Following Arm's announcement of its new AI-defined automotive platform, several key EDA players have upgraded their toolsets with support.
Following Arm's announcement of its new AI-defined automotive platform, several key EDA players have upgraded their toolsets with support.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
Micron’s 1γ LPDDR5X memory delivers record-breaking speed and efficiency for AI at the edge.
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed…
The new updates leverage AI to develop reliable circuits without all the tedious work, while also keeping high-speed routing tight and efficient.
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome…
Unveiled today, the new timing chips from Mixed-Signal Devices offer 2 GHz performance and use scalable CMOS to overcome the limits of analog alternatives.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
Announced today, the high-performance switch IC enables scale-up and scale-out for AI networks and supports co-packaged optics.
New software editions bring enterprise-grade functionality to small- and medium-sized teams.
New software editions bring enterprise-grade functionality to small- and medium-sized teams.
With a 4x increase in CPU performance, the upgraded dev kit better facilitates secure automotive communication between…
With a 4x increase in CPU performance, the upgraded dev kit better facilitates secure automotive communication between the vehicle’s gateway and its wireless technologies.
The new processor reportedly offers 100x lower latency and 500x lower energy consumption than conventional AI processors.
The new processor reportedly offers 100x lower latency and 500x lower energy consumption than conventional AI processors.
Introductions include new envelope-pushing Threadripper CPU models and Radeon GPUs for edge AI, workstations, and graphics.
Introductions include new envelope-pushing Threadripper CPU models and Radeon GPUs for edge AI, workstations, and graphics.
At Computex 2025, Intel expanded its hardware lineup with GPUs for AI inference and creative workloads and an accelerator…
At Computex 2025, Intel expanded its hardware lineup with GPUs for AI inference and creative workloads and an accelerator for large-scale generative AI training.
Polyn's NASP chip is an analog neuromorphic processor that enables ultra-low-power, real-time signal processing directly…
Polyn's NASP chip is an analog neuromorphic processor that enables ultra-low-power, real-time signal processing directly at the sensor.
Intel and Shell have partnered to deliver the first Intel-certified immersion cooling solution for Xeon processors,…
Intel and Shell have partnered to deliver the first Intel-certified immersion cooling solution for Xeon processors, addressing rising AI data center demands.
The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
The compact AI-enabled sensor captures both routine movement and high-g impacts, enabling smarter wearables and IoT devices.
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and SemiQ offer enhanced radiation protection, increased operation range, lower conduction losses, and faster switching frequencies.
Announced today, the new integrated circuit verification software leverages AI to accelerate the verification of highly…
Announced today, the new integrated circuit verification software leverages AI to accelerate the verification of highly complex chips.
Three recent design wins exemplify how wireless and edge AI technologies are advancing real-world applications.
Three recent design wins exemplify how wireless and edge AI technologies are advancing real-world applications.
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard…
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and…
Structera CXL interoperability will drive memory performance increases for data centers operating both AMD EPYC CPUs and 5th Gen Intel Xeon CPUs.
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate…
TSMC’s new A14 process is already backed by certified EDA tools from Cadence, Synopsys, and Siemens to accelerate next-gen AI and chiplet-based designs.
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to…
Taking a holistic view of data centers, Microchip is upgrading its connectivity, storage, and computer portfolios to provide comprehensive support for the AI boom.
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