Ready to design more secure devices but not sure where to start? Learn about Diffie-Hellman cryptography in this technical article.
Ready to design more secure devices but not sure where to start? Learn about Diffie-Hellman cryptography in this technical article.
A new display from Mojo Vision is just 0.48mm across, smaller than a grain of sand. What, exactly, is it for?
A new display from Mojo Vision is just 0.48mm across, smaller than a grain of sand. What, exactly, is it for?
This article will introduce the Advanced Microcontroller Bus Architecture (AMBA), an open standard for SoC designs.
This article will introduce the Advanced Microcontroller Bus Architecture (AMBA), an open standard for SoC designs.
ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.
ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.
Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.
Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.
How do processors access memory? Learn more about structures in C language and how to use them.
How do processors access memory? Learn more about structures in C language and how to use them.
In this article, we explain how the use of open-source functional simulators like Antmicro’s Renode can be an integral…
In this article, we explain how the use of open-source functional simulators like Antmicro’s Renode can be an integral part of hardware-software co-design efforts.
Microchip’s SAMA5D2 Xplained Ultra evaluation kit is a fast prototyping and development platform for the SAMA5D2 series…
Microchip’s SAMA5D2 Xplained Ultra evaluation kit is a fast prototyping and development platform for the SAMA5D2 series of microprocessors.
The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.
The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.
At APEC 2019, Renesas highlighted new PMBus DC-DC power modules.
At APEC 2019, Renesas highlighted new PMBus DC-DC power modules.
Tiny DC-DC converters with highest power density point-of-load, work with a wide variety of applications.
Tiny DC-DC converters with highest power density point-of-load, work with a wide variety of applications.
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.
Micron Multichip Packages provide designers multiple types of high-performance memory in a single package.
This article will discuss the details of interfacing a 16x2 LCD module with an MCU.
This article will discuss the details of interfacing a 16x2 LCD module with an MCU.
This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).
This week, Adesto Technologies introduced its new FusionHD non-volatile memories (NVMs).
Let's look back at the last year in AI and forward to what may be in store for 2019.
Let's look back at the last year in AI and forward to what may be in store for 2019.
NXP Semiconductor’s i.MX RT1060 Crossover Processor can be used in a wide range of applications from professional…
NXP Semiconductor’s i.MX RT1060 Crossover Processor can be used in a wide range of applications from professional audio, consumer products, home, and building automation to motor control, power conversion, and industrial computing.
Omron Electronics 2JCIE-BL01-P1 sensor development kit combines sensors, wireless connectivity, and onboard memory for…
Omron Electronics 2JCIE-BL01-P1 sensor development kit combines sensors, wireless connectivity, and onboard memory for environmental monitoring in smart homes, offices, and many other environments.
Get a primer on the basics of supercapacitors, their functionality, and which applications they're best for.
Get a primer on the basics of supercapacitors, their functionality, and which applications they're best for.
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
Toshiba Memory America has unveiled new embedded flash memory devices that utilize the UFS Version 3.0 specification.
In this article, the engineering team at Promwad examines hybrid memory cubes (HMCs), which can provide a 15-fold…
In this article, the engineering team at Promwad examines hybrid memory cubes (HMCs), which can provide a 15-fold increase in performance with up to a 70% energy savings per bit compared to DDR3 DRAM.
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