Built on 22 nm RF-CMOS and optimized for AI-based sensing, the new radar SoCs take aim at next-generation ADAS performance.
Built on 22 nm RF-CMOS and optimized for AI-based sensing, the new radar SoCs take aim at next-generation ADAS performance.
The new battery fuel gauges use Dynamic Z-Track technology to offer up to 30% longer run times in battery-powered devices.
The new battery fuel gauges use Dynamic Z-Track technology to offer up to 30% longer run times in battery-powered devices.
Diodes Incorporated has announced two new ideal diode controllers with a wide input voltage range, low quiescent current,…
Diodes Incorporated has announced two new ideal diode controllers with a wide input voltage range, low quiescent current, and overvoltage lockout protection.
Indie is aiming the stable, narrow-linewidth laser at scalable quantum computing and secure communications applications.
Indie is aiming the stable, narrow-linewidth laser at scalable quantum computing and secure communications applications.
The merger combines Synopsys’ EDA dominance with Ansys’ multiphysics simulation expertise, promising a new era of…
The merger combines Synopsys’ EDA dominance with Ansys’ multiphysics simulation expertise, promising a new era of co-optimized chip and system design.
The family brings 18-channel monitoring and SPI-to-TPL bridge to electric vehicle and energy storage applications.
The family brings 18-channel monitoring and SPI-to-TPL bridge to electric vehicle and energy storage applications.
Hailo-10H launch arrives as the edge AI accelerator market is projected to grow from $10.13 billion in 2025 to $113.71…
Hailo-10H launch arrives as the edge AI accelerator market is projected to grow from $10.13 billion in 2025 to $113.71 billion by 2034, driven by the demand for privacy-first, low-latency AI processing.
The updated features of the low-power devices may give developers new ways to address the stringent thermal,…
The updated features of the low-power devices may give developers new ways to address the stringent thermal, connectivity, and size constraints of their designs.
The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
The MT72xx family combines high EMC resilience and functional safety with a two-wire interface.
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical…
Major players are reshaping the semiconductor map: TSMC exits GaN, Infineon scales it up, GlobalFoundries goes vertical with MIPS, and TI backs U.S. fabs with $60B.
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors,…
Vishay, TDK, and Murata have debuted space-saving passives: ultra-high-frequency chip resistors, high-current inductors, and the "world’s smallest" 10 µF/50V MLCC for cars.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
New releases from Siglent, Rohde & Schwarz, and Liquid Instruments bring new features to the T&M marketplace.
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other…
The BD1423xFVJ-C and BD1422xG-C series current sense amplifiers offer design simplicity for electric vehicle and other automotive systems.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
The new SMP290 sensor integrates Bluetooth Low Energy to simplify vehicle electronics and extend sensor lifespan.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
New connector launches from JAE, Phillips Medisize, and Harwin enable safer, smaller, and smarter designs across industries.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
Announced today, the new IMU brings a cost-optimized, high-temperature solution to in-cabin automotive applications.
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and…
The device's multipath architecture—a first of its kind—accelerates signal analysis using multiple inputs and cross-correlation.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
Launching today, the organization aims to make GMSL technology a standard for automotive connectivity.
Launching today, the organization aims to make GMSL technology a standard for automotive connectivity.
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