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TI Devises Size-Saving Magnetic Packaging for New Power Modules

TI Devises Size-Saving Magnetic Packaging for New Power Modules

Today Texas Instruments has lifted the curtain on six new DC-DC power supply modules with improved thermal, EMI, and efficiency performance.


News Jul 16, 2024 by Duane Benson
New Sensors Target Smartphones, Industrial, and Automotive Designs

New Sensors Target Smartphones, Industrial, and Automotive Designs

Samsung, Sensry, and Melexis recently announced new sensor technology and collaborations aimed at improving performance, power, and protection.


News Jul 15, 2024 by Arjun Nijhawan
Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.


News Jul 15, 2024 by Darshil Patel
Solid State Battery Material Offers 100x More Energy Density

Solid State Battery Material Offers 100x More Energy Density

TDK developed the new material for its rechargeable solid-state battery, supporting an energy density of 1,000 Wh/L—100 times more energy density than TDK’s current production variants.


News Jul 12, 2024 by Mike Falter
Siemens Debuts IC Test and Analysis Tool Aimed at Sub-5 nm Process Nodes

Siemens Debuts IC Test and Analysis Tool Aimed at Sub-5 nm Process Nodes

Siemens’ new software can provide more insights into chip failure modes.


News Jul 11, 2024 by Aaron Carman
Allegro’s New Current Sensors Offer Alternative to Traditional Shunts

Allegro’s New Current Sensors Offer Alternative to Traditional Shunts

The new current sensors integrate more features, reducing the need for external components.


News Jul 11, 2024 by Jake Hertz
Makers and Learners Rejoice! Arduino Debuts Plug and Make Kit

Makers and Learners Rejoice! Arduino Debuts Plug and Make Kit

In an effort to reduce the burden of wiring for learning and rapid prototyping, today Arduino has revealed a new system of plug-and-play components leveraging the new UNO R4 with Qwiic connectors and Wi-Fi.


Toshiba Demos New Switching Topology for Non-Isolated DC-DC Converters

Toshiba Demos New Switching Topology for Non-Isolated DC-DC Converters

The new topology eliminates the need for a transformer and significantly reduces the number of capacitors in DC-DC converter ICs.


News Jul 10, 2024 by Jake Hertz
InspireSemi Announces Tapeout of Thunderbird Accelerated Computing Chip

InspireSemi Announces Tapeout of Thunderbird Accelerated Computing Chip

InspireSemi’s new compute chip couples the parallel processing of GPUs with the versatility of CPUs.


News Jul 09, 2024 by Aaron Carman
Taoglas Reveals First GNSS Patch-in-a-Patch Antenna

Taoglas Reveals First GNSS Patch-in-a-Patch Antenna

The new product reduces antenna height by 50% compared to competitive offerings.


News Jul 09, 2024 by Jake Hertz
Microchip Now Offers Full Microprocessor Spectrum, From 8- to 64-bit MPUs

Microchip Now Offers Full Microprocessor Spectrum, From 8- to 64-bit MPUs

With the ability to shift computing resources as needed, Microchip’s new 64-bit, RISC-V processors bring needed flexibility to embedded edge devices.


News Jul 09, 2024 by Aaron Carman
MIT’s Implantable Microphone May Lead to Internal Cochlear Implants

MIT’s Implantable Microphone May Lead to Internal Cochlear Implants

The new tiny biocompatible sensor may overcome one of the last cochlear implant hurdles.


News Jul 08, 2024 by Duane Benson
ST Announces First Embedded SIM to Support New IoT Standard

ST Announces First Embedded SIM to Support New IoT Standard

STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.


News Jul 08, 2024 by Mike Falter
Op Amps From ST, TI, and Rohm Vault Analog Design Challenges

Op Amps From ST, TI, and Rohm Vault Analog Design Challenges

Analog designers rejoice! ST, TI, and Rohm have released new op amps to address unique analog pain points.


News Jul 05, 2024 by Aaron Carman
Seymour Cray and the Dawn of Supercomputing

Seymour Cray and the Dawn of Supercomputing

Seymour Cray once dreamed of building the fastest computer in the world. In a 30-year span, the "father of supercomputing" accomplished that goal several times over.


News Jul 04, 2024 by Biljana Ognenova
Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Speeding AI Compute, Intel Debuts First Integrated Optical I/O Chiplet

Intel claims the optical compute interconnect chiplet will "revolutionize high-speed data processing" of AI loads in data centers and HPC.


News Jul 03, 2024 by Jake Hertz
Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Semiconductor is bringing cryptographic agility and hardware root of trust to low-power FPGAs.


News Jul 02, 2024 by Duane Benson
Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

Targeting 4K Video Interfaces, Small FPGA Boasts Hard-Core MIPI C-PHYs

"Dynamite comes in small packages": Gowin Semiconductor adopts this mentality with its new FPGA targeting embedded high-speed interfaces.


News Jul 02, 2024 by Aaron Carman
Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

Axelera AI Raises $68M for ‘World’s Most Powerful AIPU’ for the Edge

The new funding will expand the company’s product offerings and align it with the generative AI movement.


News Jul 01, 2024 by Jake Hertz
Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

Infineon Launches Wireless MCU Supporting Wi-Fi 6/6E, BLE, and Matter

The new microcontroller adds robust wireless connectivity and offloading to bolster the host processor.


News Jul 01, 2024 by Jake Hertz