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Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Infineon Achieves 800 MB/s Data Throughput with HYPERRAM 3.0

Upping the game for low pin count, high throughout DRAM, Infineon’s third generation HYPERRAM device doubles bandwidth to 800 MB/s in a 49-pin BGA.


News Aug 16, 2022 by Jeff Child
Three’s a Crowd—YTMC Throws Its Own 3D NAND Into the Ring

Three’s a Crowd—YTMC Throws Its Own 3D NAND Into the Ring

Summer 2022 is turning out to be a hot one for the memory industry, with not just one, not just two, but three announcements from chipmakers relating to advanced 3D NAND production.


News Aug 10, 2022 by Chantelle Dubois
Take Our 2022 EETech Global Engineering Survey

Take Our 2022 EETech Global Engineering Survey

Join your engineering community peers and take our EETech 2022 Global Engineering Survey. You’ll get a summary of the results once they’re released. And you’ll be entered for a chance to win an Amazon card prize!


News Aug 09, 2022 by Jeff Child
The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

The Memory Market Heats Up With SK hynix’s 238-layer 4D NAND

Last week, Micron launched the production of a 232-layer 3D NAND. Now, SK hynix is claiming "highest 4D NAND flash" at 238 layers.


News Aug 05, 2022 by Jake Hertz
Samsung Launches Industry’s First 24 Gbps GDDR6 DRAM

Samsung Launches Industry’s First 24 Gbps GDDR6 DRAM

Samsung began sampling new 16 Gbps GDDR6 DRAM featuring 24 Gb/s speed to power next-generation computing systems.


News Jul 30, 2022 by Darshil Patel
 Peaking at 232 Layers, the Sky’s the Limit for Micron’s 3D NAND

Peaking at 232 Layers, the Sky’s the Limit for Micron’s 3D NAND

The vertically-layered memory technology from Micron marks the industry’s highest areal-density NAND chip.


News Jul 29, 2022 by Jake Hertz
Researchers Unveil Liquid-based Memory Concepts for Mass Storage

Researchers Unveil Liquid-based Memory Concepts for Mass Storage

Researchers at IMEC have divulged two proposed schemes for implementing liquid-based memories. Could they provide a future replacement for NAND flash mass storage?


News Jul 23, 2022 by Darshil Patel
Rambus Spins DDR5 DIMM Interface ICs for Data Center Servers

Rambus Spins DDR5 DIMM Interface ICs for Data Center Servers

Adding SPD (serial presence detect) hub and temperature sensor ICs to its DDR5 portfolio, Rambus now has a complete chipset offering for DDR5 DIMM interfacing.


News Jul 19, 2022 by Jeff Child
Renesas Speeds Up Read and Write Performance for MCUs with STT-MRAM

Renesas Speeds Up Read and Write Performance for MCUs with STT-MRAM

A new memory offering from Renesas hopes to speed up memory accesses for IoT applications.


News Jun 17, 2022 by Jake Hertz
How Spin-transfer Torque MRAMs May Simplify Embedded Systems

How Spin-transfer Torque MRAMs May Simplify Embedded Systems

New magneto-resistive RAMs are said to simplify embedded designs by eliminating the need for batteries or capacitors.


News May 23, 2022 by Darshil Patel
Pros and Cons of Space-based Flash—Microchip Takes Flash Off to Space

Pros and Cons of Space-based Flash—Microchip Takes Flash Off to Space

Microchip has recently extended its commercial-off-the-shelf (COTS) radiation-tolerant technology to flash memory. However, what pros and cons exist for flash memory in space?


News Apr 25, 2022 by Jake Hertz
Quantum Memristors Combine AI and Quantum Computing

Quantum Memristors Combine AI and Quantum Computing

Memory capacity remains one of the enduring challenges to quantum computing. Now, Vienna researchers say they have found a way to scale quantum memristors.


Finding Your EE “Why” With Thy Tran: The “Semiconductor Gypsy”

Finding Your EE “Why” With Thy Tran: The “Semiconductor Gypsy”

In honor of Woman’s History Month, AAC talked with Micron’s Thy Tran who has made waves in the industry, inspiring new engineers and helping to bring groundbreaking DRAM technology to life.


News Mar 31, 2022 by Kimber Wymore
TinyML Strikes Out to Improve Memory Performance and Ease FPGA Design

TinyML Strikes Out to Improve Memory Performance and Ease FPGA Design

As the world of machine learning (ML) grows and finds its use in more applications, researchers and companies are finding ways to leverage it to improve hardware performance and design.


News Jan 31, 2022 by Jake Hertz
New RRAM Arrays Bypass 1T1R Limitations for Better Non-volatile Memory Solutions

New RRAM Arrays Bypass 1T1R Limitations for Better Non-volatile Memory Solutions

Aiming to kick non-volatile memory to the next level, Weebit Nano demonstrated its first crossbar resistive random-access memory (ReRAM or RRAM) arrays.


News Jan 28, 2022 by Jake Hertz
Arm Puts Security Architecture to the Test With New SoC and Demonstrator Board

Arm Puts Security Architecture to the Test With New SoC and Demonstrator Board

Arm recently announced a new prototype architecture that has spun out of its Morello program, which may pave the road for next-generation data security systems.


News Jan 26, 2022 by Darshil Patel
Renesas Pushes Beyond MRAM Write Challenges Spurring Memory Technology Forward

Renesas Pushes Beyond MRAM Write Challenges Spurring Memory Technology Forward

With new improvements to magnetoresistive random-access memory (MRAM) write technology, Renesas claims to improve power consumption for Internet-of-Things (IoT) applications and push MRAM further.


News Jan 04, 2022 by Jake Hertz
New Research Suggests Processing-in-Memory Could Revolutionize Analog Computing

New Research Suggests Processing-in-Memory Could Revolutionize Analog Computing

Processing-in-memory is no longer confined to the research realm. Even companies like Samsung and IBM are spearheading the movement toward in-memory computing.


News Dec 23, 2021 by Biljana Ognenova
Around the Industry: Examples of How Complex ICs Require Complex Design Tools

Around the Industry: Examples of How Complex ICs Require Complex Design Tools

Industries like aerospace and defense are only raising the bar on IC requirements. Here are a few recently announced tools helping IC designers meet the task.


News Dec 21, 2021 by Ikimi .O
From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

From GPUs to DDR5 Modules: CES 2022 Kicks Off Innovation Awards With Honorees

With 2022's Consumer Electronics Show (CES) coming up soon, we’ll take a look at some notable technologies to be highlighted at next year's Innovation Awards.


News Dec 20, 2021 by Jake Hertz