Latest AI/Neural Networks Articles and Videos

Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…

Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.

Both copper and optical interconnects face limitations as choices for next gen data centers. Learn how a third option…

Both copper and optical interconnects face limitations as choices for next gen data centers. Learn how a third option promises to enable scaling up AI clusters in data centers for years to come.

TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate…

TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.

Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…

Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.

The manufacturer envisions a rideable, hydrogen-powered robotic horse. Is this back to the future?

The manufacturer envisions a rideable, hydrogen-powered robotic horse. Is this back to the future?

Celebrating 40 years of innovation, Arm's architecture has evolved from a simple processor in a British lab to a…

Celebrating 40 years of innovation, Arm's architecture has evolved from a simple processor in a British lab to a cornerstone of modern computing.

The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a…

The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a software-defined RF platform.

JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…

JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.

The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis…

The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis to Parkinson’s disease.

Whether it’s streaming speech directly from the brain or turning sunlight into clean water, these new studies aim to…

Whether it’s streaming speech directly from the brain or turning sunlight into clean water, these new studies aim to solve problems across healthcare, clean energy, materials science, and beyond.

Siemens, Nokia, Infineon, Onsemi, and Black Semiconductor are making targeted acquisitions to expand their capabilities…

Siemens, Nokia, Infineon, Onsemi, and Black Semiconductor are making targeted acquisitions to expand their capabilities in manufacturing, connectivity, and advanced materials.

These collaborations will focus on making hardware more efficient: GaN in EVs, scalable photonics, and smarter GPU use in…

These collaborations will focus on making hardware more efficient: GaN in EVs, scalable photonics, and smarter GPU use in AI systems.

These three computing solutions rethink ways to bring edge AI to the harshest industrial applications.

These three computing solutions rethink ways to bring edge AI to the harshest industrial applications.

While one of the new DSP PHYs reportedly offers the industry’s lowest power consumption for 800G, the other is the…

While one of the new DSP PHYs reportedly offers the industry’s lowest power consumption for 800G, the other is the first 200G/lane DSP with integrated VCSEL drivers.

These collaborations are shaping the future of wireless networks, from RF power consumption to AI-driven data compression.

These collaborations are shaping the future of wireless networks, from RF power consumption to AI-driven data compression.

We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI…

We talked with Nuvoton President Hsin-Lung Yang in this exclusive Embedded World 2025 interview. Our topics covered AI embedded development, automotive, IoT, sustainability, and the forecast for 2025.

Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.

Enjoy this fresh crop of technology news from the Embedded World 2025 trade show in Nuremberg, Germany.

In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive…

In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.

Together, the new solutions skirt the heat associated with AI compute without compromising performance.

Together, the new solutions skirt the heat associated with AI compute without compromising performance.