The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.
The 40 nm Arm Cortex-M4F device combines 256 KB flash, CAN FD, and ASIL-B positioning for NEV subsystems.
The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.
The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.
The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and…
The 600 V gate driver family offers 12 devices for motor control and power conversion, supporting fast switching and noise immunity.
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide…
The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density…
The silicon carbide gate drivers and an ultra-low-loss isolated current sensor can improve efficiency and power density in high-voltage systems.
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over…
Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.
At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like…
At CES, All About Circuits interviewed Voyant Photonics' CEO to learn about the company's vision for LiDAR's camera-like future with solid-state 4D FMCW sensing.
Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.
Siemens says it can reduce setup time from months to days with the off-the-shelf, cloud-based, digital twin offering.
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto…
Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.
All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.
All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.
At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the…
At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.
Today at CES, Ambarella unveiled an SoC with multi-sensor perception, multi-stream video, and very low power consumption.
Today at CES, Ambarella unveiled an SoC with multi-sensor perception, multi-stream video, and very low power consumption.
Recent updates show where RISC-V is heading, from compact ESP32 devices to one of the biggest names in mainstream computing.
Recent updates show where RISC-V is heading, from compact ESP32 devices to one of the biggest names in mainstream computing.
Announced today, the new real-time, super-integration processor is the next step in NXP’s automotive processing platform.
Announced today, the new real-time, super-integration processor is the next step in NXP’s automotive processing platform.
R-Car Gen 5 X5H delivers high compute and efficiency for software-defined vehicles with RoX Whitebox SDK support.
R-Car Gen 5 X5H delivers high compute and efficiency for software-defined vehicles with RoX Whitebox SDK support.
The zero-drift TSZ901 brings microvolt-level offset and 10-MHz bandwidth to sensor interfaces and current measurement.
The zero-drift TSZ901 brings microvolt-level offset and 10-MHz bandwidth to sensor interfaces and current measurement.
The latest members of the low-power, low-density FPGA product line feature instant-on with 896 to 9400 look-up tables.
The latest members of the low-power, low-density FPGA product line feature instant-on with 896 to 9400 look-up tables.
Here's the latest roundup of connectors offering better EV power delivery, industrial SPE networking, and high-current…
Here's the latest roundup of connectors offering better EV power delivery, industrial SPE networking, and high-current automotive electronics.
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in…
By 2030, Korean chipmakers are projected to dominate AI memory (HBM), strengthen foundry/packaging, and gain traction in the stable analog/power IC market, boosting profitability and global influence.