The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Explore the latest connector innovations from Amphenol, Attend, and Hirose, engineered for harsh and high-density applications.
Announced today, Eyeo’s new optical waveguides separate colors for digital camera sensors without lossy filters,…
Announced today, Eyeo’s new optical waveguides separate colors for digital camera sensors without lossy filters, promising to make image sensors three times more sensitive.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate…
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
Zuse's Z1 computer was the first freely programmable computer in the world to use Boolean logic and binary floating point numbers.
Zuse's Z1 computer was the first freely programmable computer in the world to use Boolean logic and binary floating point numbers.
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.
The manufacturer envisions a rideable, hydrogen-powered robotic horse. Is this back to the future?
The manufacturer envisions a rideable, hydrogen-powered robotic horse. Is this back to the future?
The OX01N1B image sensor features NIR quantum efficiency and better image quality for in-cabin driver monitoring systems.
The OX01N1B image sensor features NIR quantum efficiency and better image quality for in-cabin driver monitoring systems.
These three audio devices target amplifier efficiency and transducer size to bring higher sound performance in everything…
These three audio devices target amplifier efficiency and transducer size to bring higher sound performance in everything from EVs to AI sports glasses.
Celebrating 40 years of innovation, Arm's architecture has evolved from a simple processor in a British lab to a…
Celebrating 40 years of innovation, Arm's architecture has evolved from a simple processor in a British lab to a cornerstone of modern computing.
The new inductors strike the sweet spot between performance and efficiency for DC-DC conversion.
The new inductors strike the sweet spot between performance and efficiency for DC-DC conversion.
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a…
The annual NI Connect 2025 conference showcases developments in data acquisition, AI-enhanced LabVIEW, and a software-defined RF platform.
Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for…
Renesas claims the RA0E2 MCUs feature top-tier energy efficiency, thermal reliability, and software compatibility for embedded designs under tight constraints.
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved…
JEDEC’s HBM4 standard delivers up to 2 TB/s bandwidth, higher capacity (up to 64 GB per stack), and improved efficiency for AI and HPC.
Melexis says the new sensor provides direct temperature reporting without a dedicated MCU.
Melexis says the new sensor provides direct temperature reporting without a dedicated MCU.
The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis…
The smart insole combines solar power, pressure sensors, and AI to catch early signs of conditions from plantar fasciitis to Parkinson’s disease.
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution…
With more memory-hungry AI applications around the corner, ST is future-proofing its automotive MCUs with a new solution based on its phase-change memory technology.
With frame rates over 1K FPS, FLIR’s multispectral imaging sensors unify traditional and infrared cameras to provide a…
With frame rates over 1K FPS, FLIR’s multispectral imaging sensors unify traditional and infrared cameras to provide a pain-free thermal imaging experience.