The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical…
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical with MIPS, and TI backs U.S. fabs with $60B.
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors,…
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors, and the "world’s smallest" 10 µF/50V MLCC for cars.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other…
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other automotive systems.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and…
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and cross-correlation.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
Launching today, the organization aims to make GMSL technology a standard for automotive connectivity.
Launching today, the organization aims to make GMSL technology a standard for automotive connectivity.
With a 4x increase in CPU performance, the upgraded dev kit better facilitates secure automotive communication between…
With a 4x increase in CPU performance, the upgraded dev kit better facilitates secure automotive communication between the vehicle’s gateway and its wireless technologies.
Microchip's latest 8-bit microcontrollers may simplify sensor design with their integrated, low-power analog peripherals.
Microchip's latest 8-bit microcontrollers may simplify sensor design with their integrated, low-power analog peripherals.
The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the…
The company is rolling out 16 Schottky diodes in smaller Clip-bonded FlatPower packages, side-stepping some of the constraints of traditional SMX packages.
NXP has unveiled its most powerful radar processor yet, enabling advanced autonomous driving features with better…
NXP has unveiled its most powerful radar processor yet, enabling advanced autonomous driving features with better resolution, speed, and cost efficiency.
The series is designed for lithium-ion battery systems used in electric vehicles and energy storage systems
The series is designed for lithium-ion battery systems used in electric vehicles and energy storage systems
Three recent design wins exemplify how wireless and edge AI technologies are advancing real-world applications.
Three recent design wins exemplify how wireless and edge AI technologies are advancing real-world applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
The OX01N1B image sensor features NIR quantum efficiency and better image quality for in-cabin driver monitoring systems.
The OX01N1B image sensor features NIR quantum efficiency and better image quality for in-cabin driver monitoring systems.
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