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STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

STMicroelectronics Releases USB PD Sink Controller With Hybrid Mode

The new USB Power Delivery sink controller combines hardwired USB-PD operation with a patented hybrid mode to simplify full-feature USB-C sink designs with minimal firmware.


News Feb 10, 2026 by Austin Futrell
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson
Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

Toshiba Debuts ‘Advanced Microstep Technology’ in New Motor Drivers

The new stepper motor driver adds advanced microstep control to reduce noise, vibration, and power consumption in compact motor systems.


News Feb 09, 2026 by Joshua Tidwell
Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Blecon Debuts Software Agent Linking Zebra Devices to Bluetooth Tracking

Announced today, the new solution leverages existing hardware to expand the range of logistics tracking systems.


News Feb 09, 2026 by Jeff Child
Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot

Second-Order Type-2 PLLs: Bode Diagrams, Bandwidth, and Overshoot

Learn how to select the zero frequency, damping factor, and loop bandwidth for one of the most popular PLL configurations.


Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors | New Product Brief

Bourns SSD Shunt Current Sensors are high-precision, 24-bit isolated sensing solutions engineered for the rigorous demands of modern power management. Watch and learn all about their features, specs, applications, and more!


Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.


IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

IBM & Ansys Detail Results From DARPA Thermonat Thermal Modeling Program

The research program aims to improve heat-prediction accuracy at the nanoscale while reducing simulation time for advanced semiconductor design.


News Feb 04, 2026 by Luke James
AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.


News Feb 04, 2026 by Jake Hertz
Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi Introduces Its First HAT Product for Generative AI

Raspberry Pi's new AI HAT+ 2 adds higher-performance neural acceleration and memory support to extend generative workloads on Raspberry Pi 5.


News Feb 03, 2026 by Jake Hertz
Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets | New Product Brief

Phoenix Contact E-Mobility CHARX Charge Inlets provide a high-power, versatile charging interface for electric and plug-in hybrid vehicles, supporting both continuous currents up to 250A and temporary boosts up to 500A. Watch and learn all about their features, specs, applications, and more!


ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST says its new microprocessors balance application-class performance, real-time control, and power management.


News Feb 03, 2026 by Jake Hertz
Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation

Syslogic Reveals GNSS Expansion Board for Centimeter-Accurate Navigation

The add-on board, based on U-blox's X20, brings all-band GNSS, RTK, and HAS-ready corrections to Syslogic's embedded platforms.


News Feb 02, 2026 by Luke James
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Introduction to Second-Order Type-2 PLLs

Introduction to Second-Order Type-2 PLLs

This article explains how Type-2 PLLs with an integrator loop filter outperform Type-1 systems. To do so, we'll examine the PLL behavior for frequency step and frequency ramp inputs.


Modular Architecture: The Key to Reliable EV Charging Infrastructure

Modular Architecture: The Key to Reliable EV Charging Infrastructure

Learn how modular design principles contribute to EV charger reliability, scalability, and maintenance for engineers planning charging networks.


Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev

The new toolkit integrates with Keysight’s device modeling software to automate parameter extraction and shorten compact-model and PDK development cycles.


News Jan 30, 2026 by Luke James
Intel’s 2716 and 2732: The EPROMs That Put Firmware on a Single 5 V Rail

Intel’s 2716 and 2732: The EPROMs That Put Firmware on a Single 5 V Rail

Intel’s 2716 and 2732 took UV EPROMs from “power-supply problem” to practical, socketable firmware for mainstream 8-bit and early 16-bit designs.


News Jan 30, 2026 by Luke James