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MagnaChip Announces Its 0.35 Micron, 700V Process Technology

MagnaChip Announces Its 0.35 Micron, 700V Process Technology

The new ultra-high-voltage technology aims to reduce the size of MagnaChip's UHV nLDMOS devices by 30%.


News Aug 13, 2019 by Gary Elinoff
Executing Commands in Memory: DRAM Commands

Executing Commands in Memory: DRAM Commands

This article will take a closer look at the commands used to control and interact with DRAM.


Flash Memory Summit 2019: What You Need to Know

Flash Memory Summit 2019: What You Need to Know

This week is the 14th annual Flash Memory Summit, a conference focused on memory.


News Aug 07, 2019 by Gary Elinoff
Toshiba Memory Releases New NVMe Device Form Factor for “Ultra-Mobile” and Embedded Applications

Toshiba Memory Releases New NVMe Device Form Factor for “Ultra-Mobile” and Embedded Applications

Toshiba Memory has just announced a tiny, fast new memory form factor.


News Aug 06, 2019 by Jennifer DeLaOsa
Introduction to DRAM (Dynamic Random-Access Memory)

Introduction to DRAM (Dynamic Random-Access Memory)

This article will examine the basic operation of Dynamic Random Access Memory (DRAM), along with how a DRAM chip is organized.


Secure Microcontrollers Address IoT Security

Secure Microcontrollers Address IoT Security

Security is increasingly something EEs need to be cognizant of in their component choices. Here's an overview of three secure microcontrollers.


News Jul 23, 2019 by Gary Elinoff
Why Raspberry Pi Isn’t a Good Choice for Commercial Products

Why Raspberry Pi Isn’t a Good Choice for Commercial Products

RPi has done some amazing good in the world, especially for aspiring young engineers, but here's the breakdown on why it's probably not what you need for a professional project.


The University of Michigan has Developed a Computer Based on the Memristor

The University of Michigan has Developed a Computer Based on the Memristor

AI on a smartphone? U of M researchers open the door to localized AI processing, even on portable devices.


News Jul 17, 2019 by Gary Elinoff
Principles of Cache Design

Principles of Cache Design

This article will examine principles of CPU cache design including locality, logical organization, and management heuristics.


Open Memory-Centric Architectures Enabled by RISC-V and OmniXtend

Open Memory-Centric Architectures Enabled by RISC-V and OmniXtend

This article discusses technologies for memory-centric computing and introduces OmniXtend, a cache coherence protocol.


CHIPS Alliance Brings Powerful Players into Open Source Hardware Collaboration

CHIPS Alliance Brings Powerful Players into Open Source Hardware Collaboration

Will open source hardware become as ubiquitous as open-source software, such as Linux and Android?


News Jul 08, 2019 by Gary Elinoff
The Diffie-Hellman Exchange in Embedded Cryptography

The Diffie-Hellman Exchange in Embedded Cryptography

Ready to design more secure devices but not sure where to start? Learn about Diffie-Hellman cryptography in this technical article.


Tiny MicroLED Display from Mojo Vision Features Highest-Yet Pixel Density—But for What Applications?

Tiny MicroLED Display from Mojo Vision Features Highest-Yet Pixel Density—But for What Applications?

A new display from Mojo Vision is just 0.48mm across, smaller than a grain of sand. What, exactly, is it for?


News Jun 08, 2019 by Gary Elinoff
The Advanced Microcontroller Bus Architecture: An Introduction

The Advanced Microcontroller Bus Architecture: An Introduction

This article will introduce the Advanced Microcontroller Bus Architecture (AMBA), an open standard for SoC designs.


STMicroelectronics Unveils the STM32G4 Series of Microcontrollers

STMicroelectronics Unveils the STM32G4 Series of Microcontrollers

ST's new MCUs target applications in e-mobility, digital power supplies, motor control, lighting, and building automation.


News May 30, 2019 by Gary Elinoff
“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

“Extend Beyond Moore’s Law”: Xperi Unveils New Semiconductor Wafer Bonding Technology

Watch out, Moore's Law. Growing demands on memory have pushed semiconductor companies to pack more onto chips.


News May 27, 2019 by Gary Elinoff
Understanding Memory: How to Use Structures in Embedded C Language

Understanding Memory: How to Use Structures in Embedded C Language

How do processors access memory? Learn more about structures in C language and how to use them.


Decreasing the Length of Design Cycle in Co-Designed SoCs with Renode

Decreasing the Length of Design Cycle in Co-Designed SoCs with Renode

In this article, we explain how the use of open-source functional simulators like Antmicro’s Renode can be an integral part of hardware-software co-design efforts.


SAMA5D2C Xplained Ultra Evaluation Board | Digital Datasheet

SAMA5D2C Xplained Ultra Evaluation Board | Digital Datasheet

Microchip’s SAMA5D2 Xplained Ultra evaluation kit is a fast prototyping and development platform for the SAMA5D2 series of microprocessors.


Popular Toshiba Flash Memory Platform Now Qualified for Automotive Applications

Popular Toshiba Flash Memory Platform Now Qualified for Automotive Applications

The new devices adhere to the tough AEC-Q100 Grade2 standard and range from 32GB to 256GB capacity.


News Mar 27, 2019 by Gary Elinoff