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The Impact of Non-Terrestrial Networks on Current and Future Global Connectivity

The Impact of Non-Terrestrial Networks on Current and Future Global Connectivity

This article looks at the current status and likely direction of non-terrestrial networks (NTNs), with a focus on practical considerations for early adopters of this new technology.


Zero ASIC Develops First-Ever Open Standard eFPGA Product

Zero ASIC Develops First-Ever Open Standard eFPGA Product

Zero ASIC says its approach standardizes an eFPGA architecture in the same way that RISC-V did for CPUs and JEDEC did for memory.


News Mar 31, 2025 by Luke James
How RISC-V Enables Shift-Left Practices for Securing Embedded Systems

How RISC-V Enables Shift-Left Practices for Securing Embedded Systems

RISC-V’s open architecture enables a shift-left approach to security in embedded systems. Learn how it smooths the way for integrating security features and more early in the development cycle.


Exclusive Interview—AMD Discusses Edge AI, Embedded x86, Adaptive SoCs, and More

Exclusive Interview—AMD Discusses Edge AI, Embedded x86, Adaptive SoCs, and More

In this exclusive Embedded World 2025 interview, we talk to AMD’s Kirk Saban about edge AI, ASICs vs. FPGAs, Adaptive SoCs, embedded x86, and the outlook ahead.


News Mar 21, 2025 by Jeff Child
TI Nods to Smaller, More Efficient Satellites With GaN FET Gate Driver

TI Nods to Smaller, More Efficient Satellites With GaN FET Gate Driver

With options ranging from 22 V to 200 V, the radiation-hardened gate drivers can bolster power system efficiency for any space mission.


News Mar 15, 2025 by Charles Lee
Skywater Unwraps CMOS Platform Aimed at Thermal Imaging Designs

Skywater Unwraps CMOS Platform Aimed at Thermal Imaging Designs

The new ThermaView suite supports hybridized focal plane arrays (FPAs) and monolithically fabricated microbolometer FPAs for uncooled imaging.


News Feb 11, 2025 by Arjun Nijhawan
Business Shorts: Partnerships Advancing 5G, ASIC Design, and More

Business Shorts: Partnerships Advancing 5G, ASIC Design, and More

In this edition of Business Shorts, Altium acquires Part Analytics, Keysight opens a 6G research lab, and Siemens throws its support behind budding startups.


News Feb 10, 2025 by Luke James
Research Shorts: 5 Studies Make Headway in Lasers, Antennas, and Beyond

Research Shorts: 5 Studies Make Headway in Lasers, Antennas, and Beyond

From tunable metamaterials inspired by chameleons to radiation-resistant organic solar cells, these discoveries address critical challenges in fields like defense, space exploration, communication, and manufacturing.


News Feb 03, 2025 by Luke James
Microchip Designs Compact Low-Noise Atomic Clock Device for Defense

Microchip Designs Compact Low-Noise Atomic Clock Device for Defense

The new solution merges the benefits of a crystal oscillator and an atomic clock into one uniform package.


News Jan 30, 2025 by Jake Hertz
Amphenol LTD RAPTOR Connectors | New Product Brief

Amphenol LTD RAPTOR Connectors | New Product Brief

Amphenol LTD RAPTOR Connectors are designed for high-voltage, high-current systems, offering exceptional durability and performance for applications like e-flight, electric vertical take-off and landing (e-VTOL), and hybrid systems. Watch and learn all about their features, specs, applications, and more!


AMD Reveals Adaptive SoCs With RF Conversion and 80 TOPS DSP

AMD Reveals Adaptive SoCs With RF Conversion and 80 TOPS DSP

Announced today, the new series integrates RF-sampling converters and high-performance compute on a single chip.


News Dec 10, 2024 by Jake Hertz
Infineon Rolls Out Rad-Hard 512 Mbit NOR Flash Memory for Space Designs

Infineon Rolls Out Rad-Hard 512 Mbit NOR Flash Memory for Space Designs

Infineon says the new solution is an industry first for radiation-hardened NOR Flash.


News Dec 02, 2024 by Jake Hertz
A Glimpse at a Morning in Electronica’s Test and Measurement Hall

A Glimpse at a Morning in Electronica’s Test and Measurement Hall

During a morning at Electronica's Hall A3, we visited numerous booths to learn about new instruments for an engineer's toolbox. Here are three highlights.


News Nov 26, 2024 by Duane Benson
Sciosense Launches Two-Channel Time-to-Digital Converter for LiDAR

Sciosense Launches Two-Channel Time-to-Digital Converter for LiDAR

Announced at Electronica last week, the TDC solution offers higher integration and improved performance for single-beam LiDAR.


News Nov 20, 2024 by Jake Hertz
Introduction to Modulation Techniques in RF Systems

Introduction to Modulation Techniques in RF Systems

In this article, we discuss the basics of RF modulation and how it affects the performance of communication systems.


Siemens Unwraps Electronic Systems Design Software With AI Enhancements

Siemens Unwraps Electronic Systems Design Software With AI Enhancements

The new release upgrades Xpedition, Hyperlynx, and PADS Professional with an integrated design flow and collaborative user experience.


News Nov 13, 2024 by Duane Benson
Unlocking New Frontiers in Space Applications with Off-the-Shelf Edge AI Processors

Unlocking New Frontiers in Space Applications with Off-the-Shelf Edge AI Processors

Learn how government space experts are re-evaluating radiation environments and identifying commercial electronics, including new edge AI co-processors, that can meet the mission requirements of future missions.


Microchip Fortifies 64-bit MPUs for ‘Post-Quantum Security’

Microchip Fortifies 64-bit MPUs for ‘Post-Quantum Security’

Microchip tapped SiFive's RISC-V CPUs for its new mission-critical processors.


News Oct 22, 2024 by Jake Hertz
Amphenol / SV Microwave D38999 High-Frequency Coaxial Contacts | New Product Brief

Amphenol / SV Microwave D38999 High-Frequency Coaxial Contacts | New Product Brief

Amphenol / SV Microwave D38999 High-Frequency Coaxial Contacts provide exceptional electrical performance from DC to 65GHz, making them ideal for demanding applications in military and aerospace embedded systems. Watch and learn all about their features, specs, applications, and more!


Infineon Makes First 300mm Power GaN Wafer With Existing Manufacturing Tools

Infineon Makes First 300mm Power GaN Wafer With Existing Manufacturing Tools

The 300-mm gallium nitride (GaN) wafer production will bend the cost curve for power-dense, wide-bandgap devices, bringing them closer to cost parity with silicon.


News Sep 17, 2024 by Mike Falter