All About Circuits

Latest AI/Neural Networks Articles and Videos

Categories

Siemens Adds Agentic AI to Questa One to Speed IC Design

Siemens Adds Agentic AI to Questa One to Speed IC Design

A new human-centered toolkit includes goal-driven autonomous agents within established verification environments.


News Mar 17, 2026 by Jake Hertz
NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP Launches Tiny Applications Processor Blending AI NPU and Tri-Radio

NXP claims that this device represents the first time an applications processor has combined a dedicated AI NPU with tri-radio wireless connectivity.


News Mar 17, 2026 by Jake Hertz
Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Ventuno Q: The First Fruit of the Arduino-Qualcomm Acquisition Targets AI

Six months after acquiring Arduino, Qualcomm goes big by adding the Dragonwing IQ-8275 AI processor to Arduino's platform.


News Mar 16, 2026 by Duane Benson
AI-RAN: The Technology Pushing Mobile Networks Toward AI-Native 6G

AI-RAN: The Technology Pushing Mobile Networks Toward AI-Native 6G

AI-RAN integrates AI workloads directly into cellular network infrastructure. Industry leaders, including Nvidia, Nokia, Ericsson, Intel, Keysight, and Samsung, are now collaborating to move the concept from research toward real-world deployment.


News Mar 16, 2026 by Austin Futrell
MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

MediaTek Expands Genio SoC Line to Target AI to IoT, Robotics, and More

Announced at Embedded World, the new Genio lineup spans value to flagship tiers, with on-device GenAI acceleration ranging from 6 TOPS to over 50 TOPS.


News Mar 16, 2026 by Luke James
Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware

Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.


News Mar 12, 2026 by Jake Hertz
Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries

Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.


News Mar 11, 2026 by Joshua Tidwell
Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Synaptics Redefines Edge IoT with ‘First AI-Native Wi-Fi 7 Connectivity Solution for IoT’

Announced today at Embedded World, Synaptics claims the SYN765x as the first industry's first AI Native Wi-Fi 7 solution developed specifically for the IoT. It provides Wi-Fi 7, Bluetooth 6.0, and 802.15.4 connectivity and features a Cortex-M52 and Ethos-U55 NPU.


News Mar 10, 2026 by Jake Hertz
Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Intel Rolls Out Industrial Edge AI Processors and Healthcare AI Suite

Announced today at Embedded World, the new Core Series 2 may accelerate the industrial edge and real-time applications, while the healthcare suite may help providers meet the challenges of patient care using edge AI.


News Mar 09, 2026 by Duane Benson
Menlo Micro Announces Configurable Switch for Semiconductor Testing

Menlo Micro Announces Configurable Switch for Semiconductor Testing

The company claims the MEMS switch is in a league of its own, replacing mechanical and solid-state relays in high-speed semiconductor test equipment.


News Mar 03, 2026 by Duane Benson
SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix Details Low-Power DDR6 SDRAM at ISSCC 2026

SK Hynix's new LPDDR6 SDRAM exhibits five key innovations to improve performance, reduce power consumption, and increase reliability.


News Feb 26, 2026 by Duane Benson
ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

ElastixAI Emerges From Stealth With FPGA Approach to Gen AI Supercomputing

In this exclusive interview, the Seattle startup says its software-ML-hardware co-design—announced today—converts off-the-shelf FPGA servers into high-efficiency AI inference engines.


News Feb 25, 2026 by Luke James
New Materials Target Interconnect Performance and On-Chip Photonics

New Materials Target Interconnect Performance and On-Chip Photonics

New research explores ultra-low-k COF dielectrics, screens topological conductors for nanoscale wires, and reveals high-pressure hexagonal GeSn alloys.


News Feb 24, 2026 by Luke James
TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

TI to Acquire Silicon Labs, Plus Other News in the Semiconductor World

A cluster of early February deals pulled wireless MCUs, clocking IP, analog sensors, and AI-driven inspection software into larger platforms spanning IoT, automotive, industrial, and semiconductor manufacturing.


News Feb 17, 2026 by Luke James
STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration

The new MCU includes a dedicated neural processor and phase-change memory to boost performance in X-in-1 architectures.


News Feb 17, 2026 by Jake Hertz
Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Thermal Research Roundup: New Ways to Store, Move, and Control Heat

Researchers are advancing materials and device concepts that treat heat as something that can be stored, directed, or actively managed, rather than merely dissipated.


News Feb 11, 2026 by Luke James
Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Cadence Unwraps Agentic AI Super Agent for Chip Design and Verification

Announced today, the new ChipStack AI Super Agent from Cadence automates front end silicon design and verification, delivering a 10X productivity increase.


News Feb 10, 2026 by Duane Benson
Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation—Literally Cutting Edge—Is Gaining More Importance for Wafer Fabs

Singulation (wafer dicing) is critical for IC wafer manufacturing. Laser/plasma dicing is replacing mechanical methods. Lidrotec's laser-liquid technology offers virtually zero-damage cuts.


News Feb 06, 2026 by Gordon Feller
Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

Microsoft Rolls Out Next Inference Accelerator to Boost AI in Azure

The company devised the new Maia 200 inference accelerator to improve cost and performance for AI inference processing in Azure Cloud Services.


News Feb 05, 2026 by Duane Benson
Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Breaking the Thermal Wall Using Monolithic Ceramic Cooling for Power Electronics

Learn how monolithic ceramic cooling using Selective Laser Reaction Sintering (SLRS) eliminates the "thermal wall" in high-density power electronics by creating single-piece, reliable heat exchangers.