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Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

Geehy Launches Arm Automotive MCU for Body and Comfort ECUs

The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.


News Feb 23, 2026 by Luke James
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.


News Feb 17, 2026 by Jake Hertz
Microchip Adds 12 Devices in 600 V Gate Driver Family

Microchip Adds 12 Devices in 600 V Gate Driver Family

The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.


News Feb 12, 2026 by Joshua Tidwell
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

Allegro Targets Noise and Heat With SiC Gate Drivers, Sensors

The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.


News Jan 23, 2026 by Joshua Tidwell
Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

Voyant Photonics Has Silicon That Will ‘Make LiDAR as Common as Cameras’

At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.


News Jan 19, 2026 by Jake Hertz
Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens Introduces New Type of Digital Twin Software for SDV Development

Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.


News Jan 15, 2026 by Austin Futrell
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.


News Jan 12, 2026 by Jake Hertz
Ceva Expands Edge AI Portfolio From Wearables to SDVs

Ceva Expands Edge AI Portfolio From Wearables to SDVs

At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.


News Jan 12, 2026 by Jake Hertz
At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

At CES, Ambarella Unwraps Edge AI 8K Vision SoC and New Developer Zone

Today at CES, Ambarella unveiled an SoC with multi-sensor perception, multi-stream video, and very low power consumption.


News Jan 06, 2026 by Duane Benson
6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans

6 Snapshots Show RISC-V Solidifying Its Stronghold in Products and Plans

Recent updates show where RISC-V is heading, from compact ESP32 devices to one of the biggest names in mainstream computing.


News Jan 05, 2026 by Joshua Tidwell
NXP Makes Its CES Reveal: A Central Compute Platform for Smart Vehicles

NXP Makes Its CES Reveal: A Central Compute Platform for Smart Vehicles

Announced today, the new real-time, super-integration processor is the next step in NXP’s automotive processing platform.


News Jan 05, 2026 by Jake Hertz
Renesas Hits the Gas on SDV Innovation With New Automotive SoC

Renesas Hits the Gas on SDV Innovation With New Automotive SoC

R-Car Gen 5 X5H delivers high compute and efficiency for software-defined vehicles with RoX Whitebox SDK support.


News Dec 30, 2025 by Luke James
ST Spins Out Op Amp Boasting High Accuracy, Speed, and Stability

ST Spins Out Op Amp Boasting High Accuracy, Speed, and Stability

The zero-drift TSZ901 brings microvolt-level offset and 10-MHz bandwidth to sensor interfaces and current measurement.


News Dec 29, 2025 by Jake Hertz
Lattice’s New FPGAs Expand Possibilities for Control and Connectivity

Lattice’s New FPGAs Expand Possibilities for Control and Connectivity

The latest members of the low-power, low-density FPGA product line feature instant-on with 896 to 9400 look-up tables.


News Dec 22, 2025 by Duane Benson
Tiny Connectors With Big Jobs in Automotive and Industrial Applications

Tiny Connectors With Big Jobs in Automotive and Industrial Applications

Here's the latest roundup of connectors offering better EV power delivery, industrial SPE networking, and high-current automotive electronics.


News Dec 18, 2025 by Joshua Tidwell
Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

Projections to 2030: How Korea’s Chipmakers Could Re-Shape the Semi World

By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.


News Dec 15, 2025 by Gordon Feller