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OKI Reaches New Heights With a 124-Layer PCB

OKI Reaches New Heights With a 124-Layer PCB

The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.


News May 09, 2025 by Luke James
Intel and AMD CPUs Prove Interoperable With Marvell’s CXL Portfolio

Intel and AMD CPUs Prove Interoperable With Marvell’s CXL Portfolio

Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.


News May 08, 2025 by Duane Benson
Rugged, Fast, and Flexible: New Connectors Tackle Tough Environments

Rugged, Fast, and Flexible: New Connectors Tackle Tough Environments

Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.


News May 08, 2025 by Joshua Tidwell
‘Cameras Today Are Almost Blind’: Startup Eyeo Provides ‘Perfect Sight’

‘Cameras Today Are Almost Blind’: Startup Eyeo Provides ‘Perfect Sight’

Announced today, Eyeo’s new optical waveguides separate colors for digital camera sensors without lossy filters, promising to make image sensors three times more sensitive.


News May 07, 2025 by Duane Benson
EDA Companies Throw Support Behind TSMC’s New A14 Process

EDA Companies Throw Support Behind TSMC’s New A14 Process

TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.


News May 06, 2025 by Luke James
Konrad Zuse and the Z1: The Dawn of Programmable Computing

Konrad Zuse and the Z1: The Dawn of Programmable Computing

Zuse's Z1 computer was the first freely programmable computer in the world to use Boolean logic and binary floating point numbers.


News May 05, 2025 by Luke James
Microchip Beefs Up Its AI Data Center Technology Offerings

Microchip Beefs Up Its AI Data Center Technology Offerings

Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.


News May 05, 2025 by Jake Hertz
Kawasaki Uses Hydrogen to Create Serious ‘Horse’-Power

Kawasaki Uses Hydrogen to Create Serious ‘Horse’-Power

The manufacturer envisions a rideable, hydrogen-powered robotic horse. Is this back to the future?


News May 02, 2025 by Kevin Clemens
Omnivision Launches 1.5 MP Global Shutter Sensor for Driver Monitoring

Omnivision Launches 1.5 MP Global Shutter Sensor for Driver Monitoring

The OX01N1B image sensor features NIR quantum efficiency and better image quality for in-cabin driver monitoring systems.


News May 02, 2025 by Arjun Nijhawan
Audio Roundup: The Sweet Sound of Miniaturized, Efficient Audio Devices

Audio Roundup: The Sweet Sound of Miniaturized, Efficient Audio Devices

These three audio devices target amplifier efficiency and transducer size to bring higher sound performance in everything from EVs to AI sports glasses.


News May 01, 2025 by Aaron Carman
Happy 40th Birthday to the Arm Architecture

Happy 40th Birthday to the Arm Architecture

Celebrating 40 years of innovation, Arm's architecture has evolved from a simple processor in a British lab to a cornerstone of modern computing.


News May 01, 2025 by Luke James
3 New Inductors Expand Design Flexibility for DC-DC Conversion

3 New Inductors Expand Design Flexibility for DC-DC Conversion

The new inductors strike the sweet spot between performance and efficiency for DC-DC conversion.


News Apr 30, 2025 by Jake Hertz
Rohm Spins High-Power Density SiC Modules for On-Board Chargers

Rohm Spins High-Power Density SiC Modules for On-Board Chargers

With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."


News Apr 29, 2025 by Jake Hertz
NI Connect 2025: Emerson Announces Big Hardware, Software Upgrades to T&M

NI Connect 2025: Emerson Announces Big Hardware, Software Upgrades to T&M

The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a software-defined RF platform.


News Apr 29, 2025 by Duane Benson
Renesas Rolls Out MCUs for Low-Power Designs in Tough Conditions

Renesas Rolls Out MCUs for Low-Power Designs in Tough Conditions

Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.


News Apr 28, 2025 by Joshua Tidwell
JEDEC Officially Releases HBM4 Memory Standard

JEDEC Officially Releases HBM4 Memory Standard

JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.


News Apr 28, 2025 by Luke James
Melexis’ Thermographic Sensor Overcomes Cost and Accuracy Bottlenecks

Melexis’ Thermographic Sensor Overcomes Cost and Accuracy Bottlenecks

Melexis says the new sensor provides direct temperature reporting without a dedicated MCU.


News Apr 25, 2025 by Charles Lee
Solar on Top, Sensors on Bottom: Smart Insole Offers Biometric Insights

Solar on Top, Sensors on Bottom: Smart Insole Offers Biometric Insights

The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis to Parkinson’s disease.


News Apr 25, 2025 by Luke James
ST Outfits Its Automotive MCUs With a Next-Gen Extensible Memory

ST Outfits Its Automotive MCUs With a Next-Gen Extensible Memory

With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.


News Apr 24, 2025 by Jake Hertz
Teledyne FLIR Unveils Starter Kits for Multispectral Infrared Imaging

Teledyne FLIR Unveils Starter Kits for Multispectral Infrared Imaging

With frame rates over 1K FPS, FLIR’s multispectral imaging sensors unify traditional and infrared cameras to provide a pain-free thermal imaging experience.


News Apr 24, 2025 by Aaron Carman