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AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

AMD Intros Mid-Range FPGAs Targeting Intelligent, High-Performance Designs

Announced today, the new FPGAs build off of AMD’s existing ecosystem with modernized memory, I/O, and security.


News Feb 04, 2026 by Jake Hertz
ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST Rolls Out Low-Power, Cost-Efficient Versions of STM32 MPUs

ST says its new microprocessors balance application-class performance, real-time control, and power management.


News Feb 03, 2026 by Jake Hertz
Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

Microchip Intros Touchscreen ICs for Broader Automotive Display Size Ranges

The expanded maXTouch M1 family delivers reliable capacitive sensing from compact automotive displays to ultra-wide free-form screens.


News Feb 02, 2026 by Jake Hertz
Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Semiconductor Fabs Announce New Plans to Rebalance Capacity and Control

Recent fab announcements highlight how manufacturers are translating long-term roadmaps into physical capacity.


News Jan 29, 2026 by Luke James
MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

MIPS Takes ‘Software-First Approach’ With New RISC-V NPUs

The most recent addition to the MIPS Atlas family of RISC-V processors supports transformer- and agentic-language AI models at the edge.


News Jan 27, 2026 by Austin Futrell
Understanding the PDK Generation Process

Understanding the PDK Generation Process

In this article, we'll walk through the steps of generating a Process Design Kit (PDK) for digital standard cell libraries.


Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio

Announced today, Cadence's new Tensilica HiFi iQ DSP doubles compute, octuples AI performance, and cuts power by 25% over its predecessor, targeting next-gen AI-voice and immersive automotive audio.


News Jan 21, 2026 by Duane Benson
How Brain-Inspired Hardware Is Learning to Scale

How Brain-Inspired Hardware Is Learning to Scale

While brain-inspired computing and neural interfaces have long promised transformative advances, scaling those systems has remained a challenge. New research suggests that the barrier is beginning to fall.


News Jan 20, 2026 by Austin Futrell
Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Qualcomm Brings AI Compute to PCs, Robots, and Vehicles at CES

Four CES announcements show Qualcomm pushing the same idea across categories: move more AI and control loops onto efficient, tightly integrated edge platforms.


News Jan 13, 2026 by Luke James
Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

Texas Instruments Intros New SoC Family at CES to Scale Automotive AI

All About Circuits met with Texas Instruments at CES 2026 to learn about the company’s newest automotive SoCs.


News Jan 12, 2026 by Jake Hertz
Ceva Expands Edge AI Portfolio From Wearables to SDVs

Ceva Expands Edge AI Portfolio From Wearables to SDVs

At CES 2026, All About Circuits met with Ceva to learn about its latest hardware releases and collaborations driving the future of edge AI.


News Jan 12, 2026 by Jake Hertz
Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

Broadcom Intros Wi-Fi 8 Chipset and AI Processor for Smart Homes

The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.


News Jan 12, 2026 by Luke James
Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

Exclusive—TSMC Enlightens Us About Its Next Steps in This Q&A

In this article, Gordon posed a set of questions to TSMC about their next steps going forward.


News Jan 09, 2026 by Gordon Feller
MIT Flips the Challenges of Chip Stacking On Its Head

MIT Flips the Challenges of Chip Stacking On Its Head

Low-temperature BEOL transistors and memory elements aim to cut data-movement energy in AI workloads.


News Jan 08, 2026 by Luke James
AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

AI Chip Race Heats Up With Intel, Nvidia, and AMD’s CES Debuts

The industry's biggest chipmakers came to CES with processors that will shape the future of AI PCs, data center computing, and embedded AI.


News Jan 08, 2026 by Duane Benson
Design Wins: Four Designs Rethink Compute, Power, and Integration

Design Wins: Four Designs Rethink Compute, Power, and Integration

This four-product roundup highlights new hardware platforms for spaceborne AI, EV power, wireless sensing, and private 5G.


News Jan 07, 2026 by Joshua Tidwell
The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era

The Countdown: Preparing Manufacturing Systems for the Post-Quantum Era

Decades of captured data and IP face future exposure from harvest-now, decrypt-later attacks. Products and systems built today need quantum-resistant security integrated from design through deployment.


NXP Ushers Agentic AI to the Edge with New AI Development Tools

NXP Ushers Agentic AI to the Edge with New AI Development Tools

Announced today at CES, the new tools focus on inference-first deployment to embedded processors rather than retrofitting cloud-native workflows.


News Jan 06, 2026 by Jake Hertz
NXP Makes Its CES Reveal: A Central Compute Platform for Smart Vehicles

NXP Makes Its CES Reveal: A Central Compute Platform for Smart Vehicles

Announced today, the new real-time, super-integration processor is the next step in NXP’s automotive processing platform.


News Jan 05, 2026 by Jake Hertz
The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

The New Moore’s Law: Why Optical Computing Could Redefine Scaling for AI

Optical computing is the "New Moore's Law" for AI. It solves electronic scaling limits, offering higher speed, lower power, and efficiency gains proportional to problem size for matrix operations.