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TI’s PLDs Help Engineers Leap From Concept to Prototype in a Snap

TI’s PLDs Help Engineers Leap From Concept to Prototype in a Snap

The new family of programmable logic devices highly integrates features to reduce board space by up to 94%.


News Oct 10, 2024 by Jake Hertz
MediaTek Targets the ‘Agentic AI Era’ With Dimensity’s Next Evolution

MediaTek Targets the ‘Agentic AI Era’ With Dimensity’s Next Evolution

The company’s newest flagship SoC introduces architectural advances to bring performance and efficiency to the next wave of AI-capable smartphones.


News Oct 10, 2024 by Jake Hertz
Research Shorts: Advances in Night Vision, Liquid Batteries, and Beyond

Research Shorts: Advances in Night Vision, Liquid Batteries, and Beyond

In this edition of Research Shorts, we spotlight five news snippets exploring the feats of engineering students worldwide.


News Oct 08, 2024 by Kristijan Nelkovski
Remembering John B. Goodenough, Inventor of the Lithium-Ion Battery

Remembering John B. Goodenough, Inventor of the Lithium-Ion Battery

Dr. Goodenough received a Nobel Prize at the age of 97 for his contributions to making the Lithium-ion battery a reality.


News Sep 16, 2024 by Duane Benson
Qualcomm Raises the Bar on Thin, Light PC Performance With New CPU

Qualcomm Raises the Bar on Thin, Light PC Performance With New CPU

The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.


News Sep 12, 2024 by Jake Hertz
NXP Combines UWB Radar and Secure Ranging in a Single Chip

NXP Combines UWB Radar and Secure Ranging in a Single Chip

Announced today, NXP calls the Trimension SR250 the industry’s first single-chip solution that combines ultra-wideband radar sensing, secure UWB ranging, and on-chip processing.


News Sep 10, 2024 by Jake Hertz
Bluetooth Can Now Measure Distance, With Hardware Support En Route

Bluetooth Can Now Measure Distance, With Hardware Support En Route

Bluetooth SIG promises centimeter-level accuracy when measuring the distance between connected Bluetooth devices.


News Sep 09, 2024 by Duane Benson
Intel Ushers in the Age of AI PCs With New Core Ultra Processors

Intel Ushers in the Age of AI PCs With New Core Ultra Processors

Intel has revealed the details of the long-awaited Lunar Lake architecture, bringing advanced AI compute to personal computing.


News Sep 05, 2024 by Jake Hertz
RISC-V Builds the Backbone of Three New Consumer Devices

RISC-V Builds the Backbone of Three New Consumer Devices

RISC-V, the open-standard ISA, has inspired a host of innovative designs in tablets, cameras, and laptops.


News Sep 03, 2024 by Jake Hertz
OmniVision Delivers Compact, High-Performance 50 Megapixel Camera Chip

OmniVision Delivers Compact, High-Performance 50 Megapixel Camera Chip

The OV50M40 sensor incorporates advanced features, including a stacked architecture, to deliver higher performance out of a smaller footprint.


News Aug 30, 2024 by Duane Benson
Qualcomm Serves Up Snapdragon Mobile Platform to Enhance AI Tasks

Qualcomm Serves Up Snapdragon Mobile Platform to Enhance AI Tasks

Whether it’s on-phone generative AI or AI-enabled feature enhancements, Qualcomm’s new Snapdragon chip brings smart performance to mobile devices.


News Aug 26, 2024 by Aaron Carman
Go Big or Go Home: Efinix Targets Mass Market With New FPGA Family

Go Big or Go Home: Efinix Targets Mass Market With New FPGA Family

The Topaz FPGA line builds on the company’s Titanium FPGA portfolio with high-performance, cost-effective chips for mainstream applications.


News Aug 15, 2024 by Duane Benson
Infineon Adds 8 Bluetooth MCUs for Industrial, Consumer, and Automotive

Infineon Adds 8 Bluetooth MCUs for Industrial, Consumer, and Automotive

The new variants in Infineon's BLE 5.4 MCU family feature both SoC and module configurations.


News Aug 15, 2024 by Mike Falter
Rohm Announces the ‘Industry’s Smallest’ CMOS Op Amp

Rohm Announces the ‘Industry’s Smallest’ CMOS Op Amp

Rohm designed the new 0.88 mm x 0.58 mm rail-to-rail op amp for devices where space is at a premium, such as smartphones and IoT devices.


News Aug 08, 2024 by Duane Benson
New E-Fuses Bring Intelligence to the Fuse and Circuit Breaker Worlds

New E-Fuses Bring Intelligence to the Fuse and Circuit Breaker Worlds

These new e-fuse offerings from Toshiba, Nexperia, and STMicroelectronics serve manifold applications: laptops, vehicles, datacenters, and beyond.


News Aug 07, 2024 by Duane Benson
TI’s Smallest Display Controller Enables 4K UHD Projection Anywhere

TI’s Smallest Display Controller Enables 4K UHD Projection Anywhere

At the width of a pencil eraser, the new digital light processing chipset may enable the "smallest, fastest, and lowest-power 4K ultra-high-definition (UHD) projectors ever".


News Aug 06, 2024 by Jake Hertz
Qualcomm Brings 5G and Long Battery Life to Billions of Smartphone Users

Qualcomm Brings 5G and Long Battery Life to Billions of Smartphone Users

Qualcomm’s new Snapdragon 4s Gen 2 platform brings 5G data, fast charging, and improved memory performance to low-cost phones worldwide.


News Aug 01, 2024 by Duane Benson
SiTime Introduces ‘Smallest and Lowest Power’ 32 kHz Crystal Oscillator

SiTime Introduces ‘Smallest and Lowest Power’ 32 kHz Crystal Oscillator

The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package


News Jul 22, 2024 by Duane Benson
ST Announces First Embedded SIM to Support New IoT Standard

ST Announces First Embedded SIM to Support New IoT Standard

STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.


News Jul 08, 2024 by Mike Falter
Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Combines Security of Fixed Hardware With Flexibility of an FPGA

Lattice Semiconductor is bringing cryptographic agility and hardware root of trust to low-power FPGAs.


News Jul 02, 2024 by Duane Benson