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How Neuromorphic Chips are Revolutionizing the Edge

How Neuromorphic Chips are Revolutionizing the Edge

Neuromorphic Edge AI chips mark a fundamental departure from traditional silicon, utilizing brain-inspired, event-driven architectures to enable real-time inference within milliwatt-level power budgets.


Rebellions: The Korean Company to Watch in 2026?

Rebellions: The Korean Company to Watch in 2026?

Learn how Korean AI technology company Rebellions uses proprietary dataflow NPUs, chiplets, and HBM to deliver high-efficiency, scalable AI inference for modern data centers.


News Apr 27, 2026 by Gordon Feller
More Control, Less Chaos With Microchip’s New All-in-One DSCs

More Control, Less Chaos With Microchip’s New All-in-One DSCs

Microchip’s new digital signal controllers integrate high-resolution control, high-speed analog, and post-quantum cryptography.


News Apr 24, 2026 by Joshua Tidwell
Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Mesh AI: Node-Level Intelligence with Non-Cellular 5G/6G Connectivity

Learn how LM Semi's Mesh AI platform delivers autonomous, secure, node-level intelligence via non-cellular NR+ mesh networks, addressing AI scalability for billions of devices.


News Apr 17, 2026 by Gordon Feller
Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

Infineon Reveals End-to-End Upgrades of Its Power and Sensing Portfolio

The company’s latest silicon, silicon carbide, and gallium nitride solutions offer a complete power conversion chain from the grid to the processor for AI data centers.


News Apr 16, 2026 by Jake Hertz
Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Indie Semiconductor Releases First Commercial UV DFB Laser at 399 nm

Geared for quantum systems, Indie engineered the narrow-linewidth laser engineered for ytterbium atom cooling, which eliminates the need for external optical stacks.


News Apr 14, 2026 by Luke James
EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

EW ‘26 Exclusive—Nuvoton Talks MCUs: Low-Power, Edge AI, Automotive, and More

We spoke to Nuvoton’s Walter Tseng in this exclusive Embedded World 2026 interview. Our focus was all things microcontrollers, ranging from low power to Edge AI to automotive MCUs.


News Apr 13, 2026 by Jeff Child
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 2

Learn how The Netherlands is leveraging billion-euro investments and European partnerships to scale integrated photonics from research into a world-leading, industrially mature production ecosystem.


News Apr 10, 2026 by Gordon Feller
Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

Navitas Skips 48 V Bus in 800 V-to-6 V GaN PDB for AI Racks

GaN-based power delivery board targets 96.5% efficiency and 2,100 W/in3 for NVIDIA's next-generation 800 VDC data center architecture.


News Apr 09, 2026 by Luke James
Decisions Ahead for the Next Generation of Advanced Packaging

Decisions Ahead for the Next Generation of Advanced Packaging

Advanced packaging is at a crossroads due to AI demand. Learn the four emerging paths—CoWoS, CoPoS, glass-core, and CoWoP—and how to choose the right one for your multi-die system design.


EU’s European Investment Bank Meets the Unique Needs of Semiconductors

EU’s European Investment Bank Meets the Unique Needs of Semiconductors

Learn how the EU's premier lending institution is deploying billions in loans, equity, and blended finance to build a sovereign European chip ecosystem.


News Apr 07, 2026 by Gordon Feller
High-Speed Server and Data Center Connectivity with Stewart Connector QSFP-DD Solutions | Tech Guide

High-Speed Server and Data Center Connectivity with Stewart Connector QSFP-DD Solutions | Tech Guide

In this Tech Guide, learn how Stewart Connector QSFP-DD solutions enable 400G data center connectivity, covering signal integrity, thermal management, EMI control, and integration tips for high-speed servers, switches, and HPC systems. Watch now to get started!


Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

Arm Releases First-Ever Silicon Product to Solve Agentic AI Challenges

In a landmark moment in its 35-year history, Arm has debuted its own silicon product, the AGI CPU, built on the Arm Neoverse platform.


News Apr 02, 2026 by Jake Hertz
For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

For the Netherlands, Photonics Initiatives Secure Global Leadership—Part 1

The Netherlands is securing global leadership in integrated photonics, a technology using light instead of electricity for faster, more energy-efficient data processing, essential for AI, healthcare, and mobility.


News Apr 02, 2026 by Gordon Feller
Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

Lumotive Debuts ‘World’s First 2D Photonic Beamforming Chip’

The startup's programmable chip uses a metasurface architecture to control light without moving parts.


News Apr 01, 2026 by Luke James
5 Light-Based Technologies Reshaping Computing and Sensing

5 Light-Based Technologies Reshaping Computing and Sensing

Researchers push the boundaries of photonic devices, opening new frontiers in AR, structural monitoring, and quantum applications.


News Mar 31, 2026 by Luke James
Nordic Rains IoT Products at Embedded World and MWC 2026

Nordic Rains IoT Products at Embedded World and MWC 2026

At the shows, Nordic debuted new cellular platforms, entry-level Bluetooth LE SoCs, and an edge-AI-enabled wireless chip.


News Mar 27, 2026 by Joshua Tidwell
4 Standout Microcontrollers From Embedded World 2026

4 Standout Microcontrollers From Embedded World 2026

These devices are redefining what an MCU can do in the age of edge AI, advanced connectivity, and software-defined vehicles.


News Mar 23, 2026 by Duane Benson
At Embedded World, Renesas 365 Advances to General Availability Phase

At Embedded World, Renesas 365 Advances to General Availability Phase

The Renesas 365 Development platform unifies electronics design from MCU recommendation to validation.


News Mar 20, 2026 by Duane Benson
Siemens Adds Agentic AI to Questa One to Speed IC Design

Siemens Adds Agentic AI to Questa One to Speed IC Design

A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.


News Mar 17, 2026 by Jake Hertz