Research Projects Agency (DARPA) recently announced six additions to its Electronic Resurgence Initiative (ERI), using the talents (and funding) of the US military to solve issues that practicing designers see coming in the industry.


News Sep 25, 2017 by Chantelle Dubois
Jack Kilby and the World’s First Integrated Circuit

Jack Kilby and the World’s First Integrated Circuit

Jack Kilby from Texas Instruments held 60 patents, invented the handheld calculator, and won a Nobel Prize. But he had another invention that would change electronics and the world.


News Sep 16, 2017 by Tim Youngblood
Teardown Tuesday: Bluetooth Car FM Radio Transmitter

Teardown Tuesday: Bluetooth Car FM Radio Transmitter

See what's inside this Bluetooth device that allows you to use your radio for wireless music in your car.


News Sep 05, 2017 by Mark Hughes
Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

Multi-Layer Sprayable SoC Microprocessor Demonstrates Advances in AJP

AJP promises to revolutionize 3D printing in the IoT era.


RISC-V Continues to Expand, Gathers Partnerships Across the Industry

RISC-V Continues to Expand, Gathers Partnerships Across the Industry

The RISC-V Foundation has continued to build on its momentum, announcing that this month the open-source ISA presence at HOT CHIPS 29.


News Aug 30, 2017 by Chantelle Dubois
Microsoft Reveals Xbox One X Scorpio SoC Features at Hot Chips 2017

Microsoft Reveals Xbox One X Scorpio SoC Features at Hot Chips 2017

At Hot Chips this week, Microsoft provided some details about their Scorpio SoC, slated to feature in the next X-Box gaming console.


News Aug 23, 2017 by Kate Smith
Harnessing Stimulated Brillouin Scattering for CMOS-Compatible, High-Performance Optical Circuits

Harnessing Stimulated Brillouin Scattering for CMOS-Compatible, High-Performance Optical Circuits

Stimulated Brillouin scattering (SBS)—plus a new method of integrating arsenic trisulfide onto silicon-based chips—might be the key to a new generation of ultra-high-performance optical circuits.


News Aug 10, 2017 by Zabrel Holsman
New Lithography Technique Allows Precise Nanomaterial Patterning for Nanoscale Circuit Manufacturing

New Lithography Technique Allows Precise Nanomaterial Patterning for Nanoscale Circuit Manufacturing

A new process dubbed DOLFIN enables inexpensive and scalable nanofabrication and patterning of a broad range of materials.


News Aug 09, 2017 by Zabrel Holsman
Maxim Integrated Releases New PMICs Optimized for Small Li-ion Batteries in Wearables

Maxim Integrated Releases New PMICs Optimized for Small Li-ion Batteries in Wearables

Two new PMICs boost integration with single inductor multiple output (SIMO) regulator to maintain a very long battery life.


News Aug 01, 2017 by Majeed Ahmad
The Top 3 Design Considerations in USB Type-C Power Delivery

The Top 3 Design Considerations in USB Type-C Power Delivery

Authentication, over-voltage protection, and compact form factor are key challenges in implementing power delivery feature in the next-generation USB designs.


News Jul 28, 2017 by Majeed Ahmad